Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18274982 | ELECTRODE FOR LITHIUM SECONDARY BATTERY COMPRISING INSULATING LAYER, AND METHOD FOR MANUFACTURING SAME | Non-Final OA | LG ENERGY SOLUTION, LTD. |
| 18474723 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18064260 | PREVENTING SOURCE/DRAIN EPI MERGE WITHOUT CELL SIZE INCREASE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17946147 | DOUBLE-SIDED EMBEDDED MEMORY ARRAY | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18138811 | METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES | Non-Final OA | Applied Materials, Inc. |
| 18090807 | INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR SHARED PERIPHERALS IN MEMORY | Non-Final OA | Intel Corporation |
| 18147487 | METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES | Non-Final OA | Intel Corporation |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Non-Final OA | Intel Corporation |
| 18390817 | RECESSED SOURCE/DRAIN EPITAXIAL STRUCTURE FOR DIRECT BACKSIDE CONTACT | Non-Final OA | QUALCOMM Incorporated |
| 18468493 | INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION | Non-Final OA | QUALCOMM Incorporated |
| 18528301 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF, CHIP PACKAGE STRUCTURES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18325375 | FLEXIBLE SCREEN | Non-Final OA | SYNCMOLD ENTERPRISE CORP. |
| 18129330 | STRUCTURE AND METHOD FOR IMPROVING NEAR-INFRARED QUANTUM EFFICIENCY OF BACKSIDE ILLUMINATED IMAGE SENSOR | Non-Final OA | Shanghai Huali Integrated Circuit Corporation |
| 18526532 | TRIAC DEVICE WITH HIGH COMMUTATING CAPABILITY | Non-Final OA | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
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