Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18526404 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17677329 | METHODS OF FORMING INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND INTEGRATED CIRCUIT DEVICES FORMED BY THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17787953 | DISPLAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Final Rejection | BOE Technology Group Co., Ltd. |
| 18492846 | EMISSIVE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18219695 | GATE STACK DIPOLE COMPENSATION FOR THRESHOLD VOLTAGE DEFINITION IN TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Non-Final OA | Intel Corporation |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Non-Final OA | Intel Corporation |
| 18657487 | HIGH-ASPECT RATIO METALLIZED STRUCTURES | Non-Final OA | GE Precision Healthcare LLC |
| 17742001 | PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZATION PORTIONS | Final Rejection | QUALCOMM Incorporated |
| 18345552 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18335525 | FEEDTHROUGH VIA BETWEEN ACTIVE REGIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18394568 | SiC EPITAXIAL WAFER | Non-Final OA | Resonac Corporation |
| 17409940 | CARBON NANOTUBE (CNT) MEMORY CELL ELEMENT AND METHODS OF CONSTRUCTION | Non-Final OA | Microchip Technology Incorporated |
| 18151792 | FILM MODIFICATION FOR GATE CUT PROCESS | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17843195 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | Non-Final OA | National Yang Ming Chiao Tung University |
| 18123995 | SEMICONDUCTOR DEVICE HAVING ANISOTROPIC LAYER | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17730462 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. |
| 18038106 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
| 18140030 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Final Rejection | Semiconductor Manufacturing International (Beijing) Corporation |
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