Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2829 2893
This examiner grants 84% of resolved cases
Dzung Tran is an examiner in Tech Center 2800, Art Unit 2829. The examiner has 1066 resolved cases. The data shows an allowance rate of 83.6 percent and an interview lift of 5.7 percent. The median days to allowance for these cases is 824.
The 5.7 percent interview lift is a metric that can be compared to the 83.6 percent base allowance rate. This indicates that conducting an interview is a method for increasing the likelihood of an allowance. The 824 day median pendency is the timeframe applicants can expect when navigating the resolved cases handled by this examiner in Art Unit 2829. Practitioners can consider how these metrics influence the overall prosecution timeline.
With 1066 resolved cases, the examiner's statistics provide a view of the prosecution landscape. Practitioners can use the 83.6 percent allowance rate to assess the probability of a grant. The 5.7 percent lift and the Tech Center 2800 environment are factors for prosecution strategy. These data points help in setting expectations for clients.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18631666 | MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18599943 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18584646 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18579496 | DISPLAY PANEL, METHOD FOR PREPARING SAME, AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18278674 | QUANTUM DOTS LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 17913789 | DISPLAY DEVICE, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18454310 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18884688 | Electroluminescent Display Device and Method of Manufacturing the Same | Non-Final OA | LG Display Co., Ltd. |
| 18814361 | TRANSPARENT DISPLAY PANEL AND TRANSPARENT DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18516658 | Display Device and Method for Manufacturing the Same | Final Rejection | LG Display Co., Ltd. |
| 18316165 | LATERAL SEMICONDUCTOR DEVICE COMPRISING UNIT CELLS WITH HEXAGON CONTOURS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18613141 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18522293 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Magnolia White Corporation |
| 18361920 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18185633 | METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18279020 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE, MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT, AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18650269 | CONCURRENT GENERAL-PURPOSE MEMORY DIE AND NEAR-MEMORY COMPUTE DIE IN SYSTEM-IN-PACKAGE (SIP) | Non-Final OA | QUALCOMM Incorporated |
| 18439360 | PACKAGE COMPRISING A SUBSTRATE AND A PASSIVE DEVICE | Final Rejection | QUALCOMM Incorporated |
| 18129872 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING | Non-Final OA | Intel Corporation |
| 18389496 | POWER MODULE | Final Rejection | Kia Corporation |
| 18842740 | SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIAL ADHESION INSPECTION DEVICE, AND FOREIGN MATERIAL ADHESION INSPECTION METHOD | Non-Final OA | Mitsubishi Electric Corporation |
| 18575942 | SEMICONDUCTOR DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18393597 | GAA NANOSHEET FET WITH SOURCE/DRAIN EXTENSION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18686488 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 17813990 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | WUHAN TIANMA MICROELECTRONICS CO., LTD. |
| 18643788 | Integrated Circuit Package Structure with Thermelectric Self-Cooling Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18666401 | BOTTOM-UP GAP FILL USING NON-CONFORMAL POISONING | Non-Final OA | Applied Materials, Inc. |
| 18474138 | TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY | Non-Final OA | Xilinx, Inc. |
| 18616682 | THREE-DIMENSIONAL MEMORY DEVICE WITH INTEGRATED CONTACT AND SUPPORT STRUCTURE AND METHOD OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18588849 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT ETCH-STOP LINER FOR LAYER CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
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