Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2899 4100
This examiner grants 90% of resolved cases
Rohit Parthasarathy is an examiner in Tech Center 4100 and Art Unit 2899. The examiner has 45 resolved cases. These 45 resolved cases show an 88.9% allowance rate. The median days to allowance for these grants is 1186. This 1186-day figure provides a timeline for practitioners to use when setting expectations for patent issuance in this specific unit.
The 14.7% interview lift indicates that direct communication with the examiner is associated with a higher probability of success compared to the baseline. Practitioners can use this 14.7% lift to justify the resources required for an interview. The 88.9% allowance rate serves as a key performance indicator for the 45 resolved cases. By considering both the 1186 median days to allowance and the 14.7% interview lift, practitioners can develop a specific strategy for applications assigned to this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18702846 | Array Substrate, Array Motherboard, Light-Emitting Substrate, Backlight Module, and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18067788 | AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE | Final Rejection | NXP USA, Inc. |
| 18800131 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18229959 | Capacitor Carrier Ring And Stiffener For Integrated Circuit Package Assembly | Final Rejection | Google LLC |
| 18448748 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18686234 | SEMICONDUCTOR HETEROSTRUCTURES WITH SCANDIUM III-NITRIDE LAYER | Final Rejection | The Regents of the University of Michigan |
| 18604150 | WRAP AROUND METAL CONTACT | Final Rejection | International Business Machines Corporation |
| 18586753 | STACKED STRUCTURES WITH SPLIT DEVICE LAYERS | Non-Final OA | International Business Machines Corporation |
| 18634386 | Molded Electronic Component Having a Shunt Between a Load Terminal and a Sense Terminal | Non-Final OA | Infineon Technologies AG |
| 19283746 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18443329 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING AND TESTING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18447321 | SEMICONDUCTOR DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18510523 | SEAL RING STRUCTURE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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