Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18202126 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18322234 | INTEGRATED CIRCUIT DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18069224 | TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR | Non-Final OA | Texas Instruments Incorporated |
| 17873785 | STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER | Final Rejection | Texas Instruments Incorporated |
| 17870800 | CHIP APPARATUS AND WIRELESS COMMUNICATION APPARATUS | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 17931145 | A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18342709 | SEMICONDUCTOR STRUCTURES WITH COVER LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18340897 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18088609 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Non-Final OA | Intel Corporation |
| 17929471 | MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE | Final Rejection | Intel Corporation |
| 17346999 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR | Non-Final OA | Intel Corporation |
| 17819269 | BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS | Final Rejection | QUALCOMM Incorporated |
| 18343290 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17816826 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18064971 | INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS | Non-Final OA | Microchip Technology Incorporated |
| 18098395 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17755193 | ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY | Final Rejection | ALPHA ASSEMBLY SOLUTIONS INC. |
| 17941886 | SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18334527 | PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVEL FORMED CONNECTION TO AT LEAST ONE SEMICONDUCTOR DEVICE AND PROCESSES FOR IMPLEMENTING THE SAME | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
| 18227895 | CIRCUIT BOARD ARRANGEMENT | Non-Final OA | Rolls-Royce Deutschland Ltd & Co KG |
| 18201976 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17878924 | MICROELECTROMECHANICAL SYSTEM (MEMS) MICROPHONE AND FABRICATION METHOD THEREOF | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18209128 | GaN SEMICONDUCTOR POWER TRANSISTOR WITH SLANTED GATE FIELD PLATE AND METHOD OF FABRICATION | Non-Final OA | Infineon Technologies Canada Inc. |
| 18332023 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18202360 | BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SITRONIX TECHNOLOGY CORP. |
| 17868001 | X-Ray and Photodetection Using Photoinduced Magnetoelectric Effect | Non-Final OA | Lakehead University |
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