Tech Center 2800 • Art Units: 1795 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17770363 | RESISTANCE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18578514 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18443202 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18663022 | METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18257795 | POWER MODULE FOR OPERATING AN ELECTRIC VEHICLE DRIVE HAVING OPTIMIZED COOLING AND CONTACTING | Non-Final OA | ZF Friedrichshafen AG |
| 17813592 | DISPLAY DEVICE HAVING LIGHT TRANSMISSIVE REGIONS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18590242 | INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18116721 | TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18424150 | CHOKE FILTERS IMPLEMENTED USING SUBSTRATE MATERIALS | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18413662 | SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18677190 | Carbon and/or Oxygen Doped Polysilicon Resistor | Non-Final OA | Texas Instruments Incorporated |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18470614 | Semiconductor Device Having FIN Structure and Method of Forming Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18584165 | VERTICAL RESISTIVE MEMORY DEVICE AND RELATED METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18393086 | MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, METHODS, APPARATUS, AND MODULES FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18622764 | INTEGRATION METHOD OF VERTICAL DRAM WITH PERIPHERAL CIRCUIT | Non-Final OA | Tokyo Electron Limited |
| 18230952 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT AND CORRESPONDING INTEGRATED CIRCUIT | Final Rejection | STMicroelectronics (Rousset) SAS |
| 18178333 | CAPACITOR INCLUDING LATERAL PLATES AND METHOD FOR FORMING A CAPACITOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18391742 | STACKED TRENCH CAPACITORS AND METHODS OF MAKING THEREOF | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18170522 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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