Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18002077 | IMAGING ELEMENT, IMAGING DEVICE, ELECTRONIC EQUIPMENT | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18693148 | DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18533912 | ORGANIC LIGHT EMITTING DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18438024 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18438027 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18421690 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18533518 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18527546 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18493707 | DISPLAY PANEL | Final Rejection | Samsung Display Co., Ltd. |
| 17560915 | INTEGRATED CIRCUIT DIE FOR EFFICIENT INCORPORATION IN A DIE STACK | Final Rejection | Intel Corporation |
| 17554442 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING RAISED WALL STRUCTURES FOR EPITAXIAL SOURCE OR DRAIN REGION CONFINEMENT | Non-Final OA | Intel Corporation |
| 18497585 | METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18559693 | LED Light Source Device | Final Rejection | Hitachi High-Tech Corporation |
| 18560422 | IN SITU DAMAGE FREE ETCHING OF Ga2O3 USING Ga FLUX FOR FABRICATING HIGH ASPECT RATIO 3D STRUCTURES | Final Rejection | OHIO STATE INNOVATION FOUNDATION |
| 18403757 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18526473 | CONTACT GATE ISOLATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18395787 | DISPLAY MODULE AND METHOD FOR FORMING THE SAME | Non-Final OA | AUO Corporation |
| 18326266 | HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND RECORDING MEDIUM | Final Rejection | Tokyo Electron Limited |
| 18483915 | TRANSISTOR DEVICE AND METHOD OF FABRICATING CONTACTS TO A SEMICONDUCTOR SUBSTRATE | Final Rejection | Infineon Technologies Austria AG |
| 18047482 | BACKSIDE POWER WITH ON-DIE POWER SWITCHES | Final Rejection | Advanced Micro Devices, Inc. |
| 17845232 | PIXEL AND DISPLAY DEVICE | Final Rejection | STMicroelectronics (Grenoble 2) SAS |
| 18461980 | TRANSISTOR WITH GATE LAYOUT, DEVICE IMPLEMENTING THE TRANSISTOR WITH OUTPUT PRE-MATCHING, AND PROCESS OF IMPLEMENTING THE SAME | Non-Final OA | Macom Technology Solutions Holdings, Inc. |
| 18403206 | TRANSISTOR TRIGGERED SILICON CONTROL RECTIFIER | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18385268 | DEVICE WITH ISOLATION STRUCTURES | Final Rejection | GlobalFoundries U.S. Inc. |
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