Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2817 2824 4100
This examiner grants 0% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18779786 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18643311 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18511597 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18578301 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18737762 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 18590063 | DISPLAY DEVICE | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18625761 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18435865 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18510231 | SEMICONDUCTOR DEVICE | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18588312 | RADIATION DETECTOR, RADIATION IMAGING SYSTEM, AND METHOD FOR MANUFACTURING RADIATION DETECTOR | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18609610 | 3D STACKING WITH THROUGH-MOLD CAVITY FOR THERMAL MANAGEMENT | Non-Final OA | QUALCOMM Incorporated |
| 18590688 | PACKAGE COMPRISING A BASE SUBSTRATE AND INTEGRATED DEVICES | Final Rejection | QUALCOMM Incorporated |
| 18589192 | EMBEDDED SCAFFOLD STIFFENER IN SUBSTRATE | Final Rejection | QUALCOMM Incorporated |
| 18400458 | COAXIAL THROUGH INSULATOR VIA BETWEEN CHIPLETS | Non-Final OA | International Business Machines Corporation |
| 18428240 | EXTERNAL CONNECTION PAD APPARATUS AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME | Final Rejection | SK hynix Inc. |
| 18407428 | STACKED SEMICONDUCTOR DEVICE | Non-Final OA | Micron Technology, Inc. |
| 18769334 | MEMORY DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18646444 | Epitaxial Structures in Image Sensors | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18590911 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18415192 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18590271 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18654238 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18787367 | MEMORY DEVICE INCLUDING A CORE-SIDE CHARGE TRAPPING MATERIAL LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18615516 | MEMORY DEVICE INCLUDING A CORE-SIDE CHARGE TRAPPING MATERIAL LAYER AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18510633 | SEMICONDUCTOR DEVICE | Final Rejection | Renesas Electronics Corporation |
| 18742173 | WAFER PROCESSING METHOD | Non-Final OA | DISCO CORPORATION |
| 18679362 | INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | United Microelectronics Corp. |
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