Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 89% of resolved cases
Cole Leon Lindsey serves in Tech Center 2800 and Art Unit 2812. The examiner has 135 resolved cases. The allowance rate is 88.9 percent. This high rate indicates that the vast majority of applications result in a patent grant. The 135 resolved cases provide a sufficient data set to understand the examiner's generally favorable approach to prosecution.
The median days to allowance is 1044. This timeframe shows the typical duration for successful applications to reach a grant. The interview lift is 12.7 percent. This figure represents the improvement in allowance probability associated with an examiner interview. While the 88.9 percent allowance rate is already high, the 12.7 percent lift offers an additional benefit for resolving any complex issues that may arise.
In Art Unit 2812, the 88.9 percent allowance rate and 1044 median days to allowance define a positive environment for applicants. The 135 resolved cases reflect a consistent pattern of success. The 12.7 percent interview lift is a useful strategic option. Overall, the data suggests that applicants have a high likelihood of obtaining a patent within a standard timeframe under this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18626727 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR EMBEDDED IN DIELECTRIC LAYER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18595689 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18420969 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18540106 | LIGHT EMITTING ELEMENT | Final Rejection | TOYODA GOSEI CO., LTD. |
| 18693776 | ORGANIC ELECTROLUMINESCENT DEVICES AND DISPLAY SUBSTRATES | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18517250 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18474723 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18390817 | RECESSED SOURCE/DRAIN EPITAXIAL STRUCTURE FOR DIRECT BACKSIDE CONTACT | Final Rejection | QUALCOMM Incorporated |
| 18468493 | INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION | Non-Final OA | QUALCOMM Incorporated |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Final Rejection | Intel Corporation |
| 18547084 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18396913 | POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18064260 | PREVENTING SOURCE/DRAIN EPI MERGE WITHOUT CELL SIZE INCREASE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18589721 | STITCH BOND TO COPPER NANOTWIN PLATED LEAD | Non-Final OA | Texas Instruments Incorporated |
| 18540147 | Memory Circuitry And Method Used In Forming Memory Circuitry | Final Rejection | Micron Technology, Inc. |
| 18787573 | PASSIVATION LAYERS WITH ROUNDED CORNERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18760276 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786265 | Wafer Bonding Apparatus and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18138811 | METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES | Final Rejection | Applied Materials, Inc. |
| 18124674 | MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18515472 | PACKAGING STRUCTURE AND PACKAGING METHOD | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18526532 | TRIAC DEVICE WITH HIGH COMMUTATING CAPABILITY | Final Rejection | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
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