Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18184901 | INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED INSULATOR AND METHODS OF FABRICATION THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17403723 | GALVANIC HIGH VOLTAGE ISOLATION CAPABILITY ENHANCEMENT ON REINFORCED ISOLATION TECHNOLOGIES | Non-Final OA | Texas Instruments Incorporated |
| 17486674 | ELECTROLUMINESCENT ELEMENT, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18309205 | Method for Forming Sidewall in Forksheet Structure and Forksheet Semiconductor Device | Final Rejection | Huawei Technologies Co., Ltd. |
| 18548704 | Semiconductor Device with Electric Field Management Structures | Final Rejection | Massachusetts Institute of Technology |
| 17698322 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Non-Final OA | Intel Corporation |
| 17129854 | METAL INSULATOR METAL (MIM) CAPACITOR WITH PEROVSKITE DIELECTRIC | Non-Final OA | Intel Corporation |
| 18361226 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17835776 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17663108 | PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18192186 | DEPOSITION METHOD AND PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18279809 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18358341 | MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17849037 | METHODS OF FORMING UNIFORMLY DOPED DEEP IMPLANTED REGIONS IN SILICON CARBIDE AND SILICON CARBIDE LAYERS INCLUDING UNIFORMLY DOPED IMPLANTED REGIONS | Final Rejection | Wolfspeed, Inc. |
| 18232848 | THIN-FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAKAI DISPLAY PRODUCTS CORPORATION |
| 18349041 | ELECTRONIC ESD PROTECTION DEVICE | Final Rejection | STMicroelectronics (Tours) SAS |
| 18256727 | A NOVEL TRANSISTOR DEVICE | Non-Final OA | Search For The Next, LTD |
| 17711660 | PROCESS FOR PRODUCING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC COMPONENT AND PROTECTIVE LAYER | Non-Final OA | Pictiva Displays International Limited |
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