Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18405141 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18164748 | MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18534832 | DISPLAY APPARATUS HAVING PIXEL AREAS DISPLAYING DIFFERENT COLORS | Non-Final OA | LG Display Co., Ltd. |
| 18533912 | ORGANIC LIGHT EMITTING DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18110452 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18002077 | IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | Final Rejection | Intel Corporation |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Non-Final OA | Intel Corporation |
| 18263603 | CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME | Non-Final OA | LG INNOTEK CO., LTD. |
| 18218756 | POWER MODULE | Final Rejection | Kia Corporation |
| 18561449 | SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREFOR | Non-Final OA | TDK CORPORATION |
| 18461232 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kioxia Corporation |
| 18472320 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18526473 | CONTACT GATE ISOLATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18447482 | INDUCTIVE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18326266 | HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND RECORDING MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 18076196 | VIA FORMED USING A PARTIAL PLUG THAT EXTENDS INTO A SUBSTRATE | Final Rejection | Celestial AI Inc. |
| 18047482 | BACKSIDE POWER WITH ON-DIE POWER SWITCHES | Final Rejection | Advanced Micro Devices, Inc. |
| 17965888 | TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CONDUCTIVE PADS OF THE SEMICONDUCTOR DIE | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 17812385 | SYSTEM AND METHODS FOR SINGULATION OF GAN-ON-SILICON WAFERS | Final Rejection | Navitas Semiconductor Limited |
| 17845232 | PIXEL AND DISPLAY DEVICE | Non-Final OA | STMicroelectronics (Grenoble 2) SAS |
| 18090841 | SOLID-STATE IMAGE SENSOR | Final Rejection | TOPPAN Inc. |
| 18483915 | TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDUCTOR SUBSTRATE | Non-Final OA | Infineon Technologies Austria AG |
| 18385268 | DEVICE WITH ISOLATION STRUCTURES | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18231811 | SOLID-STATE IMAGING DEVICE | Final Rejection | Sharp Semiconductor Innovation Corporation |
| 18013754 | THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDUCTIVE SHEET | Final Rejection | SHOWA DENKO MATERIALS CO., LTD. |
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