Tech Center 2800 • Art Units: 2847
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18191627 | PROTECTING ESP CABLES FROM H2S WITH LIQUID CONDUCTOR | Final Rejection | Halliburton Energy Services, Inc. |
| 18475716 | CONDITION MONITORING DEVICE FOR A ROTATING MACHINE LINKED TO AN EXTERNAL POWER SUPPLY | Non-Final OA | Aktiebolaget SKF |
| 18497373 | METHOD FOR FORMING FUNCTIONAL LAYER, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT INCLUDING FUNCTIONAL LAYER | Final Rejection | RICOH COMPANY, LTD. |
| 18188297 | ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT | Non-Final OA | Intel Corporation |
| 17750016 | COMPRESSED PINOUTS FOR HIGH-SPEED DIFFERENTIAL PAIRS | Final Rejection | Intel Corporation |
| 17912018 | HIGH POWER SHIELDED BUSBAR FOR ELECTRIC VEHICLE CHARGING AND POWER DISTRIBUTION | Final Rejection | Tesla, Inc. |
| 18691436 | ELECTRONIC CONTROL DEVICE | Non-Final OA | HITACHI ASTEMO, LTD. |
| 16926954 | BOARD JOINT STRUCTURE AND BOARD JOINT METHOD | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18281079 | COATING AGENT MANUFACTURING KIT, COATING AGENT, AND METHOD FOR PRODUCING ELECTRONIC SUBSTRATE AND ELECTRONIC COMPONENT MODULE | Final Rejection | SEKISUI CHEMICAL CO., LTD. |
| 18680375 | CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18697470 | PRINTED CIRCUIT BOARD | Final Rejection | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
| 18479590 | BUS BAR WITH TAB AND CIRCUIT ASSEMBLY | Non-Final OA | Sumitomo Wiring Systems, Ltd. |
| 18683738 | STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES | Final Rejection | Liquid Wire Inc. |
| 18724645 | MULTILAYER SUBSTRATE AND JIG | Non-Final OA | NIDEC ADVANCE TECHNOLOGY CORPORATION |
| 18172324 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Unimicron Technology Corp. |
| 18647609 | ADJUSTABLE DEPTH ELECTRICAL BOX | Non-Final OA | GENESEE A&B, LLC |
| 18559152 | Component Carrier With Photosensitive Adhesion Promoter and Method of Manufacturing the Same | Non-Final OA | AT&S Austria Technologie & Systemtechnik AG |
| 18135551 | Electrically Functional Circuit Board Core Material | Final Rejection | KEMET Electronics Corporation |
| 18435062 | LIGHT-EMITTING DEVICE AND ELECTRICAL MODULE THEREOF | Final Rejection | Lextar Electronics(Chuzhou) Corporation |
| 18418026 | ELECTRIC ELEMENT ASSEMBLY | Final Rejection | JOINSET CO., LTD. |
| 18578017 | CONNECTING ARRANGEMENT WITH A CRIMP CONNECTION AND METHOD FOR PRODUCING A CONNECTING ARRANGEMENT WITH A CRIMP CONNECTION | Non-Final OA | PHOENIX CONTACT E-Mobility GmbH |
| 18162668 | Component Carrier | Final Rejection | AT&S (China) Co. Ltd. |
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