Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2823 2899
This examiner grants 79% of resolved cases
Quovaunda Jefferson is an examiner in Tech Center 2800 and Art Unit 2823, with 910 resolved cases. The allowance rate is 79.3 percent, and the median days to allowance is 1031. These metrics indicate the probability of success and the prosecution timeline for the 910 resolved cases that have reached a final decision. The data suggests a consistent environment for applicants in Art Unit 2823. The 910 resolved cases provide a reliable statistical foundation.
The interview lift is 8.7 percent, showing that direct communication has a positive impact on the 79.3 percent base allowance rate. While the 79.3 percent rate is already strong, the 8.7 percent lift suggests that interviews can help resolve specific issues. For practitioners, the 910 resolved cases provide a basis for strategy, and the 8.7 percent lift is a tool for navigating the 1031 days to allowance. The examiner appears to be receptive to discussion, as evidenced by the 8.7 percent lift across the 910 resolved cases.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508143 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18519268 | SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR | Non-Final OA | NXP B.V. |
| 18362687 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18753072 | DISPLAY DEVICE | Non-Final OA | CARUX TECHNOLOGY PTE. LTD. |
| 18486047 | PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18091265 | DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES | Final Rejection | Intel Corporation |
| 18089877 | INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS | Non-Final OA | Intel Corporation |
| 18061126 | POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES | Final Rejection | Intel Corporation |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Final Rejection | Intel Corporation |
| 18090407 | FLASH MEMORY CHIP WITH SELF ALIGNED ISOLATION FILL BETWEEN PILLARS | Non-Final OA | Intel NDTM US LLC |
| 18727256 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17562838 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18391011 | SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHIP WITH FACE-TO-FACE HYBRID BONDING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18733586 | SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18781455 | Method for Reducing Line-End Space in Integrated Circuit Patterning | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18756609 | PLANAR AND NON-PLANAR FET-BASED ELECTROSTATIC DISCHARGE PROTECTION DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18208710 | ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS | Non-Final OA | Applied Materials, Inc. |
| 17973927 | OXIDATION ENHANCED DOPING | Non-Final OA | Applied Materials, Inc. |
| 17590116 | Methods And Systems For Accurate Measurement Of Deep Structures Having Distorted Geometry | Final Rejection | KLA Corporation |
| 18633685 | MULTI-SUBSTRATE TRANSFORMER PACKAGES WITH MAGNETOSTRICTION MANAGEMENT | Non-Final OA | Allegro MicroSystems, LLC |
| 18614194 | PACKAGING STRUCTURE FOR ELECTRONIC DEVICES | Final Rejection | JCET GROUP CO., LTD. |
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