Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18815171 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18405141 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18693148 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18533518 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18493707 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 17992234 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18533912 | ORGANIC LIGHT EMITTING DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18402766 | ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 17556602 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Non-Final OA | Intel Corporation |
| 18497585 | METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18002077 | IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18560422 | IN SITU DAMAGE FREE ETCHING OF Ga2O3 USING Ga FLUX FOR FABRICATING HIGH ASPECT RATIO 3D STRUCTURES | Non-Final OA | OHIO STATE INNOVATION FOUNDATION |
| 18205583 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18090841 | SOLID-STATE IMAGE SENSOR | Non-Final OA | TOPPAN Inc. |
| 18263603 | CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME | Final Rejection | LG INNOTEK CO., LTD. |
| 18593038 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 17845232 | PIXEL AND DISPLAY DEVICE | Final Rejection | STMicroelectronics (Grenoble 2) SAS |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18526473 | CONTACT GATE ISOLATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17817025 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18326266 | HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND RECORDING MEDIUM | Final Rejection | Tokyo Electron Limited |
| 18047482 | BACKSIDE POWER WITH ON-DIE POWER SWITCHES | Final Rejection | Advanced Micro Devices, Inc. |
| 17965888 | TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CONDUCTIVE PADS OF THE SEMICONDUCTOR DIE | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 18395787 | DISPLAY MODULE AND METHOD FOR FORMING THE SAME | Non-Final OA | AUO Corporation |
| 18561449 | SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREFOR | Final Rejection | TDK CORPORATION |
| 17809701 | METHOD OF PROCESSING WAFER | Non-Final OA | DISCO CORPORATION |
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