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Last updated: October 25, 2026

Alliance Ip, LLC - Intel: all pending office actions

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App #TitleClientExaminerArt UnitStatutesStatusDue inAIFiled
19425232 Untitled Intel Corporation SU, STEPHANIE T 3662 — Non-Final OA — Pending
19288619 INDEPENDENT SAFETY MONITORING OF AN AUTOMATED DRIVING SYSTEM Intel Corporation SU, STEPHANIE T 3662 §103 Non-Final OA — Pending Aug 01, 2025
19239325 DIE-TO-DIE INTERCONNECT Intel Corporation DALEY, CHRISTOPHER ANTHONY 2184 DP Non-Final OA — Pending Jun 16, 2025
19075313 ISOLATED POWER DOMAINS IN A COMPUTING DEVICE Intel Corporation DARE, RYAN A 2132 §103§112 Non-Final OA 40d Pending Mar 10, 2025
19107813 DISTRIBUTED ADDRESS TRANSLATION SERVICES Intel Corporation YOON, ALEXANDER J 2135 §103§112 Final Rejection — Pending Feb 28, 2025
19106586 COMMUNICATION OF MEDIA CONFIGURATION INFORMATION OVER A SERIAL COMMUNICATION INTERFACE Intel Corporation YIMER, GETENTE A §103 Non-Final OA — Pending Feb 25, 2025
19042760 SOURCE ORDERING IN DEVICE INTERCONNECTS Intel Corporation HASSAN, AURANGZEB 2184 §103 Final Rejection — Pending Jan 31, 2025
18940819 Tall DIMM Structural Retention Intel Corporation KRIM, PETER 2841 §102§103 Non-Final OA — Pending Nov 07, 2024
18920362 CHARACTERIZING AND MARGINING MULTI-VOLTAGE SIGNAL ENCODING FOR INTERCONNECTS Intel Corporation KNAPP, JUSTIN R 2112 DP Final Rejection 40d AI Ready Oct 18, 2024
18899209 FLEXIBLE MOUNTING STRUCTURES FOR SURFACE MOUNT COMPONENTS Intel Corporation MISHLER, ROBIN J 2628 §103 Final Rejection 15d overdue Pending Sep 27, 2024
18849897 PHYSICAL DOWNLINK CONTROL CHANNEL (PDCCH) MONITORING CAPABILITY FOR MULTI-CELL SCHEDULING Intel Corporation LE, BRIAN T 2479 §102§103§112 Non-Final OA — Pending Sep 23, 2024
18843970 MECHANISMS FOR MULTI-CARRIER TRANSMIT SWITCHING FOR NEW RADIO SYSTEMS IN 5G RAN1 Intel Corporation HUYNH, DUNG B. 2469 §103§112 Non-Final OA — Pending Sep 04, 2024
18838740 TECHNOLOGIES FOR LOW POWER INDOOR AND OUTDOOR DETECTION Intel Corporation TRAN, VI N 2117 §101§102§103 Non-Final OA — Pending Aug 15, 2024
18833337 SYSTEMS AND METHODS FOR TIMING CONTROL AND UCI MULTIPLEXING IN MULTI-TRP MULTI-PANEL OPERATION Intel Corporation COBY, FRANTZ 2459 §103 Non-Final OA — Pending Jul 25, 2024
18738798 POWER OPTIMIZED MULTI-REGIONAL UPDATE DISPLAY Intel Corporation AZARI, SEPEHR 2621 §102§103 Final Rejection — AI Ready Jun 10, 2024
18620866 TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS Intel Corporation KIANNI, KAVEH C 2874 §103 Non-Final OA — Pending Mar 28, 2024
18400632 DATA PRIVACY PRESERVATION IN MACHINE LEARNING TRAINING Intel Corporation PARK, GRACE A 2144 §102§103 Non-Final OA — Pending Dec 29, 2023
18395162 VIRTUAL ENVIRONMENT MODIFICATIONS BASED ON USER BEHAVIOR OR CONTEXT Intel Corporation BLAUFELD, JUSTIN R 2151 §102§103§112 Final Rejection 54d AI Ready Dec 22, 2023
18535544 APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT Intel Corporation EISNER, RONALD 2644 §103 Final Rejection 7d AI Ready Dec 11, 2023
18565408 METHOD AND APPARATUS FOR MODIFYING A SUBSTRATE Intel Corporation EVANGELISTA, THEODORE JUSTINE 3761 §102§103§112 Non-Final OA — Pending Nov 29, 2023
