Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18118983 | THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17850957 | ARTIFICIAL INTELLIGENT COOLING METHOD FOR SERVER AND SSD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18495830 | SCANNING SINGLE ELECTRON TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 18464926 | METHOD AND MATERIAL SYSTEM FOR TUNABLE HYBRID BOND INTERCONNECT RESISTANCE | Non-Final OA | Applied Materials, Inc. |
| 17788248 | DEVICE WITH THREE-DIMENSIONAL OPTOELECTRONIC COMPONENTS FOR LASER CUTTING AND LASER CUTTING METHOD OF SUCH A DEVICE | Non-Final OA | Aledia |
| 18456291 | ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17876189 | ELASTOMER INTERCONNECTION SUBSTRATE LAYER AND METHOD OF FORMING THE SAME | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18376668 | HIGH-ELECTRON-MOBILITY TRANSISTOR | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18466278 | CHIP-ON-FILM AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18495688 | SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF | Non-Final OA | ACTRON TECHNOLOGY CORPORATION |
| 18450167 | SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | PHOENIX PIONEER TECHNOLOGY CO., LTD. |
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