Tech Center 2800 • Art Units: 2800 2826 2829 2893 2897 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17836925 | Organic Light Emitting Display Device and Method of Fabricating the Same | Final Rejection | LG Display Co., Ltd. |
| 18426779 | DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18668954 | METHOD OF TRANSFERRING LIGHT EMITTING CHIP, LIGHT EMITTING STRUCTURE AND DISPLAY PANEL | Non-Final OA | HKC CORPORATION LIMITED |
| 18479780 | CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18660229 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18773506 | INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT | Non-Final OA | Texas Instruments Incorporated |
| 18610627 | WAFER CAP ATTACHMENT FOR SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18455558 | DUAL SWITCHING POWER DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 17537923 | NON-COPLANAR OR BUMPED LEAD FRAME FOR ELECTRONIC ISOLATION DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18650831 | METHOD AND MATERIAL SYSTEM FOR BACKSIDE POWER DELIVERY NETWORK IN STATIC RANDOM-ACCESS MEMORY DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18599819 | Doped Aluminum Oxide Bonding Layer for Hybrid Bonding | Non-Final OA | Applied Materials, Inc. |
| 18361502 | CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE | Final Rejection | NEXPERIA B.V. |
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