Tech Center 2800 • Art Units: 2874
This examiner grants 53% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17396114 | WAVEGUIDE FOR HEAD-UP DISPLAY, INCLUDING REFLECTIVE OUTPUT COUPLING STRUCTURE | Non-Final OA | Snap Inc. |
| 18089934 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Intel Corporation |
| 18188499 | WAVEGUIDE WITH ORGANIC SOLID CRYSTAL SUBSTRATE | Non-Final OA | Meta Platforms Technologies, LLC |
| 17895680 | ELECTRICAL AND OPTICAL CONNECTOR | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 16714100 | OPTICAL GLASS, AND OPTICAL ELEMENT, OPTICAL SYSTEM, CEMENTED LENS, INTERCHANGEABLE CAMERA LENS, AND OPTICAL DEVICE USING SAME | Final Rejection | NIKON CORPORATION |
| 18786922 | MODE CONVERSION WAVEGUIDE SYSTEM | Non-Final OA | The Boeing Company |
| 18452613 | SINGLE-MODE OPTICAL FIBER WITH THIN COATING FOR HIGH DENSITY CABLES AND INTERCONNECTS | Non-Final OA | CORNING INCORPORATED |
| 18211696 | CO-ALKALI DOPED OPTICAL FIBERS | Final Rejection | CORNING INCORPORATED |
| 18229936 | ANNEALED SUBUNITS IN BUNDLED DROP ASSEMBLY AND PROCESS OF ANNEALING SUBUNITS IN BUNDLED DROP ASSEMBLY | Final Rejection | CORNING RESEARCH & DEVELOPMENT CORPORATION |
| 18206268 | MULTICORE OPTICAL FIBER SYSTEM CONNECTIVITY IN DATA CENTERS | Non-Final OA | CORNING RESEARCH & DEVELOPMENT CORPORATION |
| 18469607 | OPTICAL FIBER | Final Rejection | FURUKAWA ELECTRIC CO., LTD. |
| 18157626 | OPTICAL COUPLER FOR VERTICAL OPTICAL COUPLING | Final Rejection | Cisco Technology, Inc. |
| 18755868 | RESIN COMPOSITION FOR COLORED COATING ON OPTICAL FIBER, OPTICAL FIBER, AND OPTICAL FIBER RIBBON | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18686932 | OPTICAL FIBER | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 17519411 | Integrated Optical Switch Having Doped Fiber/Waveguide Amplifiers Packaged in A Transposer | Final Rejection | Mellanox Technologies, Ltd. |
| 18501602 | PHOTODETECTORS WITH A NOTCHED LIGHT-ABSORBING LAYER | Non-Final OA | GlobalFoundries U.S. Inc. |
| 17452197 | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE | Non-Final OA | Soitec |
| 18556117 | IMPROVED PHOTONIC PACKAGING | Non-Final OA | Sentea NV |
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