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| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19303520 | AUTOMATIC POOL CLEANING DEVICE AND ITS CONTROLLING METHOD | Aiper Global Pte. Ltd. | ALAM, NAEEM TASLIM | 3668 | §102§103 | Non-Final OA | — | Pending | Aug 19, 2025 |
| 19243074 | THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | TAN, DAVE | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 19, 2025 |
| 19209878 | ELECTRONIC DEVICE AND METHOD FOR RESTORING A STATE OF AN INTEGRATED CIRCUIT | Infineon Technologies AG | JACKSON, JAYLUN ARMAN | 2112 | §103 | Non-Final OA | — | Pending | May 16, 2025 |
| 19093485 | DOOR PROTECTION DEVICE | Waspw, LLC | MENEZES, MARCUS | 3634 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2025 |
| 19089118 | PROTECTION OF AI MODELS | Infineon Technologies AG | SRIRAM, ADITYA | 2491 | §101§103§112 | Non-Final OA | — | Pending | Mar 25, 2025 |
| 19073656 | POWER/AREA EFFICIENT ACCELERATION OF PROCESSOR-BASED ARTIFICIAL NEURAL NETWORK COMPUTATION | Infineon Technologies AG | SADLER, NATHAN | 2139 | §103DP | Final Rejection | — | Pending | Mar 07, 2025 |
| 19063918 | LOW-TEMPERATURE VAPORIZER FOR ION IMPLANTER WITH IN-VACUUM CONTROLLED FLOW | Axcelis Technologies, Inc. | CHEN, KEATH T | 1716 | §103 | Final Rejection | 132d overdue | Pending | Feb 26, 2025 |
| 19105161 | FEEDER POLE APPARATUS, METHOD OF USE AND MANUFACTURE THEREOF | Innovative Blasting Technologies Pty Ltd. | CULLER, JILL E | §103 | Non-Final OA | — | Pending | Feb 20, 2025 | |
| 19058173 | RESOLVING A HARDWARE FAULT OCCURRENCE IN A MULTI-DOMAIN DEVICE | Infineon Technologies AG | RUSIN, KAYO LISA | 2114 | §102§103 | Non-Final OA | — | Pending | Feb 20, 2025 |
| 19099902 | STORAGE STABLE MICROBIAL COMPOSITION | Lanbiotic GmbH | ROBINSON, HOPE A | 1652 | §112 | Non-Final OA | — | Pending | Jan 30, 2025 |
| 19027128 | SYSTEM AND METHOD FOR HANDLING DIGITAL CONTENT GOVERNANCE IN AN ORGANIZATION | Hyland UK Operations Limited | LE, UYEN T | 2156 | §101§103§112 | Non-Final OA | 30d overdue | Pending | Jan 17, 2025 |
| 19028479 | PERMISSIONS-CONSTRAINED DYNAMIC FACETING OF SEARCH RESULTS IN A CONTENT MANAGEMENT SYSTEM | Hyland UK Operations Limited | WILLOUGHBY, ALICIA M | 2156 | §103Other | Non-Final OA | 33d | Pending | Jan 17, 2025 |
| 18981800 | MEMORY CELL WITH UNIPOLAR SELECTORS | Taiwan Semiconductor Manufacturing Company, Ltd. | LAPPAS, JASON | 2827 | §103 | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18980276 | WAFER ALIGNMENT, CLEANLINESS, AND SURFACE QUALITY VERIFICATION USING LASER LIGHT SCATTERING | Axcelis Technologies, Inc. | STOCK JR, GORDON J | 2877 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2024 |
| 18969428 | IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT | Taiwan Semiconductor Manufacturing Company, Ltd. | SOHN, SEUNG C | 2878 | §112 | Non-Final OA | — | Pending | Dec 05, 2024 |
| 18950296 | APPLICATION OF SECURITY PARAMETERS FOR CONTENT | Hyland UK Operations Limited | CHOY, KA SHAN | 2435 | §103 | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18935391 | MULTI-CHANNEL CONTROL SYSTEM FOR CONTROLLING PLURALITY OF SMART WINDOWS | Gooil Solution Co., Ltd. | WILSON, PAISLEY L | 2871 | §102§112 | Non-Final OA | — | Pending | Nov 01, 2024 |
| 18921069 | FeRAM MFM STRUCTURE WITH SELECTIVE ELECTRODE ETCH | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, ERIC A | §103 | Non-Final OA | — | Pending | Oct 21, 2024 | |
| 18919483 | APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING | Axcelis Technologies, Inc. | LOGIE, MICHAEL J | 2881 | §103§112 | Final Rejection | 34d | Pending | Oct 18, 2024 |
| 18918276 | DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM | Axcelis Technologies, Inc. | MENDOZA, ALEXANDRIA ARELLANO | 2877 | §102§103§112 | Non-Final OA | 42d | Pending | Oct 17, 2024 |
| 18901408 | MEDICAL ANALYSIS USING SPATIOTEMPORAL ANALYSIS AND TRANSFORMER-BASED MODELS | Emory University | HUYNH, VAN D | 2665 | §102§103 | Non-Final OA | — | Pending | Sep 30, 2024 |
