Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2628 2816 2898 2899
This examiner grants 82% of resolved cases
Molly Kay Reida serves as an examiner in Tech Center 2800 and Art Unit 2628. She has a total of 444 resolved cases. The allowance rate for these cases is 82.4 percent. This 82.4 percent rate indicates the frequency at which applications reach a grant under her review. With 444 resolved cases, the profile provides a specific look at the outcomes in this docket.
The interview lift is 3.2 percent. This 3.2 percent figure is lower than the 82.4 percent allowance rate, suggesting that interviews provide a modest increase in the likelihood of allowance. Practitioners in Art Unit 2628 may use this 3.2 percent lift to evaluate the impact of direct communication. The median days to allowance is 802. This 802-day duration is the typical timeframe for successful applications. The 802-day metric, combined with the 444 resolved cases, helps stakeholders understand the pendency and probability of success in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18645765 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18528592 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18598456 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18594317 | METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING BURIED STOP LAYER IN SUBSTRATE | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18402497 | INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEMS AND METHODS | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18645813 | SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18444778 | SEMICONDUCTOR STRUCTURE | Final Rejection | E Ink Holdings Inc. |
| 18618675 | 3D NON-VOLATILE MEMORY SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18415487 | SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18720857 | Hybrid Bonding With Micro-Light Emitting Diode (LED) Devices | Non-Final OA | Lumileds LLC |
| 18638600 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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