18492007 COMPOSABLE TRUSTED EXECUTION ENVIRONMENTS Intel Corporation MILLS, PAUL V 2196 §103 Final Rejection 41d AI Ready Oct 23, 2023
18477881 LAPTOP BLOWER USING AC IONIC WIND PRINCIPLES Intel Corporation FENG, ZHENGFU J 2841 §102§103 Non-Final OA — Pending Sep 29, 2023
18477836 TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE Intel Corporation ENDRESEN, KIRSTEN DANIELA 2874 §102§103§112 Non-Final OA — Pending Sep 29, 2023
18552213 PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING Intel Corporation SOUNDRANAYAGAM, RAYAPPU NMN 2851 §102§103 Non-Final OA — Pending Sep 25, 2023
18458621 HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCALABILITY Intel Corporation TAYLOR, EARL N 2811 — Non-Final OA — Pending Aug 30, 2023
18264214 TECHNOLOGIES FOR WIRELESS SENSOR NETWORKS Intel Corporation ABAZA, AYMAN A 2465 §103 Non-Final OA 14d AI Ready Aug 03, 2023
18362308 TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED CIRCUIT DIES Intel Corporation HOLLWEG, THOMAS A 2874 §102§103 Non-Final OA — Pending Jul 31, 2023
18346212 TWO-TERMINAL FERROELECTRIC PEROVSKITE DIODE MEMORY ELEMENT Intel Corporation STUESSY, NOLAN GABRIEL 2812 §103 Non-Final OA — Pending Jul 01, 2023
18345208 STREAMING FABRIC INTERFACE Intel Corporation HUYNH, KIM T 2184 §102§103 Non-Final OA — Pending Jun 30, 2023
18346098 FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT Intel Corporation ANYA, IGWE U 2891 §102 Non-Final OA — Pending Jun 30, 2023
18345106 TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR Intel Corporation JORDAN, ANDREW 2874 §102§103§112 Non-Final OA — Pending Jun 30, 2023
18346087 HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER Intel Corporation ERDEM, FAZLI 2812 §102 Non-Final OA — Pending Jun 30, 2023
18346039 PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE Intel Corporation SMITH, CHAD 2874 §102§103 Non-Final OA — Pending Jun 30, 2023
18345127 TECHNOLOGIES FOR BARRIER LAYERS IN PEROVSKITE TRANSISTORS Intel Corporation YUSHINA, GALINA G 2811 — Non-Final OA — Pending Jun 30, 2023
18217165 ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS Intel Corporation RAHLL, JERRY T 2874 §102§103 Non-Final OA — Pending Jun 30, 2023
18344042 ARCHITECTURAL INTERFACE FOR ADDRESS TRANSLATION CACHE (ATC) IN XPU TO SUBMIT COMMAND DIRECTLY TO GUEST SOFTWARE Intel Corporation LI, SIDNEY 2137 §103 Non-Final OA — Pending Jun 29, 2023
18342422 TECHNOLOGIES FOR A HYBRID OPTICAL CHIP-TO-CHIP COUPLING Intel Corporation TAVLYKAEV, ROBERT FUATOVICH 2896 §102§103 Non-Final OA — Pending Jun 27, 2023
18209827 AUTOMATIC TUNING OF HETEROGENOUS WIRELESS INFRASTRUCTURE Intel Corporation CHEEMA, HASAN ALI 2465 §103 Non-Final OA — Pending Jun 14, 2023
18334025 HARDWARE ACCELERATION IN A NETWORK INTERFACE DEVICE Intel Corporation NGUYEN, VAN H 2199 §102§112 Non-Final OA — Pending Jun 13, 2023
18326773 DYNAMIC HARDWARE PROFILE MODIFICATION Intel Corporation AYERS, MICHAEL W 2195 §102§103§112 Non-Final OA — Pending May 31, 2023
18325512 KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME Intel Corporation MANHEIM, MARC ETIENNE 2874 §102§103 Non-Final OA — Pending May 30, 2023
18324640 HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES Intel Corporation TURNER, BRIAN 2818 §103 Non-Final OA — Pending May 26, 2023