| 18783997 | STOPPER BUMP STRUCTURES FOR MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | WATTS, JEREMY DANIEL | 2897 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783569 | CAPACITOR DEVICE WITH SELF ALIGNED SPACER | Taiwan Semiconductor Manufacturing Company, Ltd. | DIAZ, JOSE R | 2815 | §102§103DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784638 | NOVEL MIM STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | PAGE, STEVEN MITCHELL CHR | 2812 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783538 | HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783574 | DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | HOSSAIN, MOAZZAM | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783824 | BOND PAD WITH ENHANCED RELIABILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | DIALLO, MAMADOU L | 2897 | §102 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18784428 | INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Co., Ltd. | VU, HUNG K | 2897 | §112DP | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18783529 | BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18782439 | HIGH ASPECT RATIO BOSCH DEEP ETCH | Taiwan Semiconductor Manufacturing Company, Ltd. | CHAMBLISS, ALONZO | 2897 | §102DP | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782159 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §102 | Non-Final OA | — | Pending | Jul 24, 2024 |
| 18782291 | INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | AU, BAC H | §103Other | Non-Final OA | — | Pending | Jul 24, 2024 | |
| 18780959 | SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | BRASFIELD, QUINTON A | 2814 | §103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18781081 | BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KLEIN, JORDAN M | 2893 | DP | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 23, 2024 |
| 18779180 | CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE | Taiwan Semiconductor Manufacturing Company, Ltd. | ENDRESEN, KIRSTEN DANIELA | 2874 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779252 | STILTED PAD STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | VU, DAVID | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779844 | DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS | Taiwan Semiconductor Manufacturing Company, Ltd. | SARKER-NAG, AKHEE | 2893 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779188 | IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | ROLAND, CHRISTOPHER M | 2893 | §103 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779221 | METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES | Taiwan Semiconductor Manufacturing Company, Ltd. | LEE, ALVIN LYNGHI | 2813 | §102§103§112 | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18779305 | DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE | Taiwan Semiconductor Manufacturing Company, Ltd. | WARD, ERIC A | 2891 | §102§103§112Other | Non-Final OA | — | Pending | Jul 22, 2024 |
| 18778990 | SPACER SCHEME AND METHOD FOR MRAM | Taiwan Semiconductor Manufacturing Company, Ltd. | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778989 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | MICHAUD, NICHOLAS BRIAN | 2818 | §103§112 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18778985 | CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Jul 21, 2024 |
| 18777885 | CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CRITE, ANTONIO B | §102 | Non-Final OA | — | Pending | Jul 19, 2024 | |
| 18778189 | SONAR SENSOR IN PROCESSING CHAMBER | Taiwan Semiconductor Manufacturing Company, Ltd. | OH, JAEHWAN | 2899 | DP | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18777807 | STRAP TECHNOLOGY TO IMPROVE ESD HBM PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | ZHU, SHENG-BAI | 2897 | §103 | Non-Final OA | — | Pending | Jul 19, 2024 |
| 18776416 | 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | GEBREMARIAM, SAMUEL A | 2811 | §112 | Non-Final OA | — | Pending | Jul 18, 2024 |
