Tech Center 2800 • Art Units: 2817
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18090325 | DISPLAY APPARATUS | Non-Final OA | LG DISPLAY CO., LTD. |
| 17798162 | QUAMTUM DOT LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY PANEL, AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18354402 | LIGHT EMITTING DEVICE | Non-Final OA | Seoul Semiconductor Co., Ltd. |
| 18022402 | DISPLAY DEVICE | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 17968657 | PIXEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18159173 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE | Final Rejection | TOHOKU UNIVERSITY |
| 17899890 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THEREOF | Non-Final OA | AUO Corporation |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17561720 | RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTURE WITH KNOWN GOOD DIES | Non-Final OA | Intel Corporation |
| 17899577 | SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME | Final Rejection | Micron Technology, Inc. |
| 17937326 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NICHIA CORPORATION |
| 18519786 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 17950041 | SEMICONDUCTOR PACKAGE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17972071 | MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD | Non-Final OA | Shanghai Tianma Micro-Electronics Co., Ltd. |
| 18310635 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18195504 | SEMICONDUCTOR INTERPOSER STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17857220 | SEMICONDUCTOR INTERPOSER STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18245414 | Optoelectronic Device | Non-Final OA | ams-OSRAM International GmbH |
| 18514461 | Method for Forming an Interconnection Structure | Non-Final OA | IMEC VZW |
| 18347670 | LED PACKAGING DEVICE AND PREPARATION METHOD THEREFOR | Non-Final OA | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD. |
| 18208791 | FAN-OUT TYPE PACKAGING STRUCTURE | Non-Final OA | WaferChem Technology Corporation |
| 18179886 | NATURAL SPHERICAL SURFACE LED MODULE | Final Rejection | DESIGNLED TECHNOLOGY CORP. |
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