Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2847
This examiner grants 76% of resolved cases
Stanley Tso has overseen 511 resolved cases in Art Unit 2847. The examiner's allowance rate is 75.5 percent. A key takeaway from the data is the interview lift of 34.3 percent, which represents a high increase in the probability of allowance following an interview. This 34.3 percent lift is a significant metric in the examiner's profile, suggesting that direct engagement is highly effective. Practitioners should use the 75.5 percent allowance rate as a baseline for their expectations in Tech Center 2800.
The median days to allowance is 834. Practitioners should strongly consider interviewing with this examiner, as the 34.3 percent lift can improve the chances of a positive outcome. The 834-day median provides a realistic timeline for reaching an allowance. With 511 resolved cases, the examiner's trends are well-established and favor those who engage in verbal dialogue. The 75.5 percent allowance rate indicates a generally successful path for most applicants. Strategy should prioritize interviews to capitalize on the observed lift.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18889289 | BUS BAR | Final Rejection | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18420769 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | FUJIFILM Corporation |
| 18767871 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18494849 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18963896 | Mixtures of supercritical fluids as a dielectric material | Non-Final OA | Georgia Tech Research Corporation |
| 18892171 | ADHERED SAP SUBSTRATE FOR CuBOL ASSEMBLY PACKAGE | Non-Final OA | QUALCOMM Incorporated |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | Non-Final OA | Intel Corporation |
| 17842215 | PCB MLCC-INDUCED ACOUSTIC NOISE REDUCTION | Non-Final OA | Intel Corporation |
| 18849285 | GLASS CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18726640 | COOLING STRUCTURE OF A POWER SUPPLY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 16926954 | BOARD JOINT STRUCTURE AND BOARD JOINT METHOD | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18847782 | WIRE MOVABLE PATH REGULATING COMPONENT AND PATH REGULATING WIRE HARNESS | Final Rejection | SUMITOMO WIRING SYSTEMS, LTD. |
| 18479590 | BUS BAR WITH TAB AND CIRCUIT ASSEMBLY | Final Rejection | Sumitomo Wiring Systems, Ltd. |
| 18895148 | WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME | Non-Final OA | KYOCERA Corporation |
| 18560741 | PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE | Final Rejection | LG INNOTEK CO., LTD. |
| 18739086 | CABLING HAVING FARADAY CAGES IMPLEMENTED THEREWITH | Non-Final OA | International Business Machines Corporation |
| 18335172 | POWER DISTRIBUTION WITH BACKSIDE POWER PLANES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18851690 | INSULATING RESIN COMPOSITION FOR ELECTRIC POWER CABLE AND ELECTRIC POWER CABLE | Final Rejection | FURUKAWA ELECTRIC CO., LTD. |
| 18475716 | CONDITION MONITORING DEVICE FOR A ROTATING MACHINE LINKED TO AN EXTERNAL POWER SUPPLY | Final Rejection | Aktiebolaget SKF |
| 18771507 | FLEXIBLE AUTOMOTIVE GRADE LIGHT SOURCE | Non-Final OA | LUMILEDS LLC |
| 18690062 | SPARK PLUG | Final Rejection | NITERRA CO., LTD. |
| 18540569 | POWER HARNESS | Final Rejection | TE Connectivity Solutions GmbH |
| 18615432 | Electrically Functional Circuit Board Core Material | Final Rejection | KEMET Electronics Corporation |
| 18135551 | Electrically Functional Circuit Board Core Material | Final Rejection | KEMET Electronics Corporation |
| 18822905 | WIRING BOARD | Final Rejection | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18845879 | WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD | Non-Final OA | AOI ELECTRONICS CO., LTD. |
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