Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18626727 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR EMBEDDED IN DIELECTRIC LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18595689 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18404607 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18503543 | SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | HYUNDAI MOBIS CO., LTD. |
| 18693776 | ORGANIC ELECTROLUMINESCENT DEVICES AND DISPLAY SUBSTRATES | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18474723 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18517250 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18468493 | INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION | Final Rejection | QUALCOMM Incorporated |
| 18090807 | INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY | Final Rejection | Intel Corporation |
| 18147487 | METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES | Final Rejection | Intel Corporation |
| 18547084 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18589721 | STITCH BOND TO COPPER NANOTWIN PLATED LEAD | Non-Final OA | Texas Instruments Incorporated |
| 18403754 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18124674 | MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES | Final Rejection | Applied Materials, Inc. |
| 18064260 | PREVENTING SOURCE/DRAIN EPI MERGE WITHOUT CELL SIZE INCREASE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17946147 | DOUBLE-SIDED EMBEDDED MEMORY ARRAY | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18534862 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | MACRONIX INTERNATIONAL CO., LTD. |
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