Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
Younes Boulghassoul examines in Tech Center 2800 and Art Unit 2814. He has 529 resolved cases and an allowance rate of 88.3 percent. This 88.3 percent rate is exceptionally high and suggests a very favorable environment for applicants. The 529 resolved cases provide a strong statistical foundation for these positive insights and help practitioners evaluate the likelihood of success.
The interview lift is 7.0 percent, a modest figure that reflects the high baseline probability of success. The median days to allowance is 806, which is an efficient timeline for the prosecution process. Practitioners should find the 88.3 percent allowance rate and the 806 days to allowance to be highly encouraging for their strategy. The 7.0 percent interview lift suggests that while interviews are beneficial, they may not be as critical as in units with lower grant rates. These metrics, based on 529 resolved cases, highlight the favorable grant frequency and the 806 days typically required to reach an allowance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18441071 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18380848 | SEMICONDUCTOR DEVICES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18506402 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18500345 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18624012 | LIGHT EMITTING DISPLAY DEVICE INCLUDING SHAPED LIGHT EMITTING AREAS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18531428 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18612487 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18469465 | SELF-ALIGNED BACKSIDE INTERCONNECT | Non-Final OA | QUALCOMM Incorporated |
| 18763777 | SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES ABOVE INSULATOR SUBSTRATES | Non-Final OA | Intel Corporation |
| 17958302 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Non-Final OA | Intel Corporation |
| 16940117 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Final Rejection | Intel Corporation |
| 18596803 | DEEP VIA STRUCTURES FOR STACKED TRANSISTOR DEVICES | Non-Final OA | International Business Machines Corporation |
| 18393449 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18411331 | SEMICONDUCTOR PROCESSING INTEGRATION FOR BIPOLAR JUNCTION TRANSISTOR (BJT) | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18648510 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17890571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18643212 | Depositing and Oxidizing Silicon Liner for Forming Isolation Regions | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18149265 | Via Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Co. Ltd. |
| 18391776 | DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS | Non-Final OA | Applied Materials, Inc. |
| 18464287 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18396224 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18408602 | SEMICONDUCTOR STRUCTURE WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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