Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2897
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18735789 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18663416 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18653139 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18515000 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18313396 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18165349 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18316043 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18107099 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18089957 | DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS | Non-Final OA | Intel Corporation |
| 17723619 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Japan Display Inc. |
| 18510815 | SEMICONDUCTOR PACKAGE ASSEMBLY | Final Rejection | MEDIATEK INC. |
| 18650394 | LDMOS DEVICES WITH FLOATING FIELD PLATE | Non-Final OA | Texas Instruments Incorporated |
| 18591186 | MICROELECTRONIC DEVICE PACKAGE WITH MULTILAYER PACKAGE SUBSTRATE | Non-Final OA | Texas Instruments Incorporated |
| 18446549 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18505701 | PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE | Non-Final OA | Infineon Technologies AG |
| 18264423 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Final Rejection | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18207090 | PACKAGE STRUCTURE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18482201 | Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor Package | Final Rejection | NEXPERIA B.V. |
| 18237420 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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