Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817
This examiner grants 58% of resolved cases
Nkechinyere Otuomasirich Esiaba examines cases in Tech Center 2800 and Art Unit 2817, with 19 resolved cases. The allowance rate is 57.9 percent. The median time to allowance is 1288 days. This 1288 days duration provides a benchmark for the expected length of prosecution for applications that reach a grant.
The interview lift is 47.1 percent. This high figure suggests that interviews are very effective at increasing the likelihood of an allowance. For the 19 cases resolved, the 47.1 percent lift indicates that direct discussion is a powerful strategy for overcoming rejections. Practitioners should consider the 57.9 percent allowance rate as a moderate baseline that is significantly improved by oral advocacy. The 47.1 percent lift is a key insight for those navigating the 1288 days median pendency. This profile shows that while prosecution can be lengthy, interviews offer a strong path toward a successful outcome.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18022402 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18532810 | SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER | Non-Final OA | Robert Bosch GmbH |
| 18703582 | SOLID-STATE IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18245414 | Optoelectronic Device | Non-Final OA | ams-OSRAM International GmbH |
| 18519786 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18432870 | 2-TRANSISTOR MEMORY CELL AND GATE STRUCTURE HAVING MULTIPLE PORTIONS | Non-Final OA | Micron Technology, Inc. |
| 18411595 | Contact Structures in Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18325006 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17899890 | LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THEREOF | Final Rejection | AUO Corporation |
| 18389669 | SEMICONDUCTOR WAFER DETECTION DEVICE AND DROPLET GUIDE MEMBER | Non-Final OA | EBARA CORPORATION |
| 18108872 | SEMICONDUCTOR ASSEMBLY | Non-Final OA | LITE-ON TECHNOLOGY CORPORATION |
| 18747608 | ETCHING METHOD FOR SEMICONDUCTOR STRUCTURE COMPRISING SUBSTRATE, FIRST STRUCTURE LOCATED ON PART OF TOP SURFACE OF THE SUBSTRATE, SIDEWALLS STRUCTURE AND FIELD EFFECT TRANSISTOR | Non-Final OA | Silergy Semiconductor Technology (Hangzhou) LTD |
| 18310635 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18403244 | DUAL GATE HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | Final Rejection | National Yang Ming Chiao Tung University |
| 18644131 | MICRO LIGHT EMITTING DIODE PANEL | Non-Final OA | PlayNitride Display Co., Ltd. |
| 17701678 | MICRO LIGHT EMITTING DIODE PANEL AND METHOD OF FABRICATING THE SAME | Final Rejection | PlayNitride Display Co., Ltd. |
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