| 18774988 | METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICONDUCTOR SUBSTRATE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHIU, TSZ K | 2898 | §102§103 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775130 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | Taiwan Semiconductor Manufacturing Company, Ltd. | CLINTON, EVAN GARRETT | 2899 | §102 | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18775100 | WAFER LEVEL IMAGE SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | CROSS, XIA L | 2892 | §102Other | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18772364 | CAPPING LAYER OVER FET FERAM TO INCREASE CHARGE MOBILITY | Taiwan Semiconductor Manufacturing Company, Ltd. | DIAZ, JOSE R | 2815 | §102DP | Non-Final OA | — | Pending | Jul 15, 2024 |
| 18771095 | BACKSIDE STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | DP | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18769807 | STACKED SEMICONDUCTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DAO H | 2818 | §112 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18765738 | IMAGE SENSOR WITH PHOTOSENSITIVITY ENHANCEMENT REGION | Taiwan Semiconductor Manufacturing Company, Ltd. | RODELA, EDUARDO A | 2893 | §103 | Non-Final OA | — | Pending | Jul 08, 2024 |
| 18763239 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | BERNSTEIN, ALLISON | Other | Non-Final OA | — | Pending | Jul 03, 2024 | |
| 18757663 | PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MORE VAPOR CHAMBERS OVER IC CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | HO, TU TU V | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18754706 | BACKSIDE CAPACITOR TECHNIQUES | Taiwan Semiconductor Manufacturing Company, Ltd. | GREEN, TELLY D | 2898 | §103Other | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753075 | CROSS-ENTERPRISE DOCUMENT SHARING (XDS) METADATA MORPHING | Hyland Software, Inc. | HAMILTON, MATTHEW L | 3682 | §101 | Final Rejection | 16d | Pending | Jun 25, 2024 |
| 18749921 | IMAGE SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SEDOROOK, DAVID PAUL | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | May 31, 2024 |
| 18676841 | PIXEL ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KLEIN, JORDAN M | 2893 | §102§103 | Non-Final OA | — | Pending | May 29, 2024 |
| 18673792 | SEMICONDUCTOR ISOLATION STRUCTURE FOR INJECTION SUPPRESSION AND METHOD OF MAKING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | RAMIREZ, ALEXANDRE XAVIER | 2812 | §102§103 | Non-Final OA | — | Pending | May 24, 2024 |
| 18665716 | SUBMERSIBLE PUMP GAUGE WITH DOWNHOLE ANALYSIS CAPABILITY | Grc Technologies LLC | HARCOURT, BRAD | 3674 | §103 | Final Rejection | 49d | Pending | May 16, 2024 |
| 18664402 | RING STRUCTURE FOR FILM RESISTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102§103§112 | Non-Final OA | — | Pending | May 15, 2024 |
| 18659143 | AMPLIFIER CIRCUITS | Infineon Technologies AG | MARANO, NATASHA YOLANDA | 2843 | §103 | Non-Final OA | — | Pending | May 09, 2024 |
| 18651752 | RISK PREDICTION OF HEART FAILURE | UNIVERSITY HOSPITALS CLEVELAND MEDICAL CENTER | GEBRESLASSIE, WINTA | 2677 | §103 | Final Rejection | — | Pending | May 01, 2024 |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102Other | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18644209 | CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | GEYER, SCOTT B | 2812 | §102 | Non-Final OA | — | Pending | Apr 24, 2024 |
