Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2823 2899
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18653116 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18604973 | SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18508143 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18727256 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18705758 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18677280 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18485823 | Display Device and Tiling Display Device Including the Same | Final Rejection | LG Display Co., Ltd. |
| 18585412 | WAFER AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18486047 | PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18091265 | DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES | Final Rejection | Intel Corporation |
| 18089877 | INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS | Final Rejection | Intel Corporation |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Final Rejection | Intel Corporation |
| 18061126 | POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES | Final Rejection | Intel Corporation |
| 18090407 | FLASH MEMORY CHIP WITH SELF ALIGNED ISOLATION FILL BETWEEN PILLARS | Final Rejection | Intel NDTM US LLC |
| 18391011 | SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHIP WITH FACE-TO-FACE HYBRID BONDING | Non-Final OA | Meta Platforms Technologies, LLC |
| 17665984 | METHODS OF DETERMINING SHEAR STRENGTH OF BONDED FREE AIR BALLS ON WIRE BONDING MACHINES | Final Rejection | Kulicke and Soffa Industries, Inc. |
| 18519268 | SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR | Final Rejection | NXP B.V. |
| 17562838 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18733586 | SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18208710 | ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS | Non-Final OA | Applied Materials, Inc. |
| 18192573 | DOPED SILICON-CONTAINING MATERIALS WITH INCREASED ELECTRICAL, MECHANICAL, AND ETCH CHARACTERISTICS | Non-Final OA | Applied Materials, Inc. |
| 18485346 | LINE-VIA-LINE STRUCTURE FOR BSPDN | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18179417 | LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18753072 | DISPLAY DEVICE | Non-Final OA | CARUX TECHNOLOGY PTE. LTD. |
| 17590116 | Methods And Systems For Accurate Measurement Of Deep Structures Having Distorted Geometry | Final Rejection | KLA Corporation |
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