18323812 SOFTWARE-BASED PHYSICAL LAYER CONFIGURATION Intel Corporation PHAN, RAYMOND NGAN 2175 §101§103§112Other Non-Final OA — Pending May 25, 2023
18323521 SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE Intel Corporation MINNEY, GABRIEL SEBASTIAN 2897 §102§103 Non-Final OA — Pending May 25, 2023
18309123 APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED CIRCUITS Intel Corporation KIANNI, KAVEH C 2874 §103 Non-Final OA — Pending Apr 28, 2023
18131783 ADAPTIVE MULTIMODAL EVENT DETECTION Intel Corporation LE, PETER D 2488 §103 Final Rejection 62d Pending Apr 06, 2023
18130404 Liquid-Proof Edge Connector Designs for Immersion Cooling Intel Corporation PAUMEN, GARY F 2834 §102§103 Final Rejection — Pending Apr 03, 2023
18194147 TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES Intel Corporation SMITH, CHAD 2874 §102§103 Non-Final OA — Pending Mar 31, 2023
18126833 FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS Intel Corporation LIU, BENJAMIN T 2893 — Non-Final OA — Pending Mar 27, 2023
18189844 PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN Intel Corporation HOLLWEG, THOMAS A 2874 §102§103 Final Rejection — Pending Mar 24, 2023
18189808 ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACKSIDE MEMORY USING HIGH PERFORMANCE (HP) THIN FILM TRANSISTOR (TFT) MATERIAL Intel Corporation SALERNO, SARAH KATE 2814 §102§103 Final Rejection — Pending Mar 24, 2023
18188577 STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY Intel Corporation ANGUIANO, MICHAEL 2899 §102§103 Non-Final OA — Pending Mar 23, 2023
18188297 ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT Intel Corporation TSO, STANLEY 2847 §102§103 Non-Final OA 71d AI Ready Mar 22, 2023
18148871 FIELD EFFECT TRANSISTOR COMPRISING TRANSITION METAL DICHALCOGENIDE (TMD) AND FERROELECTRIC MATERIAL Intel Corporation ALAM, MOHAMMED R 2897 §102§103 Non-Final OA — Pending Dec 30, 2022
18091583 TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING Intel Corporation HANUMASAGAR, SHAMITA S 2814 §103 Non-Final OA — Pending Dec 30, 2022
18148355 INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES Intel Corporation IMTIAZ, S M SOHEL 2812 §103 Final Rejection — Pending Dec 29, 2022
18148240 CHIRAL COUPLING-BASED VALLEYTRONIC MAGNETOELECTRIC SPIN-ORBIT DEVICES Intel Corporation CHUNG, ANDREW 2898 §102§103 Non-Final OA — Pending Dec 29, 2022
18090420 REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS Intel Corporation VU, HUNG K 2897 §102§103§112 Non-Final OA — Pending Dec 28, 2022
18147457 ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER Intel Corporation LOHAKARE, PRATIKSHA JAYANT 2818 §102§103 Final Rejection — AI Ready Dec 28, 2022
18089801 GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES Intel Corporation ROLAND, CHRISTOPHER M 2893 — Final Rejection — AI Ready Dec 28, 2022
18089022 MECHANISM TO RECOMPOSE WORKLOAD PACKAGES IN A COMPUTING ENVIRONMENT Intel Corporation VINCENT, ROSS MICHAEL 2196 §103 Non-Final OA — AI Ready Dec 27, 2022
18083493 PROBABILISTIC AND DETERMINISTIC LOGIC DEVICES WITH REDUCED SYMMETRY MATERIALS Intel Corporation KING, DOUGLAS 2824 §103 Non-Final OA — Pending Dec 17, 2022