| 18642897 | GAIN-CELL RANDOM ACCESS MEMORY WITH ENHANCED RETENTION | Taiwan Semiconductor Manufacturing Company, Ltd. | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18635478 | TAPERED LIGHT ABSORPTION STRUCTURE FOR INTEGRATED CIRCUIT PHOTODETECTOR | Taiwan Semiconductor Manufacturing Company, Ltd. | SMITH, CHAD | 2874 | §102 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18635103 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | WEILAND, ADAM DAVID | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18632132 | NOVEL RESISTIVE RANDOM ACCESS MEMORY DEVICE | Taiwan Semiconductor Manufacturing Co., Ltd. | TURNER, BRIAN | 2818 | DP | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18630307 | SEMICONDUCTOR WAVEGUIDE HEATER WITH HEATER CONTACTS | Taiwan Semiconductor Manufacturing Company, Ltd. | BLEVINS, JERRY M | 2874 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630021 | SEMICONDUCTOR DEVICE WITH IMPROVED DEVICE PERFORMANCE | Taiwan Semiconductor Manufacturing Company, Ltd. | KOO, LAMONT B | 2813 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18619632 | GATE STRUCTURE DISPOSED BETWEEN FIN STRUCTURES TO DECREASE LEAKAGE IN GAIN CELL RANDOM ACCESS MEMORY (GCRAM) | Taiwan Semiconductor Manufacturing Company, Ltd. | PARVEZ, AZM A | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2024 | |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | DINKE, BITEW A | 2812 | §103 | Final Rejection | — | Pending | Mar 27, 2024 |
| 18603629 | IMAGE SENSORS AND METHOD OF MANUFACTURING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TRANG Q | 2811 | §102§112 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603729 | VIA STRUCTURE FOR MULTI-STACKED CHIPS | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18597045 | INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING | Taiwan Semiconductor Manufacturing Company, Ltd. | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597086 | CONSOLIDATION OF INTERRUPT LOST EVENTS IN MULTI-LEVEL INTERRUPT SYSTEM | Infineon Technologies AG | MAMO, ELIAS | 2184 | §101§102 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18591047 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | Taiwan Semiconductor Manufacturing Company, Ltd. | BOOTH, RICHARD A | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18591282 | IC STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER ON SEMICONDUCTOR DEVICES | Taiwan Semiconductor Manufacturing Company, Ltd. | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | Taiwan Semiconductor Manufacturing Company, Ltd. | ENAD, CHRISTINE A | 2811 | §103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18582781 | PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | CAMPBELL, SHAUN M | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 21, 2024 |
| 18444896 | IMAGE SENSOR AND METHOD OF MANUFACTURING IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | HOSSAIN, MOAZZAM | 2898 | §103 | Non-Final OA | — | Pending | Feb 19, 2024 |
| 18442381 | HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | GUPTA, RAJ R | 2893 | §102§103 | Non-Final OA | — | Pending | Feb 15, 2024 |
| 18438538 | DUAL DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | WEGNER, AARON MICHAEL | 2897 | §102§103 | Non-Final OA | — | Pending | Feb 12, 2024 |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | LIU, BENJAMIN T | 2893 | §103 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18432197 | INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHOUDHRY, MOHAMMAD M | 2899 | §103 | Non-Final OA | — | Pending | Feb 05, 2024 |
| 18423616 | INTEGRATED CHIP AND METHOD OF FORMING THEREOF | Taiwan Semiconductor Manufacturing Company, Ltd. | SANDVIK, BENJAMIN P | 2812 | §103 | Final Rejection | — | Pending | Jan 26, 2024 |
| 18407705 | RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | TUTTLE, ETHAN ALEXANDER | 2897 | §102§103§112 | Non-Final OA | — | Pending | Jan 09, 2024 |
| 18406678 | COMPUTING SYSTEM FOR CONFIGURABLE OFF-CHAIN STORAGE FOR BLOCKCHAINS | Hyland Software, Inc. | NILFOROUSH, MOHAMMAD A | 3697 | §101§112 | Non-Final OA | — | Pending | Jan 08, 2024 |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Taiwan Semiconductor Manufacturing Company, Ltd. | CHANG, JAY C | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18396810 | METHOD FOR THE STARTING OF AN ELECTROLYSIS SYSTEM, AND ELECTROLYSIS SYSTEM FOR CARRYING OUT THE METHOD | Sunfire SE | WONG, EDNA | 1795 | §103§112 | Non-Final OA | — | Pending | Dec 27, 2023 |
