Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
11 pending office actions • 7 art units • 11 examiners • 0 of 11 (0%) have an AI response strategy ready • 8 patents granted in the last 365 days
At&S Austria Technologie & Systemtechnik AG currently manages 9 pending office actions in the Semiconductors, Circuits & Optics technology area. These matters are distributed among 9 distinct examiners, meaning each active application is being reviewed by a different individual. These examiners are spread across 5 distinct art units, indicating a diverse technical footprint within the semiconductors sector.
The busiest examiner for the company is ANDERSON, WILLIAM H, who is handling 1 pending office action. Since there are 9 pending office actions and 9 distinct examiners, the workload is perfectly distributed, with no single examiner managing more than one case. This distribution across 5 distinct art units requires the company to manage multiple examiner relationships and navigate the specific requirements of different technical divisions simultaneously.
For practitioners, the presence of 9 distinct examiners for 9 pending office actions highlights a lack of examiner concentration. Each case likely requires a unique approach tailored to the individual examiner's style, even though they are grouped within 5 distinct art units. This balance between examiner variety and art unit focus is a key feature of the company's current prosecution landscape in the Semiconductors, Circuits & Optics field.
Based on the USPTO statutory response window for each pending office action. 7 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 7 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 7 (64%) |
| Multi-statute (no §101) | 4 (36%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SHARMA, ADITYA | 1 | 79.5% | +28.1% |
| ANDERSON, WILLIAM H | 1 | 85.1% | +17.9% |
| RAHMAN, MOHAMMAD A | 1 | 87.1% | +10.8% |
| SAWYER, STEVEN T | 1 | 72.5% | +30.5% |
| VARGHESE, ROSHN K | 1 | 67.5% | +20.6% |
| AYCHILLHUM, ANDARGIE M | 1 | 84.3% | +14.7% |
| HARRISON, MONICA D | 1 | 91.8% | +2.7% |
| CRITE, ANTONIO B | 1 | 81.6% | -13.4% |
| ALONZO MILLER, RHADAMES J | 1 | 67.1% | +4.7% |
| CHAN, TSZFUNG JACKIE | 1 | 75.6% | +18.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 72d |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | — |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | — |
| 18585434 | Component Carrier with Ultra-thin Insulation Film and Manufacturing Method | HARRISON, MONICA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18301244 | Metal Body Formed on a Component Carrier by Additive Manufacturing | ALONZO MILLER, RHADAMES J | 141d overdue |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | CRITE, ANTONIO B | 1d overdue |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 15d |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 43d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18692032 | Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure | SAWYER, STEVEN T | 4d overdue |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 15d |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 43d |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 72d |
| 18693630 | Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method | SHARMA, ADITYA | — |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | — |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | — |
| Art Unit | Apps |
|---|---|
| 2847 | 3 |
| 2896 | 1 |
| 2848 | 1 |
| 2815 | 1 |
| 2817 | 1 |
| 2837 | 1 |
| 2899 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18693630 | Component Carrier with Rough Surface and Smooth Surface Metal Traces and Manufacturing Method | SHARMA, ADITYA | 2847 | §103 | Final Rejection | — | Pending | Mar 20, 2024 |
| 18693683 | Package with Organic Integrated Circuit Substrate Embedded in Inorganic Carrier Body and Redistribution Structure Extending Along Both | ANDERSON, WILLIAM H | — | §103 | Final Rejection | — | Pending | Mar 20, 2024 |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | RAHMAN, MOHAMMAD A | — | §103 | Final Rejection | — | Pending | Mar 19, 2024 |
| 18692032 | Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure | SAWYER, STEVEN T | 2847 | §103 | Final Rejection | 4d overdue | Pending | Mar 14, 2024 |
| 18605509 | Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method | VARGHESE, ROSHN K | 2896 | §102§103 | Final Rejection | 43d | Pending | Mar 14, 2024 |
| 18692075 | Manufacturing a Component Carrier by a Nano Imprint Lithography Process | AYCHILLHUM, ANDARGIE M | 2848 | §103 | Final Rejection | 72d | Pending | Mar 14, 2024 |
| 18585434 | Component Carrier with Ultra-thin Insulation Film and Manufacturing Method | HARRISON, MONICA D | 2815 | §103 | Final Rejection | — | Pending | Feb 23, 2024 |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | CRITE, ANTONIO B | 2817 | §102§103§112 | Non-Final OA | 1d overdue | Pending | Oct 03, 2023 |
| 18301244 | Metal Body Formed on a Component Carrier by Additive Manufacturing | ALONZO MILLER, RHADAMES J | 2847 | §102§103 | Final Rejection | 141d overdue | Pending | Apr 16, 2023 |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 2837 | §103§112Other | Final Rejection | 15d | Pending | Mar 10, 2023 |
| 18160406 | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | TYNES JR., LAWRENCE C | 2899 | §103 | Final Rejection | 75d | Pending | Jan 27, 2023 |
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