Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18769794 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18530763 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17486674 | ELECTROLUMINESCENT ELEMENT, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18537875 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Non-Final OA | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 17129854 | METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC | Non-Final OA | Intel Corporation |
| 18033847 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE AND LIGHT-EMITTING ELEMENT MANUFACTURING METHOD | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18279809 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 17559493 | WRAP-AROUND LABEL FOR SSD | Final Rejection | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 17590697 | TEMPERATURE-BASED SEMICONDUCTOR WAFER SINGULATION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17403723 | GALVANIC HIGH VOLTAGE ISOLATION CAPABILITY ENHANCEMENT ON REINFORCED ISOLATION TECHNOLOGIES | Final Rejection | Texas Instruments Incorporated |
| 18548704 | Semiconductor Device with Electric Field Management Structures | Final Rejection | Massachusetts Institute of Technology |
| 18770166 | SEMICONDUCTOR STRUCTURE WITH DIELECTRIC FEATURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18358255 | ENHANCED DESIGN FOR IMAGE SENSING TECHNOLOGY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18152157 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17663108 | PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18172240 | DEVICE WITH THROUGH VIA AND RELATED METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18192186 | DEPOSITION METHOD AND PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18163889 | SEMICONDUCTOR DEVICE AND THE MANUFACTURING METHOD THEREOF | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18740817 | SEMICONDUCTOR DEVICE | Non-Final OA | Winbond Electronics Corp. |
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