Tech Center 2800 • Art Units: 2818
This examiner grants 93% of resolved cases
Rose Alyssa Keagy is an examiner in Tech Center 2800 and Art Unit 2818. Her record includes 44 resolved cases with an allowance rate of 93.2 percent. This rate suggests that most applications assigned to her result in a patent grant. The median days to allowance is 1156, which provides a timeline for when these grants typically occur. This duration is an important factor for applicants to consider in their planning.
The interview lift of 10.7 percent indicates that interviews provide a boost to the probability of success. While the 93.2 percent allowance rate is already high, the 10.7 percent lift shows that verbal engagement can still be a useful tool for resolving remaining issues. With 44 resolved cases, the examiner has shown a consistent tendency toward allowance. Practitioners should plan for a 1156-day median timeline but can be confident in the likelihood of a positive outcome, especially when utilizing the 10.7 percent interview lift to supplement written prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18796684 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18772310 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18389699 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18215985 | SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18304659 | INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN | Non-Final OA | Intel Corporation |
| 19185707 | SEMICONDUCTOR STRUCTURE WITH CRACK-BLOCKING THREE-DIMENSIONAL STRUCTURE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18519256 | METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHING MASK TO DEFINE DICING LINES | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18216749 | ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY | Non-Final OA | International Business Machines Corporation |
| 18360666 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18340843 | ACTIVE REGION TRIMMING AFTER FORMATION OF SOURCE/DRAIN COMPONENTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18766767 | Self-Aligned Contact Hard Mask Structure of Semiconductor Device and Method of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18404266 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18491237 | MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18768925 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18738727 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18593863 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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