Prosecution Insights
Last updated: October 02, 2026

Examiner: BODNAR, JOHN A

Tech Center 2800 • Art Units: 1795 2893

This examiner grants 83% of resolved cases

Analysis

John A. Bodnar is an examiner in Tech Center 2800, specifically working within Art Unit 1795. He has 596 resolved cases, which provides a reliable sample of his examination history. The allowance rate pct for Bodnar is 83.2, indicating that a large majority of the applications he reviews result in a grant. This 83.2 allowance rate pct suggests a favorable environment for applicants in Art Unit 1795.

The interview lift pct of 11.9 is a meaningful factor for practitioners to consider. This value indicates that conducting an interview with Bodnar increases the probability of allowance. The median days to allowance is 942, showing a relatively efficient timeline for successful cases. Given the 11.9 interview lift pct and the 942 median days to allowance, interviews appear to be a valuable tool for resolving issues and reaching a conclusion. With 596 resolved cases, Bodnar's profile suggests that active engagement can help navigate the prosecution process in Tech Center 2800 effectively.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

83.2%
Allow Rate
+15.2% vs TC avg
622
Total Applications
+11.9%
Interview Lift
942
Avg Prosecution Days
Based on 596 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
22.2%
§102 Novelty
48.7%
§103 Obviousness
25.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18717799 SUBSTRATE STRUCTURE FOR TRANSCRIPTION OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR PIXEL, AND DISPLAY DEVICE COMPRISING SAME Non-Final OA LG DISPLAY CO., LTD.
18733710 Display Device Non-Final OA LG Display Co, Ltd.
18443202 Display Device Final Rejection LG Display Co., Ltd.
18663022 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE Non-Final OA NICHIA CORPORATION
18590242 INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS Non-Final OA QUALCOMM Incorporated
18116721 TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Non-Final OA Intel Corporation
18671501 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Non-Final OA YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18575382 SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
17770363 RESISTANCE ELEMENT AND ELECTRONIC DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18704766 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS Non-Final OA KYOCERA Corporation
18739431 SELF-ALIGNED BACKSIDE CUT Non-Final OA International Business Machines Corporation
18599234 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Kioxia Corporation
18677190 Carbon and/or Oxygen Doped Polysilicon Resistor Non-Final OA Texas Instruments Incorporated
18072702 INTEGRATED CIRCUIT CAPACITOR Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18178333 CAPACITOR INCLUDING LATERAL PLATES AND METHOD FOR FORMING A CAPACITOR Non-Final OA STMicroelectronics (Crolles 2) SAS
18659337 INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18393086 MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, METHODS, APPARATUS, AND MODULES FOR SEMICONDUCTOR MANUFACTURING Non-Final OA Applied Materials, Inc.
18476310 STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVICE MANUFACTURING METHOD Final Rejection SUMITOMO HEAVY INDUSTRIES, LTD.
17025972 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Final Rejection Advanced Semiconductor Engineering, Inc.
18232868 RESISTIVE MEMORY ELEMENTS WITH A MULTIPLE-MATERIAL ELECTRODE Final Rejection GlobalFoundries Singapore Pte. Ltd.
18117911 SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS OF SEMICONDUCTOR STRUCTURES Non-Final OA Semiconductor Manufacturing International (Shanghai) Corporation
18170522 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE Final Rejection CHANGXIN MEMORY TECHNOLOGIES, INC.

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