Tech Center 2800 • Art Units: 2811 2827 2875 2893
This examiner grants 82% of resolved cases
William Clarence Trice III serves in Tech Center 2800 and Art Unit 2811, with a record of 55 resolved cases. The allowance rate stands at 81.8 percent, indicating the frequency of successful outcomes. These 55 resolved cases offer a data set for understanding the examiner's approach. This volume of cases forms the basis for the current metrics.
The interview lift is 27.2 percent, which highlights the impact of oral advocacy during prosecution. A median days to allowance of 1270 provides a benchmark for the speed of the process. Within Art Unit 2811, these statistics reflect the examiner's typical workflow and decision-making timeline.
For practitioners, the 27.2 percent interview lift is a relevant metric when considering a request for a personal discussion. The 81.8 percent allowance rate and the 1270 median days to allowance are factors for setting realistic goals. Data from Tech Center 2800 suggests a predictable environment for patent applications.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18439863 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18422612 | DISPLAY PANEL AND ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17677329 | METHODS OF FORMING INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND INTEGRATED CIRCUIT DEVICES FORMED BY THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18077394 | INTEGRATION OF FINFET AND GATE-ALL-AROUND DEVICES | Final Rejection | Intel Corporation |
| 17561682 | INTEGRATED CIRCUIT STRUCTURE WITH BURIED POWER RAIL | Final Rejection | Intel Corporation |
| 18847289 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18394568 | SiC EPITAXIAL WAFER | Final Rejection | Resonac Corporation |
| 18657487 | HIGH-ASPECT RATIO METALLIZED STRUCTURES | Final Rejection | GE Precision Healthcare LLC |
| 18608931 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18789197 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18786268 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18786260 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773631 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18345552 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17875975 | SEMICONDUCTOR DEVICE STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18232986 | SPACER STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18637574 | MICROWAVE APPARATUS FOR DUAL MODE OPERATION AND METHODS OF USE | Non-Final OA | Applied Materials, Inc. |
| 18404530 | IMAGE SENSORS WITH A TUNABLE FLOATING DIFFUSION STRUCTURE | Final Rejection | KLA Corporation |
| 18654015 | TRANSISTOR STRUCTURE WITH MULTIPLE VERTICAL THIN BODIES | Non-Final OA | Invention and Collaboration Laboratory, Inc. |
| 18140030 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
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