Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18202126 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18322234 | INTEGRATED CIRCUIT DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18295324 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18141456 | INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS | Final Rejection | Texas Instruments Incorporated |
| 17873785 | STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER | Final Rejection | Texas Instruments Incorporated |
| 17870800 | CHIP APPARATUS AND WIRELESS COMMUNICATION APPARATUS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 17932794 | LOW-CURRENT VOLTAGE SOURCE WATCHDOG | Non-Final OA | International Business Machines Corporation |
| 17931145 | A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18088609 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Non-Final OA | Intel Corporation |
| 17929471 | MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE | Final Rejection | Intel Corporation |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | Non-Final OA | Intel Corporation |
| 17874457 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18268591 | SILICON CARBIDE POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Hitachi Energy Ltd |
| 17819269 | BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS | Final Rejection | QUALCOMM Incorporated |
| 17816826 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18342709 | SEMICONDUCTOR STRUCTURES WITH COVER LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18340897 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18064971 | INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS | Non-Final OA | Microchip Technology Incorporated |
| 18202360 | BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SITRONIX TECHNOLOGY CORP. |
| 18166473 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18227895 | CIRCUIT BOARD ARRANGEMENT | Non-Final OA | Rolls-Royce Deutschland Ltd & Co KG |
| 17878924 | MICROELECTROMECHANICAL SYSTEM (MEMS) MICROPHONE AND FABRICATION METHOD THEREOF | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18332023 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18098395 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18266487 | INERT GAS CHAMBER | Final Rejection | MRSI Systems LLC |
| 18035758 | SHARED-DIELECTRIC MOSFET DEVICE WITH RESISTIVE-FIELD-PLATE AND PREPARATION METHOD THEREOF | Non-Final OA | NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION |
| 17755193 | ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY | Non-Final OA | ALPHA ASSEMBLY SOLUTIONS INC. |
| 17943135 | MANUFACTURE OF SEMICONDUCTOR DEVICE WITH OPTICAL TRANSMISSION CHANNEL BETWEEN OPTICAL COUPLER AND OUTSIDE OF THE SEMICONDUCTOR DEVICE | Non-Final OA | UNITED MICROELECTRONICS CENTER CO., LTD |
| 17868001 | X-Ray and Photodetection Using Photoinduced Magnetoelectric Effect | Non-Final OA | Lakehead University |
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