Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2826 2829 2893 2897 2898
This examiner grants 86% of resolved cases
Jordan M Klein is an examiner in Tech Center 2800 and Art Unit 2800. They have reached a final decision on 544 resolved cases, which provides the statistical basis for their current performance metrics. These 544 resolved cases reflect the examiner's experience within Art Unit 2800 and Tech Center 2800, offering a clear view of their historical decision-making patterns.
The data shows an allowance rate of 85.5 percent, which represents the frequency with which applications are granted. For those applications that reach a successful conclusion, the median days to allowance is 896. This duration of 896 days serves as a primary benchmark for the expected timeline of the prosecution process. The 85.5 percent allowance rate indicates a high probability of success for applicants.
The interview lift for this examiner is 8.0 percent. This 8.0 percent lift suggests that conducting an interview is associated with an increase in the probability of allowance relative to the baseline rate of 85.5 percent. Given the median days to allowance of 896, practitioners should consider that while the baseline rate is strong, an interview remains a productive tool for ensuring a favorable outcome.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18750219 | DISPLAY DEVICE INCLUDING THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 17836925 | Organic Light Emitting Display Device and Method of Fabricating the Same | Final Rejection | LG Display Co., Ltd. |
| 18708543 | METHOD FOR MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR CHIP | Non-Final OA | ams-OSRAM International GmbH |
| 18581566 | HEAT SPREADER WITH PINS FOR THE THERMAL MANAGEMENT IMPROVEMENT OF CHIPLETS | Final Rejection | International Business Machines Corporation |
| 18488236 | SEMICONDUCTOR STRUCTURES WITH MULTI-STAGE VIAS | Non-Final OA | International Business Machines Corporation |
| 18660229 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18773506 | INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT | Non-Final OA | Texas Instruments Incorporated |
| 18610627 | WAFER CAP ATTACHMENT FOR SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18676841 | PIXEL ISOLATION STRUCTURE FOR IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18496572 | FERROMAGNETIC CONTROL OF WAFER BONDING | Non-Final OA | Micron Technolgy, Inc. |
| 17936597 | SOLAR CELL WITH A TRANSPARENT CONDUCTOR COMPRISING AN EMBEDDED METAL GRID | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 18346561 | POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY | Non-Final OA | WOLFSPEED, INC. |
| 18731221 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18308467 | MOLDED POWER MODULES | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18507696 | BACKSIDE ILLUMINATION IMAGE SENSOR AND METHOD OF FORMING THE SAME | Final Rejection | Semiconductor Manufacturing International (Shanghai) Corporation |
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