Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2898 2899
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18164287 | CAPACITOR AND DRAM DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17624019 | DISPLAY PANEL | Final Rejection | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 17690399 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18618675 | 3D NON-VOLATILE MEMORY SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18335138 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18076808 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18594317 | METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING BURIED STOP LAYER IN SUBSTRATE | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18494315 | SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | MIRISE Technologies Corporation |
| 18507381 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18330805 | LUMIPHORIC MATERIALS WITHIN LIGHT-EMITTING DIODE CHIPS | Non-Final OA | CreeLED, Inc. |
| 18104966 | LASER ETCHING FOR LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | Final Rejection | CreeLED, Inc. |
| 18248641 | INFRARED LED ELEMENT | Final Rejection | Ushio Denki Kabushiki Kaisha |
| 18144029 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 18166267 | MOLYBDENUM CARRIER SUBSTRATE FOR A SURFACE-EMITTING IR-LED DEVICE | Final Rejection | VISHAY SEMICONDUCTOR GmbH |
| 18094901 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD. |
| 18254093 | COMPOSITE SUBSTRATES, PHOTOELECTRIC DEVICES, AND MANUFACTURING METHODS THEREOF | Final Rejection | ENKRIS SEMICONDUCTOR, INC. |
| 18005419 | LED EPITAXIAL STRUCTURE AND LED CHIP | Non-Final OA | XIAMEN SILAN ADVANCED COMPOUND SEMICONDUCTOR CO., LTD. |
| 18476058 | ELECTRONIC MODULE CONFIGURED FOR THERMAL MANAGEMENT | Final Rejection | Kyosan Electric Manufacturing Co., Ltd. |
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