Tech Center 2800 • Art Units: 2817
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17840019 | DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18485118 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18320668 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME | Final Rejection | NICHIA CORPORATION |
| 18532810 | SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER | Non-Final OA | Robert Bosch GmbH |
| 18022402 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18681046 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT | Non-Final OA | Sharp Display Technology Corporation |
| 17972071 | MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD | Non-Final OA | Shanghai Tianma Micro-Electronics Co., Ltd. |
| 18533756 | VAN DER WAALS STACKED JOSEPHSON JUNCTION STRUCTURE AND METHOD FOR FABRICATING SAME | Non-Final OA | POSTECH Research and Business Development Foundation |
| 17899577 | SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18411595 | Contact Structures in Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18519786 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18484982 | SEMICONDUCTOR DEVICE | Non-Final OA | RENESAS ELECTRONICS CORPORATION |
| 17857220 | SEMICONDUCTOR INTERPOSER STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
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