Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2875 2893
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18422612 | DISPLAY PANEL AND ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18227454 | ETCHING COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUITS USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18378654 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17656477 | PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED SIGNAL ROUTING CAPACITY, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Final Rejection | Intel Corporation |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Final Rejection | Intel Corporation |
| 18608931 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18773631 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18345552 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18334630 | NOISE TRANSISTOR | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17875975 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18232986 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17681346 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18636401 | Method of Forming Transistor | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18637574 | MICROWAVE APPARATUS FOR DUAL MODE OPERATION AND METHODS OF USE | Non-Final OA | Applied Materials, Inc. |
| 17409940 | CARBON NANOTUBE (CNT) MEMORY CELL ELEMENT AND METHODS OF CONSTRUCTION | Final Rejection | Microchip Technology Incorporated |
| 18394568 | SiC EPITAXIAL WAFER | Non-Final OA | Resonac Corporation |
| 17843195 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | Non-Final OA | National Yang Ming Chiao Tung University |
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