Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1795 2893
This examiner grants 83% of resolved cases
John A. Bodnar is an examiner in Tech Center 2800, specifically working within Art Unit 1795. He has 596 resolved cases, which provides a reliable sample of his examination history. The allowance rate pct for Bodnar is 83.2, indicating that a large majority of the applications he reviews result in a grant. This 83.2 allowance rate pct suggests a favorable environment for applicants in Art Unit 1795.
The interview lift pct of 11.9 is a meaningful factor for practitioners to consider. This value indicates that conducting an interview with Bodnar increases the probability of allowance. The median days to allowance is 942, showing a relatively efficient timeline for successful cases. Given the 11.9 interview lift pct and the 942 median days to allowance, interviews appear to be a valuable tool for resolving issues and reaching a conclusion. With 596 resolved cases, Bodnar's profile suggests that active engagement can help navigate the prosecution process in Tech Center 2800 effectively.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18717799 | SUBSTRATE STRUCTURE FOR TRANSCRIPTION OF SEMICONDUCTOR LIGHT EMITTING DEVICE FOR PIXEL, AND DISPLAY DEVICE COMPRISING SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18733710 | Display Device | Non-Final OA | LG Display Co, Ltd. |
| 18443202 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18663022 | METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18590242 | INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18116721 | TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18671501 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18575382 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17770363 | RESISTANCE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18704766 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS | Non-Final OA | KYOCERA Corporation |
| 18739431 | SELF-ALIGNED BACKSIDE CUT | Non-Final OA | International Business Machines Corporation |
| 18599234 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kioxia Corporation |
| 18677190 | Carbon and/or Oxygen Doped Polysilicon Resistor | Non-Final OA | Texas Instruments Incorporated |
| 18072702 | INTEGRATED CIRCUIT CAPACITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18178333 | CAPACITOR INCLUDING LATERAL PLATES AND METHOD FOR FORMING A CAPACITOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18659337 | INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18393086 | MODULAR PROCESSING CHAMBERS AND RELATED HEATING CONFIGURATIONS, METHODS, APPARATUS, AND MODULES FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18476310 | STAGE APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, AND DEVICE MANUFACTURING METHOD | Final Rejection | SUMITOMO HEAVY INDUSTRIES, LTD. |
| 17025972 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18232868 | RESISTIVE MEMORY ELEMENTS WITH A MULTIPLE-MATERIAL ELECTRODE | Final Rejection | GlobalFoundries Singapore Pte. Ltd. |
| 18117911 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS OF SEMICONDUCTOR STRUCTURES | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18170522 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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