18066271 DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF Intel Corporation WOLCOTT, BRIAN P 3711 §102§103§112 Final Rejection 2d overdue AI Ready Dec 14, 2022
18061109 PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING Intel Corporation FREAL, JOHN BRENDAN 2847 §102§103 Final Rejection 14d AI Ready Dec 02, 2022
18061083 POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES Intel Corporation JEFFERSON, QUOVAUNDA 2899 §102§103 Final Rejection 31d overdue AI Ready Dec 02, 2022
18061126 POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES Intel Corporation JEFFERSON, QUOVAUNDA 2899 §103 Final Rejection — Pending Dec 02, 2022
18061283 INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) Intel Corporation JEAN BAPTISTE, WILNER 2899 §102§103 Final Rejection 46d AI Ready Dec 02, 2022
18061237 INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) Intel Corporation AHMADI, MOHSEN 2896 §103§112 Final Rejection — AI Ready Dec 02, 2022
17992010 REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED COMPONENT Intel Corporation ZARNEKE, DAVID A 2891 §102§103 Final Rejection — Pending Nov 22, 2022
17991811 EXECUTABLE PASSING USING MAILBOX REGISTERS Intel Corporation SPANN, COURTNEY P 2183 §103§112 Final Rejection 12d AI Ready Nov 21, 2022
17988051 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER Intel Corporation ZARNEKE, DAVID A 2891 §102§103 Final Rejection 22d AI Ready Nov 16, 2022
17958333 TECHNOLOGIES FOR ADDRESS TRANSLATION CACHE RESERVATION IN OFFLOAD DEVICES Intel Corporation TALUKDAR, ARVIND 2132 §103§112 Final Rejection — AI Ready Oct 01, 2022
17958053 METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS Intel Corporation CHEN, YU 2896 — Final Rejection 22d AI Ready Sep 30, 2022
17957953 HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS Intel Corporation HEBERT, THEODORE E 2199 §101§103 Final Rejection 4d overdue AI Ready Sep 30, 2022
17957590 INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION Intel Corporation YASMEEN, NISHATH 2811 §103 Final Rejection — AI Ready Sep 30, 2022
17951024 ARCHITECTURAL INTERFACES FOR GUEST SOFTWARE TO SUBMIT COMMANDS TO AN ADDRESS TRANSLATION CACHE IN XPUs Intel Corporation FRANKLIN, RICHARD B 2181 §103 Final Rejection — Pending Sep 22, 2022
17947071 FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES Intel Corporation AHMED, SHAHED 2813 §102 Final Rejection 16d AI Ready Sep 16, 2022
17943354 TECHNOLOGIES FOR GLASS CORE INDUCTOR Intel Corporation MCDONALD, JASON ANDREW 2898 §103§112 Final Rejection 23d AI Ready Sep 13, 2022
17871443 MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS Intel Corporation LIU, BENJAMIN T 2893 §103 Non-Final OA — Pending Jul 22, 2022
17870719 PHOTONICS INTEGRATED CIRCUIT DEVICE INCLUDING METALENS STRUCTURE AND SYSTEM INCLUDING SAME Intel Corporation ENDRESEN, KIRSTEN DANIELA 2874 §103 Non-Final OA — AI Ready Jul 21, 2022
17868557 EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE Intel Corporation MANHEIM, MARC ETIENNE 2874 §103 Final Rejection — Pending Jul 19, 2022
17856969 SUBSTRATES WITH NITRIDED GLASS CORES Intel Corporation ENAD, CHRISTINE A 2811 §103 Final Rejection — Pending Jul 02, 2022
17855568 SINX BASED SURFACE FINISH ARCHITECTURE Intel Corporation ONUTA, TIBERIU DAN 2814 §102§103 Final Rejection 49d overdue AI Ready Jun 30, 2022
