Tech Center 2800 • Art Units: 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18379841 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18128490 | MIM FLUX CAPACITOR WITH THIN AND THICK METAL LEVELS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18072702 | INTEGRATED CIRCUIT CAPACITOR | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18257795 | POWER MODULE FOR OPERATING AN ELECTRIC VEHICLE DRIVE HAVING OPTIMIZED COOLING AND CONTACTING | Non-Final OA | ZF Friedrichshafen AG |
| 17813592 | DISPLAY DEVICE HAVING LIGHT TRANSMISSIVE REGIONS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18450689 | LIGHT-EMITTING UNIT | Non-Final OA | AUO Corporation |
| 18476310 | STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVICE MANUFACTURING METHOD | Non-Final OA | SUMITOMO HEAVY INDUSTRIES, LTD. |
| 18188082 | STRUCTURE AND METHOD FOR DEEP TRENCH CAPACITOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18178406 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17887273 | SACRIFICIAL LAYER FOR SUBSTRATE ANALYSIS | Non-Final OA | Intel Corporation |
| 17654530 | DOPED METAL-INSULATOR-METAL (MIM) CAPACITOR OF A MEMORY ARRAY | Final Rejection | Intel Corporation |
| 18046088 | BIT LINES HAVING HIGH ELECTRICAL CONDUCTIVITY AND LOW MUTUAL CAPACITANCE AND RELATED APPARATUSES, COMPUTING SYSTEMS, AND METHODS | Final Rejection | Micron Technology, Inc. |
| 18345001 | OPENING IN STRESS-INDUCING LINER(S) BETWEEN TRANSISTORS | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18178333 | CAPACITOR INCLUDING LATERAL PLATES AND METHOD FOR FORMING A CAPACITOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18238646 | Bottom Layer Metal Interconnection Line Structure | Non-Final OA | Shanghai Huali Integrated Circuit Corporation |
| 18230952 | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT AND CORRESPONDING INTEGRATED CIRCUIT | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 18170522 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18232868 | RESISTIVE MEMORY ELEMENTS WITH A MULTIPLE-MATERIAL ELECTRODE | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18177087 | CAPACITOR STRUCTURES OF SEMICONDUCTOR DEVICES | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18117911 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS OF SEMICONDUCTOR STRUCTURES | Final Rejection | Semiconductor Manufacturing International (Shanghai) Corporation |
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