Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2829 2893
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18631666 | MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18599943 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18584646 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18583215 | STORAGE DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18583467 | MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18476415 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18278674 | QUANTUM DOTS LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 17915525 | DISPLAY DEVICE, DISPLAY PANEL AND METHOD FOR MANUFACTURING THE DISPLAY PANEL | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18467653 | PHASE CHANGE MEMORY CELL | Non-Final OA | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 18424909 | MANUFACTURING METHOD OF DISPLAY DEVICE AND MOTHER SUBSTRATE FOR DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18361920 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18316165 | LATERAL SEMICONDUCTOR DEVICE COMPRISING UNIT CELLS WITH HEXAGON CONTOURS | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18650269 | CONCURRENT GENERAL-PURPOSE MEMORY DIE AND NEAR-MEMORY COMPUTE DIE IN SYSTEM-IN-PACKAGE (SIP) | Non-Final OA | QUALCOMM Incorporated |
| 18129872 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING | Non-Final OA | Intel Corporation |
| 18279020 | LIGHT EMITTING ELEMENT, DISPLAY DEVICE, MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT, AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18638650 | LATERAL DIODE FOR BACKSIDE POWER RAIL APPLICATION | Non-Final OA | MEDIATEK INC. |
| 18366914 | SEMICONDUCTOR STRUCTURE | Final Rejection | MEDIATEK INC. |
| 18389496 | POWER MODULE | Non-Final OA | Kia Corporation |
| 17316155 | Recessed STI as the Gate Dielectric of HV Device | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18588849 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A REPLACEMENT ETCH-STOP LINER FOR LAYER CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18474138 | TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY | Non-Final OA | Xilinx, Inc. |
| 18440017 | DIE PADDLE STANDOFFS IN SEMICONDUCTOR PACKAGES | Non-Final OA | NEXPERIA B.V. |
| 18489672 | NONVOLATILE MEMORY WITH ISOLATION STRUCTURE AND METHOD OF FORMING THE SAME | Final Rejection | GLOBALFOUNDRIES U.S. Inc. |
| 18495060 | PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER | Final Rejection | Allegro MicroSystems, LLC |
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