Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2642 2800 2812 2818 2826 4100
This examiner grants 91% of resolved cases
Herve-Louis Y. Assouman examines cases in Art Unit 2642 of Tech Center 4100, where he has a high volume of 682 resolved cases. His allowance rate of 91.3% is remarkably high, suggesting a very favorable environment for patent applicants. Furthermore, the median days to allowance is 775, indicating a relatively swift path to grant compared to many other units at the USPTO.
The interview lift for this examiner is 4.1%. While this is a positive figure, its impact is limited by the fact that the 91.3% allowance rate is already near the ceiling. For the 682 resolved cases, an interview provides a small additional benefit, but the baseline probability of success is already very high. Practitioners can expect an efficient prosecution experience in Tech Center 4100, with the 775-day median timeline and the 91.3% allowance rate reflecting a streamlined path to securing patent rights.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739950 | SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18707256 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18672685 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18805392 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18774317 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18557210 | METHOD FOR PRODUCING A VERTICAL POWER SEMICONDUCTOR COMPONENT, AND VERTICAL POWER SEMICONDUCTOR COMPONENT | Final Rejection | Robert Bosch GmbH |
| 18345607 | DIRECT BONDING ON BURIED POWER RAILS | Final Rejection | Adeia Semiconductor Bonding Technologies, Inc. |
| 18695467 | SEMICONDUCTOR DEVICE | Non-Final OA | Sumitomo Electric Device Innovations, Inc. |
| 18421837 | MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18408633 | BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18345065 | BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING | Final Rejection | Texas Instruments Incorporated |
| 18788172 | MULTIPLEXER CELL AND SEMICONDUCTOR DEVICE HAVING CAMOUFLAGE DESIGN, AND METHOD FOR FORMING MULTIPLEXER CELL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18772634 | STRUCTURE FORMATION IN A SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783157 | Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18771181 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18521701 | SEMICONDUCTOR DEVICE HAVING CONTACT FEATURE AND METHOD OF FABRICATING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18408820 | Die Stacking with Integrated Thermal Treatment | Non-Final OA | Applied Materials, Inc. |
| 17671235 | LED TRANSFER MATERIALS AND PROCESSES | Non-Final OA | Applied Materials, Inc. |
| 18537324 | INSULATION MODULE | Non-Final OA | ROHM CO., LTD. |
| 18696151 | HIGH MOBILITY TFT DRIVING DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION |
| 18327848 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NATIONAL TAIWAN UNIVERSITY |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18414743 | LED STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Enkris Semiconductor, Inc. |
| 18575114 | FAN-OUT PACKAGING METHOD, FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD HEREOF | Final Rejection | HYGON INFORMATION TECHNOLOGY CO., LTD. |
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