Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18217655 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18448748 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18453713 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17994116 | SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18229959 | Capacitor Carrier Ring And Stiffener For Integrated Circuit Package Assembly | Non-Final OA | Google LLC |
| 17957003 | HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE | Non-Final OA | Intel Corporation |
| 17853329 | DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP) | Final Rejection | Intel Corporation |
| 17847434 | PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS | Non-Final OA | Intel Corporation |
| 18447321 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18067788 | AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE | Non-Final OA | NXP USA, Inc. |
| 18162481 | SHIELDED WAFER LEVEL CHIP SCALE PACKAGE WITH SHIELD CONNECTED TO GROUND WITH VIAS THROUGH DIE | Final Rejection | Skyworks Solutions, Inc. |
| 18331837 | POWER MODULE FOR HALF-BRIDGE CIRCUIT WITH SCALABLE ARCHITECTURE AND IMPROVED LAYOUT | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18328795 | METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18490615 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18073045 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | JCET MANAGEMENT CO., LTD. |
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