17851968 LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND OPERATION OF SAME Intel Corporation WANG, NICHOLAS A 1734 §103 Final Rejection 12d AI Ready Jun 28, 2022
17849557 TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR Intel Corporation ENDRESEN, KIRSTEN DANIELA 2874 §102§103§112 Non-Final OA — Pending Jun 24, 2022
17849207 MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF Intel Corporation SIPLING, KENNETH MARK 2818 §102§103 Final Rejection 28d AI Ready Jun 24, 2022
17841451 PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING Intel Corporation MANHEIM, MARC ETIENNE 2874 — Non-Final OA — Pending Jun 15, 2022
17833650 GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Intel Corporation ZARNEKE, DAVID A 2891 §102§103§112 Non-Final OA 78d AI Ready Jun 06, 2022
17833648 GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS Intel Corporation ZARNEKE, DAVID A 2891 §102§103 Final Rejection — AI Ready Jun 06, 2022
17711978 MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME Intel Corporation MUNOZ, ANDRES F 2818 §102§103 Final Rejection 77d overdue AI Ready Apr 01, 2022
17711671 PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS Intel Corporation CHAVEZ, RENEE D 2186 §101§102 Final Rejection 5d AI Ready Apr 01, 2022
17710584 VERTICAL BIT DATA PATHS FOR INTEGRATED CIRCUITS Intel Corporation MARUF, SHEIKH 2897 §103 Final Rejection 70d overdue AI Ready Mar 31, 2022
17710556 TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS Intel Corporation MOJADDEDI, OMAR F 2898 — Final Rejection — Pending Mar 31, 2022
17707366 THIN CLIENT FORM FACTOR ASSEMBLY Intel Corporation TRAN, THANH Y 2817 §103 Non-Final OA 14d AI Ready Mar 29, 2022
17698928 PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX Intel Corporation SYLVIA, CHRISTINA A 2817 §103 Final Rejection 30d AI Ready Mar 18, 2022
17688495 INTERCONNECTS WITH SPINTRONIC LOGIC DEVICES Intel Corporation RAHIM, NILUFA 2893 §102§103 Final Rejection — Pending Mar 07, 2022
17561463 TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING Intel Corporation PILLAY, DEVINA 1726 §102§103 Final Rejection 73d overdue AI Ready Dec 23, 2021
17528733 MULTI-LAYER INTERCONNECT COMPRISING LOW RESISTIVITY FIRST METAL LAYER BETWEEN SECOND METAL LAYER AND THIS METAL LAYER Intel Corporation MALSAWMA, LALRINFAMKIM HMAR 2892 §103 Final Rejection — Pending Nov 17, 2021
17484213 CONFORMAL POWER DELIVERY STRUCTURES Intel Corporation PRASAD, NEIL R 2897 §102§103 Non-Final OA — Pending Sep 24, 2021
17480168 PREDICTIVE ANALYTICS MODEL MANAGEMENT USING COLLABORATIVE FILTERING Intel Corporation PARK, GRACE A 2144 §102§103§112 Final Rejection 14d AI Ready Sep 21, 2021
17343280 TECHNOLOGIES FOR PHOTONIC DEMULTIPLEXERS Intel Corporation CONNELLY, MICHELLE R 2874 §103 Final Rejection 74d overdue AI Ready Jun 09, 2021
17076776 DYNAMIC NETWORK CONTROLLER POWER MANAGEMENT Intel Corporation YEN, PAUL JUEI-FU 2175 §103 Final Rejection 2d overdue AI Ready Oct 21, 2020

Data sourced from USPTO Patent File Wrapper (daily) and Office Action Archive (weekly). Analysis generated by IP Author.

Data: USPTO Patent File Wrapper (daily) • Office Action Archive (weekly) • 89M+ prosecution events

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