Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2818 2826
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18507224 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18225447 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18345065 | BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING | Final Rejection | Texas Instruments Incorporated |
| 18509035 | BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18408633 | BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18381331 | LOW TEMPERATURE CO-FLOW EPITAXIAL DEPOSITION PROCESS | Non-Final OA | Applied Materials, Inc. |
| 18537324 | INSULATION MODULE | Non-Final OA | ROHM CO., LTD. |
| 18507817 | POST PASSIVATION INTERCONNECT | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18155912 | SEMICONDUCTOR DEVICE INCLUDING INSULATING STRUCTURE SURROUNDING THROUGH VIA AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18398028 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18506163 | HETEROSTRUCTURE HAVING NON-VOLATILE ACTUATABLE POLARIZATION | Non-Final OA | Technion Research & Development Foundation Limited |
| 17563921 | MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18172904 | PROTECTION DAM FOR A POWER MODULE WITH SPACERS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18761587 | ELECTRONIC IMAGING DETECTOR WITH THERMAL CONDUCTION LAYER | Non-Final OA | Gatan, Inc. |
| 17736567 | SUPERCONDUCTING THROUGH SUBSTRATE VIAS | Final Rejection | IQM Finland Oy |
| 18575114 | FAN-OUT PACKAGING METHOD, FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD HEREOF | Non-Final OA | HYGON INFORMATION TECHNOLOGY CO., LTD. |
| 18345607 | DIRECT BONDING ON BURIED POWER RAILS | Final Rejection | Adeia Semiconductor Bonding Technologies, Inc. |
| 18572868 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY CO., LTD. |
| 18104856 | THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUGH-SILICON-VIA INTERCONNECTION STRUCTURE AND METHOD FOR PREPARING SAME, AND ELECTRONIC DEVICE | Non-Final OA | GUSU LABORATORY OF MATERIALS |
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