Tech Center 2800 • Art Units: 2817 2895
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18118983 | THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17850957 | ARTIFICIAL INTELLIGENT COOLING METHOD FOR SERVER AND SSD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18235221 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18459174 | PACKAGES WITH NOTCHED, INTERDIGITATED, AND RETRACTED METAL LAYERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18237110 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17952205 | WORKWEAR UNIT HAVING A GLOVE THAT FASTENS A CONTROL SYSTEM AND FUNCTIONAL MODULE TO A USER'S BODY | Non-Final OA | Workaround GmbH |
| 18348934 | MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES | Final Rejection | Apple Inc. |
| 18464926 | METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RESISTANCE | Non-Final OA | Applied Materials, Inc. |
| 18495830 | SCANNING SINGLE ELECTRON TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 18479808 | STRUCTURE HAVING CAPPING LAYER AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18456291 | ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18479432 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON OXIDE ION-GETTERING STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17958012 | AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES | Non-Final OA | Intel Corporation |
| 17833608 | ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY | Non-Final OA | Intel Corporation |
| 18460471 | PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER | Non-Final OA | QUALCOMM Incorporated |
| 17788248 | DEVICE WITH THREE-DIMENSIONAL OPTOELECTRONIC COMPONENTS FOR LASER CUTTING AND LASER CUTTING METHOD OF SUCH A DEVICE | Non-Final OA | Aledia |
| 18476616 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE | Non-Final OA | NEXPERIA B.V. |
| 17876189 | ELASTOMER INTERCONNECTION SUBSTRATE LAYER AND METHOD OF FORMING THE SAME | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18479327 | SEMICONDUCTOR DEVICE | Non-Final OA | RENESAS ELECTRONICS CORPORATION |
| 18376668 | HIGH-ELECTRON-MOBILITY TRANSISTOR | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18010254 | VIA CONNECTION STRUCTURE COMPRISING MULTIPLE VIAS AND SUBSTRATE COMPRISING THE SAME | Non-Final OA | ABSOLICS INC. |
| 18495688 | SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF | Non-Final OA | ACTRON TECHNOLOGY CORPORATION |
| 18469523 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18450167 | SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | PHOENIX PIONEER TECHNOLOGY CO., LTD. |
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