Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2899 4100
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18605431 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18217655 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18334578 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18702846 | Array Substrate, Array Motherboard, Light-Emitting Substrate, Backlight Module, and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18693513 | Display Substrate and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18229959 | Capacitor Carrier Ring And Stiffener For Integrated Circuit Package Assembly | Final Rejection | Google LLC |
| 18328795 | METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18686234 | SEMICONDUCTOR HETEROSTRUCTURES WITH SCANDIUM III-NITRIDE LAYER | Non-Final OA | The Regents of the University of Michigan |
| 18067788 | AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE | Final Rejection | NXP USA, Inc. |
| 18448748 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18416779 | Low-Leakage NEDMOS and LDMOS Devices | Non-Final OA | pSemi Corporation |
| 18443329 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING AND TESTING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18447321 | SEMICONDUCTOR DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 19274981 | Package with Improved Heat Dissipation Efficiency and Method for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18510523 | SEAL RING STRUCTURE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18457523 | REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18331837 | POWER MODULE FOR HALF-BRIDGE CIRCUIT WITH SCALABLE ARCHITECTURE AND IMPROVED LAYOUT | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18604150 | WRAP AROUND METAL CONTACT | Non-Final OA | International Business Machines Corporation |
| 18586753 | STACKED STRUCTURES WITH SPLIT DEVICE LAYERS | Non-Final OA | International Business Machines Corporation |
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