Tech Center 2800 • Art Units: 2823 2899
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508143 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18362687 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18486047 | PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18209700 | NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18192573 | DOPED SILICON-CONTAINING MATERIALS WITH INCREASED ELECTRICAL, MECHANICAL, AND ETCH CHARACTERISTICS | Final Rejection | Applied Materials, Inc. |
| 18391007 | SYSTEMS AND METHODS FOR NON-UNIFORM MEMORY ACCESS ON THREE-DIMENSIONALLY-STACKED HYBRID MEMORY | Non-Final OA | Meta Platforms Technologies, LLC |
| 18091265 | DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES | Non-Final OA | Intel Corporation |
| 18089877 | INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS | Non-Final OA | Intel Corporation |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | Non-Final OA | Intel Corporation |
| 18532726 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18528213 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18255133 | FILM FORMATION METHOD | Final Rejection | Tokyo Electron Limited |
| 17562838 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18504714 | CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18519268 | SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR | Non-Final OA | NXP B.V. |
| 17926093 | WET FUNCTIONALIZATION OF DIELECTRIC SURFACES | Non-Final OA | Lam Research Corporation |
| 18512165 | MULTIPLE CHIP LED PACKAGES WITH COMMON ELECTRODES | Non-Final OA | CreeLED, Inc. |
| 18324262 | WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM | Final Rejection | DISCO CORPORATION |
| 17590116 | Methods And Systems For Accurate Measurement Of Deep Structures Having Distorted Geometry | Non-Final OA | KLA Corporation |
| 18407409 | INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18651804 | SUBSTRATE SCANNING APPARATUS WITH PENDULUM AND ROTATABLE SUBSTRATE HOLDER | Non-Final OA | TEL Manufacturing and Engineering of America, Inc. |
| 18098042 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MEMORY | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17585096 | FACET SUPPRESSION OF GALLIUM ARSENIDE SPALLING USING NANOIMPRINT LITHOGRAPHY AND METHODS THEREOF | Final Rejection | Colorado School of Mines |
| 18570706 | PLATING DEFECTS ESTIMATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | HITACHI POWER SEEMICONDUCTOR DEVICE, LTD. |
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