10 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18693665 | Component Carrier with Protruding Dielectric Signal Element and Manufacture Method | KIM, SEOKJIN | 2844 | Final Rejection | Mar 20, 2024 |
| 18692032 | Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure | SAWYER, STEVEN T | 2847 | Non-Final OA | Mar 14, 2024 |
| 18559152 | Component Carrier With Photosensitive Adhesion Promoter and Method of Manufacturing the Same | TSO, STANLEY | 2847 | Non-Final OA | Nov 06, 2023 |
| 18479944 | Package having component carrier with cavity and electronic component as well as functional filling medium therein | CRITE, ANTONIO B | 2817 | Non-Final OA | Oct 03, 2023 |
| 18253341 | Component Carrier For Waveguide Applications | SHARMA, ADITYA | 2847 | Final Rejection | May 17, 2023 |
| 18301938 | Component Carrier and Method of Manufacturing the Same | WILLIS, TREMESHA S | 2847 | Non-Final OA | Apr 17, 2023 |
| 18301244 | Metal Body Formed on a Component Carrier by Additive Manufacturing | ALONZO MILLER, RHADAMES J | 2847 | Final Rejection | Apr 16, 2023 |
| 18193461 | Component Carrier With Solder Mask Having Curved Sidewalls Interacting With Legend Marking | BARZYKIN, VICTOR V | 2893 | Final Rejection | Mar 30, 2023 |
| 18182272 | Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same | CHAN, TSZFUNG JACKIE | 2837 | Non-Final OA | Mar 10, 2023 |
| 18160406 | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | TYNES JR., LAWRENCE C | 2899 | Final Rejection | Jan 27, 2023 |
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