Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2891
This examiner grants 62% of resolved cases
David William Ward is an examiner in Art Unit 2891, part of Tech Center 2800. The examiner has 76 resolved cases, which show an allowance rate of 63.2%. This indicates the proportion of applications that are successful. However, the median days to allowance is 1331, which is the timeline for successful cases. Practitioners should consider this 1331-day duration when managing applications in Art Unit 2891.
The interview lift for this examiner is 42.1%. This is a high lift, suggesting that interviews are a tool for practitioners. The 42.1% lift is a significant figure when compared to the 63.2% baseline allowance rate. Given the 1331-day median pendency, an interview may be necessary to navigate the prosecution process. With 76 resolved cases, the data suggests that the 42.1% lift offers a tactical advantage for reaching an allowance. Practitioners in Tech Center 2800 should use the 42.1% lift to improve outcomes relative to the 63.2% allowance rate.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18812022 | METHOD OF FABRICATING MAGNETIC MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18666932 | SEMICONDUCTOR DEVICES HAVING A SEAL RING | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18666888 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18661906 | INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18390782 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18537013 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17800254 | DISPLAY PANEL, METHOD FOR MANUFACTURING SAME, DISPLAY DEVICE, AND VEHICLE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 17630666 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18505364 | DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR | Final Rejection | NXP B.V. |
| 18781655 | PIXEL AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18326229 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17876788 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 17874556 | SEALING STRUCTURE AND DISPLAY DEVICE HAVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17870350 | TILED DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17851668 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 17572113 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18587861 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18456855 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18072333 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18060505 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 17942202 | BOTTOM EMISSION TYPE ELECTROLUMINESCENCE DISPLAY | Final Rejection | LG DISPLAY CO., LTD. |
| 17874763 | Display Device and Method for Manufacturing Cushion Plate | Final Rejection | LG Display Co., Ltd. |
| 17620643 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18349267 | MULTI-TERMINAL GALLIUM NITRIDE POWER TRANSISTOR | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18126857 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Final Rejection | Intel Corporation |
| 18179092 | METHODS AND APPARATUS TO PLACE BALLS FOR SECOND LEVEL INTERCONNECTS OF INTEGRATED CIRCUIT PACKAGES | Non-Final OA | Intel Corporation |
| 17848660 | VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT | Final Rejection | Intel Corporation |
| 18396543 | SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18538860 | SEMICONDUCTOR STRUCTURE, FABRICATION METHOD THEREOF, AND MEMORY SYSTEM | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18294638 | SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
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