Prosecution Insights
Last updated: August 17, 2026

Examiner: BODNAR, JOHN A

Tech Center 2800 • Art Units: 1795 2893

This examiner grants 83% of resolved cases

Performance Statistics

83.2%
Allow Rate
+15.2% vs TC avg
620
Total Applications
+11.7%
Interview Lift
940
Avg Prosecution Days
Based on 591 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
22.3%
§102 Novelty
48.7%
§103 Obviousness
25.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17770363 RESISTANCE ELEMENT AND ELECTRONIC DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18578514 DISPLAY SUBSTRATE AND DISPLAY DEVICE Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
18443202 Display Device Final Rejection LG Display Co., Ltd.
18663022 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE Non-Final OA NICHIA CORPORATION
18257795 POWER MODULE FOR OPERATING AN ELECTRIC VEHICLE DRIVE HAVING OPTIMIZED COOLING AND CONTACTING Non-Final OA ZF Friedrichshafen AG
17813592 DISPLAY DEVICE HAVING LIGHT TRANSMISSIVE REGIONS Non-Final OA SAMSUNG DISPLAY CO., LTD.
18590242 INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS Non-Final OA QUALCOMM Incorporated
18116721 TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION Non-Final OA Intel Corporation
18424150 CHOKE FILTERS IMPLEMENTED USING SUBSTRATE MATERIALS Non-Final OA Avago Technologies International Sales Pte. Limited
18413662 SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
18677190 Carbon and/or Oxygen Doped Polysilicon Resistor Non-Final OA Texas Instruments Incorporated
18659337 INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18470614 Semiconductor Device Having FIN Structure and Method of Forming Thereof Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18584165 VERTICAL RESISTIVE MEMORY DEVICE AND RELATED METHOD Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18393086 MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, METHODS, APPARATUS, AND MODULES FOR SEMICONDUCTOR MANUFACTURING Non-Final OA Applied Materials, Inc.
18622764 INTEGRATION METHOD OF VERTICAL DRAM WITH PERIPHERAL CIRCUIT Non-Final OA Tokyo Electron Limited
18230952 METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT AND CORRESPONDING INTEGRATED CIRCUIT Final Rejection STMicroelectronics (Rousset) SAS
18178333 CAPACITOR INCLUDING LATERAL PLATES AND METHOD FOR FORMING A CAPACITOR Non-Final OA STMicroelectronics (Crolles 2) SAS
18391742 STACKED TRENCH CAPACITORS AND METHODS OF MAKING THEREOF Non-Final OA GlobalFoundries U.S. Inc.
18170522 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE Final Rejection CHANGXIN MEMORY TECHNOLOGIES, INC.

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