Tech Center 2800 • Art Units: 2826 2896 2898
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18535076 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18453422 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18494525 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18455956 | SEMICONDUCTOR POWER MODULE HAVING MORE EFFICIENT HEAT DISSIPATION AND IMPROVED SWITCHING BEHAVIOR | Non-Final OA | ZF Friedrichshafen AG |
| 18227788 | SEMICONDUCTOR LIGHT EMITTING DEVICE FOR A DISPLAY PIXEL AND A DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | LG ELECTRONICS INC. |
| 18642889 | COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A MEMS DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750231 | BILAYER ENCAPSULATION OF A MEMORY CELL | Non-Final OA | Intel Corporation |
| 18399415 | ARRAY SUBSTRATE AND DISPLAY PANEL | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18569232 | ORGANIC LIGHT EMITTING DIODE DISPLAY PANEL AND ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18457162 | INTEGRATED CIRCUIT DEVICE HAVING A SUBSTRATE WITH A STEPPED CONFIGURATION TO ACCOMMODATE AT LEAST TWO DIFFERENT SOLDER BALL SIZES | Non-Final OA | QUALCOMM Incorporated |
| 18023337 | METHOD FOR TREATING AN OPTOELECTRONIC DEVICE | Final Rejection | ALEDIA |
| 18464759 | MEMS DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | ROHM CO., LTD. |
| 18460885 | MEMS DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18222926 | MEMS Array Structures for Gyroscopes with High Resonant Frequencies | Non-Final OA | STMicroelectronics International N.V. |
| 18451542 | Shallow Trench Isolation using Porous Semiconductor | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18328129 | MEMS with cover drive and method of operating the same | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 18277505 | MULTIMODE SUPERCONDUCTING CAVITY RESONATORS | Non-Final OA | Yale University |
| 18364138 | PHASE CHANGE MATERIAL MICROELECTROMECHANICAL SYSTEMS BASED ANALOG MEMORY AND COMPUTATIONAL DEVICE | Non-Final OA | HONEYWELL INTERNATIONAL INC. |
| 18117249 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18547022 | CARTRIDGE INTERFERENCE | Non-Final OA | VueReal Inc. |
| 18152511 | Semiconductor Devices and Methods of Manufacture | Final Rejection | Taiwan Semiconductor manufacturing Co., Ltd. |
| 18454038 | MEMS MICROPHONE | Non-Final OA | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| 18363599 | MICROELECTROMECHANICAL BUTTON DEVICE AND CORRESPONDING WATERPROOF USER INTERFACE ELEMENT | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18449455 | AMBIENT LIGHT SENSOR WITH ULTRAVIOLET LIGHT DETECTION FUNCTION | Final Rejection | Taiwan-Asia Semiconductor Corporation |
| 18278216 | TUNABLE DISSIPATIVE CIRCUITS FOR LOW TEMPERATURE FREQUENCY SHIFTERS, AND METHODS FOR MAKING A FREQUENCY SHIFT AT LOW TEMPERATURE | Non-Final OA | IQM FINLAND OY |
| 18546582 | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18342560 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME AND SEAL RING STRUCTURE | Non-Final OA | HUNAN SAN’AN SEMICONDUCTOR CO., LTD. |
| 18227929 | POWER CHIP PACKAGE AND POWER MODULE | Non-Final OA | Ganstronic INC. |
| 18266514 | MEMS DEVICE MANUFACTURING | Final Rejection | Obsidian Sensors, Inc. |
| 18318607 | Systems of Getters for Microelectronics and Methods for Production Thereof | Non-Final OA | Mesoline Inc. |
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