Tech Center 2800 • Art Units: 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18318854 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18184901 | INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED INSULATOR AND METHODS OF FABRICATION THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17486674 | ELECTROLUMINESCENT ELEMENT, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17403723 | GALVANIC HIGH VOLTAGE ISOLATION CAPABILITY ENHANCEMENT ON REINFORCED ISOLATION TECHNOLOGIES | Non-Final OA | Texas Instruments Incorporated |
| 17819874 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18309205 | Method for Forming Sidewall in Forksheet Structure and Forksheet Semiconductor Device | Final Rejection | Huawei Technologies Co., Ltd. |
| 18140900 | DUMMY DIE MATERIAL SELECTION AND POSITIONING FOR BONDING PROCESSES | Non-Final OA | Applied Materials, Inc. |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17698322 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Non-Final OA | Intel Corporation |
| 18279809 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18172240 | DEVICE WITH THROUGH VIA AND RELATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17660485 | SEMICONDUCTOR PACKAGING | Final Rejection | CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION |
| 17880311 | TWO-DIMENSIONAL SEMICONDUCTOR-METAL OHMIC-CONTACT STRUCTURE, PREPARATION METHOD THEREFOR AND USE THEREOF | Final Rejection | NANJING UNIVERSITY |
| 17559493 | WRAP-AROUND LABEL FOR SSD | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 17378196 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING AIRGAP CONTAINING INSULATING LAYERS AND METHOD OF MAKING THE SAME | Final Rejection | SANDISK TECHNOLOGIES LLC |
| 18030048 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | ENKRIS SEMICONDUCTOR, INC. |
| 18232848 | THIN-FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAKAI DISPLAY PRODUCTS CORPORATION |
| 18349041 | ELECTRONIC ESD PROTECTION DEVICE | Final Rejection | STMicroelectronics (Tours) SAS |
| 18256727 | A NOVEL TRANSISTOR DEVICE | Non-Final OA | Search For The Next, LTD |
| 17788861 | TRENCH-TYPE MESFET | Final Rejection | Novel Crystal Technology, Inc. |
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