Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2628 2816 2898 2899
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18645765 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18423984 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18531140 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18594317 | METHOD FOR FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE USING BURIED STOP LAYER IN SUBSTRATE | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18618675 | 3D NON-VOLATILE MEMORY SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18767188 | SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18415487 | SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17805566 | SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18402497 | INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEMS AND METHODS | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18415100 | METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS THROUGH A MULTI-LAYER STACK | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18423619 | CHIPLET INTEGRATION STRUCTURE FOR THERMAL MANAGEMENT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18638600 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18144029 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
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