Prosecution Insights
Last updated: April 19, 2026

Examiner: LINDSEY, COLE LEON

Tech Center 2800 • Art Units: 2812

This examiner grants 89% of resolved cases

Performance Statistics

88.8%
Allow Rate
+20.8% vs TC avg
150
Total Applications
+12.8%
Interview Lift
1089
Avg Prosecution Days
Based on 116 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
27.2%
§102 Novelty
55.8%
§103 Obviousness
15.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18492946 INTEGRATED CIRCUIT DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18474723 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18274982 ELECTRODE FOR LITHIUM SECONDARY BATTERY COMPRISING INSULATING LAYER, AND METHOD FOR MANUFACTURING SAME Non-Final OA LG ENERGY SOLUTION, LTD.
18503543 SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME Non-Final OA HYUNDAI MOBIS CO., LTD.
18547084 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
18517250 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18540106 LIGHT EMITTING ELEMENT Non-Final OA TOYODA GOSEI CO., LTD.
18397756 SEMICONDUCTOR DEVICE Non-Final OA FUJI ELECTRIC CO., LTD.
18396913 POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
18064260 PREVENTING SOURCE/DRAIN EPI MERGE WITHOUT CELL SIZE INCREASE Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
17946147 DOUBLE-SIDED EMBEDDED MEMORY ARRAY Final Rejection INTERNATIONAL BUSINESS MACHINES CORPORATION
18090807 INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY Non-Final OA Intel Corporation
18147487 METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES Non-Final OA Intel Corporation
18087517 UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING Non-Final OA Intel Corporation
18390817 RECESSED SOURCE/DRAIN EPITAXIAL STRUCTURE FOR DIRECT BACKSIDE CONTACT Non-Final OA QUALCOMM Incorporated
18468493 INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION Non-Final OA QUALCOMM Incorporated
18506657 METHOD OF MANUFACTURING FIELD-EFFECT TRANSISTOR ARRAY BY DIRECT CARBON NANOTUBE PRINTING AND FIELD EFFECT TRANSISTOR ARRAY MANUFACTURED BY THE SAME Non-Final OA DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY
18325375 FLEXIBLE SCREEN Non-Final OA SYNCMOLD ENTERPRISE CORP.
18389817 SILICON-CARBIDE-BASED MOSFET DEVICE AND METHOD FOR MANUFACTURING SAME Non-Final OA Alkaid-Semi Technologies (Shanghai) Co., Ltd
18526532 TRIAC DEVICE WITH HIGH COMMUTATING CAPABILITY Non-Final OA Littelfuse Semiconductor (Wuxi) Co., Ltd.

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