Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18380854 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18380848 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18462851 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18231284 | VERTICAL MEMORY DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18120845 | SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18117891 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18274392 | METHOD FOR MANUFACTURING NANOWIRE, METHOD FOR MANUFACTURING THIN FILM TRANSISTOR, THIN FILM TRANSISTOR AND SEMICONDUCTOR DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18272129 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18505562 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18343127 | STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE INTERCONNECT THROUGH VIA LANDING MODIFICATION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18350933 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SPACERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18327628 | OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323323 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18149265 | Via Structures | Final Rejection | Taiwan Semiconductor Manufacturing Co. Ltd. |
| 17818230 | EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18513969 | WAFER PROCESSING APPARATUS | Non-Final OA | DISCO CORPORATION |
| 18355029 | SELF-ALIGNED LINE-AND-VIA STRUCTURE AND METHOD OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18451043 | SHIELDED THROUGH SUBSTRATE VIA STRUCTURES FOR A SILICON INTERCONNECT DIE AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18357797 | FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18520979 | IN-SITU DEPOSITION OF OXIDE PASSIVATION LAYER ON III-NITRIDE BASED HEMT | Non-Final OA | University of South Carolina |
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