Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18452616 | MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18231445 | SEMICONDUCTOR DEVICE, IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18228278 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18226065 | SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18694301 | DISPLAY APPARATUS, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Final Rejection | Intel Corporation |
| 17929471 | MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A BRIDGE DIE | Final Rejection | Intel Corporation |
| 17357895 | NANORIBBON SUBFIN ISOLATION BY BACKSIDE SILICON SUBSTRATE REMOVAL WITH EPI PROTECTION | Non-Final OA | Intel Corporation |
| 17346999 | INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE VIA BAR | Final Rejection | Intel Corporation |
| 18308891 | SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE | Final Rejection | SK hynix Inc. |
| 17873785 | STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER | Final Rejection | Texas Instruments Incorporated |
| 17896030 | EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18340897 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18303137 | SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18230793 | MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18064971 | INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS | Non-Final OA | Microchip Technology Incorporated |
| 18343290 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 17932794 | LOW-CURRENT VOLTAGE SOURCE WATCHDOG | Non-Final OA | International Business Machines Corporation |
| 18334527 | PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVEL FORMED CONNECTION TO AT LEAST ONE SEMICONDUCTOR DEVICE AND PROCESSES FOR IMPLEMENTING THE SAME | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
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