Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18091583 | TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING | Non-Final OA | Intel Corporation |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Final Rejection | Intel Corporation |
| 17357895 | NANORIBBON SUBFIN ISOLATION BY BACKSIDE SILICON SUBSTRATE REMOVAL WITH EPI PROTECTION | Non-Final OA | Intel Corporation |
| 17347015 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING BACKSIDE REMOVAL APPROACH | Non-Final OA | Intel Corporation |
| 17346999 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR | Non-Final OA | Intel Corporation |
| 17346990 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATES WITH REDUCED ASPECT RATIO CUTS | Non-Final OA | Intel Corporation |
| 18227895 | CIRCUIT BOARD ARRANGEMENT | Non-Final OA | Rolls-Royce Deutschland Ltd & Co KG |
| 18069224 | TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR | Final Rejection | Texas Instruments Incorporated |
| 18308891 | SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE | Final Rejection | SK hynix Inc. |
| 17896030 | EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18343290 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18379837 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18098395 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Advanced Semiconductor Engineering, Inc. |
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