Prosecution Insights
Last updated: April 19, 2026

Examiner: REIDA, MOLLY KAY

Tech Center 2800 • Art Units: 2816 2898 2899

This examiner grants 84% of resolved cases

Performance Statistics

83.5%
Allow Rate
+15.5% vs TC avg
448
Total Applications
+2.4%
Interview Lift
827
Avg Prosecution Days
Based on 417 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
34.4%
§102 Novelty
46.3%
§103 Obviousness
16.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18138311 INTEGRATED CIRCUIT DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18164287 CAPACITOR AND DRAM DEVICE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18151805 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18150835 IMAGING DEVICE AND IMAGING METHOD Non-Final OA Panasonic Intellectual Property Management Co., Ltd.
17805566 SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17624019 DISPLAY PANEL Final Rejection Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
17690399 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
18618675 3D NON-VOLATILE MEMORY SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Non-Final OA SK hynix Inc.
18335138 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Final Rejection SK hynix Inc.
18076808 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Final Rejection SK hynix Inc.
18484311 DEVICES AND METHODS RELATED TO STACK ASSEMBLY Final Rejection SKYWORKS SOLUTIONS, INC.
18594317 METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING BURIED STOP LAYER IN SUBSTRATE Final Rejection YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18101183 DETECTION DEVICE Final Rejection The University of Tokyo
18494315 SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SEMICONDUCTOR DEVICE INCLUDING THE SAME Non-Final OA MIRISE Technologies Corporation
18330805 LUMIPHORIC MATERIALS WITHIN LIGHT-EMITTING DIODE CHIPS Non-Final OA CreeLED, Inc.
18152865 METHOD OF MANUFACTURING WAFER Final Rejection DISCO CORPORATION
18538055 EXCHANGE ELECTRODES FOR NETWORK OF QUANTUM DOTS Non-Final OA COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
18248641 INFRARED LED ELEMENT Final Rejection Ushio Denki Kabushiki Kaisha
18144029 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Final Rejection Amkor Technology Singapore Holding Pte. Ltd.
18166267 MOLYBDENUM CARRIER SUBSTRATE FOR A SURFACE-EMITTING IR-LED DEVICE Final Rejection VISHAY SEMICONDUCTOR GmbH
18094901 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Final Rejection QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
17958667 METHOD OF MANUFACTURING OPTOELECTRONIC PRODUCTS AND APPARATUS THEREOF Non-Final OA EPISTAR CORPORATION
18476058 ELECTRONIC MODULE CONFIGURED FOR THERMAL MANAGEMENT Final Rejection Kyosan Electric Manufacturing Co., Ltd.

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