Tech Center 2800 • Art Units: 2818 2897
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18735789 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18663416 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18815208 | DISPLAY SUBSTRATE, DISPLAY DEVICE AND HIGH-PRECISION METAL MASK | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18769428 | DISPLAY SUBSTRATE, METHOD OF FORMING DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18316043 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18313396 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18165349 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18740699 | METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM | Non-Final OA | ASM IP Holding B.V. |
| 18515964 | THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18805397 | ORGANIC EL DEVICE AND METHOD FOR MANUFACTURING ORGANIC EL DEVICES | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18510815 | SEMICONDUCTOR PACKAGE ASSEMBLY | Final Rejection | MEDIATEK INC. |
| 18650394 | LDMOS DEVICES WITH FLOATING FIELD PLATE | Non-Final OA | Texas Instruments Incorporated |
| 18495411 | Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The Same | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18511954 | SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18237420 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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