Prosecution Insights
Last updated: August 17, 2026

Examiner: KEAGY, ROSE ALYSSA

Tech Center 2800 • Art Units: 2818

This examiner grants 97% of resolved cases

Performance Statistics

97.4%
Allow Rate
+29.4% vs TC avg
55
Total Applications
+4.3%
Interview Lift
1160
Avg Prosecution Days
Based on 39 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
29.3%
§102 Novelty
57.5%
§103 Obviousness
13.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18754608 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18593293 MAGNETIC MEMORY DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18389699 SEMICONDUCTOR PACKAGE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18215985 SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18461336 Thin Film Transistor, Fabrication Method Thereof, and Display Apparatus Comprising the Same Non-Final OA LG Display Co., Ltd.
18044434 Display Screen, Method for Manufacturing Same, and Display Terminal Non-Final OA Huawei Technologies Co., Ltd.
18304659 INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN Non-Final OA Intel Corporation
18360666 PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18340843 ACTIVE REGION TRIMMING AFTER FORMATION OF SOURCE/DRAIN COMPONENTS Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18491237 MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
17815078 Semiconductor Device and Method of Manufacturing the Same Non-Final OA Taiwan Semiconductor Manufacturing Co.,Ltd.
18491297 METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR GAPS AND METHODS OF FORMING THE SAME Non-Final OA WESTERN DIGITAL TECHNOLOGIES, INC.,
18516707 METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING PRODUCT AND SEMICONDUCTOR DEVICE Non-Final OA STMICROELECTRONICS S.r.l.
18216749 ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY Final Rejection International Business Machines Corporation
18539244 MEMS DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA AAC Technologies Pte. Ltd.

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