Tech Center 2800 • Art Units: 2800 2826 2829 2893 2897
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17836925 | Organic Light Emitting Display Device and Method of Fabricating the Same | Non-Final OA | LG Display Co., Ltd. |
| 18576203 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17661885 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18324145 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18479780 | CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING | Non-Final OA | Meta Platforms Technologies, LLC |
| 17898536 | SEMICONDUCTOR DEVICE | Final Rejection | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18366771 | Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18308467 | MOLDED POWER MODULES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18145502 | POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATIONS FOR ONE OR MORE POWER DEVICES AND PROCESSES IMPLEMENTING THE SAME | Final Rejection | WOLFSPEED, INC. |
| 18507696 | BACKSIDE ILLUMINATION IMAGE SENSOR AND METHOD OF FORMING THE SAME | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 17995064 | POWER MODULE WITH OVERMOULDING, DEVICES COMPRISING SUCH A POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE WITH OVERMOULDING | Final Rejection | VALEO EQUIPEMENTS ELECTRIQUES MOTEUR |
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