| 18395841 | IMAGE SENSORS AND METHODS OF MANUFACTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | 55d | Pending | Dec 26, 2023 |
| 18545231 | PREDICTING NEO-ADJUVANT CHEMOTHERAPY RESPONSE FROM PRE-TREATMENT BREAST MAGNETIC RESONANCE IMAGING USING ARTIFICIAL INTELLIGENCE AND HER2 STATUS | Case Western Reserve University | LIU, GUOZHEN | 1686 | §101§103 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18500423 | OPTICAL COUPLING DEVICE WITH DUST TRAP | Raylase GmbH | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Final Rejection | 29d | Pending | Nov 02, 2023 |
| 18486211 | INTEGRATED PROCESS FLOW FOR SENSOR PACKAGE | Taiwan Semiconductor Manufacturing Company, Ltd. | GALVAN, ANGELICA ROS ESTIGOY | 2815 | §102§112 | Non-Final OA | — | Pending | Oct 13, 2023 |
| 18460208 | CONTACT RESISTANCE MEASUREMENT METHOD | Infineon Technologies AG | MARINI, MATTHEW G | 2853 | §103 | Final Rejection | 7d | Pending | Sep 01, 2023 |
| 18366776 | REDUCED CROSS-TALK IN COLOR AND INFRARED IMAGE SENSOR | Taiwan Semiconductor Manufacturing Company, Ltd. | KIM, JAHAE | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 08, 2023 |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | PARKER, JOHN M | 2899 | §103 | Non-Final OA | 3d overdue | Pending | Jul 24, 2023 |
| 18261289 | AIR-FLOW APPARATUS | Sandrier GmbH | LAU, JASON | 3762 | §103 | Non-Final OA | 23d overdue | Pending | Jul 13, 2023 |
| 18346544 | MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE | Taiwan Semiconductor Manufacturing Company, Ltd. | BELOUSOV, ALEXANDER | 2818 | §103 | Final Rejection | 14d | Pending | Jul 03, 2023 |
| 18345008 | RESOURCE PROTECTION | Infineon Technologies AG | ELAHIAN, DANIEL | 2407 | §103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18323553 | COMBINATION OF RADIOMIC AND PATHOMIC FEATURES IN THE PREDICTION OF PROGNOSES FOR TUMORS | Case Western Reserve University | BURKE, TIONNA M | 2178 | §101§102§103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18321268 | PIEZOELECTRIC DEVICE HAVING PIEZOELECTRIC STRUCTURE DISPOSED BETWEEN PATTERNED CONDUCTIVE STRUCTURES | Taiwan Semiconductor Manufacturing Company, Ltd. | NGUYEN, DONGHAI D | 3729 | §102§103 | Non-Final OA | — | Pending | May 22, 2023 |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | §102§112 | Non-Final OA | — | Pending | May 22, 2023 |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | CHEN, JACK S J | 2893 | §102§103§112 | Non-Final OA | — | Pending | May 12, 2023 |
| 18302972 | OPTICAL DIGITAL-TO-ANALOG CONVERTER | Taiwan Semiconductor Manufacturing Company, Ltd. | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §103 | Non-Final OA | — | Pending | Apr 19, 2023 |
| 18300513 | METAL ISOLATION TESTING IN THE CONTEXT OF MEMORY CELLS | Taiwan Semiconductor Manufacturing Company, Ltd. | PARIHAR, SUCHIN | 2851 | §112 | Non-Final OA | — | Pending | Apr 14, 2023 |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Taiwan Semiconductor Manufacturing Company, Ltd. | RODRIGUEZ VILLANU, SANDRA MILENA | 2898 | §103§112 | Final Rejection | 8d | Pending | Feb 16, 2023 |
| 17918920 | CUT-IN-SAFE ADAPTIVE CRUISE CONTROL SYSTEM FOR VEHICLES | Technische Universitaet Muenchen | MCCULLERS, AARON KYLE | 3663 | §103 | Final Rejection | — | Pending | Oct 14, 2022 |
| 17872351 | SYSTEMS, METHODS, AND DEVICES FOR A DYNAMICALLY MANAGEABLE QR DRIVEN INFORMATION PLATFORM | Godocent Inc. | OSMAN BILAL AHMED, AFAF | 3622 | §101§112 | Final Rejection | — | Pending | Jul 25, 2022 |
| 17866924 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Company, Ltd. | LIN, JOHN | 2815 | §103§112 | Final Rejection | — | Pending | Jul 18, 2022 |
| 17750746 | BOND ROUTING STRUCTURE FOR STACKED WAFERS | Taiwan Semiconductor Manufacturing Company, Ltd. | SON, ERIKA HEERA | 2893 | §103§112 | Non-Final OA | 18d overdue | Pending | May 23, 2022 |
| 17570710 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION | Taiwan Semiconductor Manufacturing Company, Ltd. | TRAN, TRANG Q | 2811 | §102§103 | Non-Final OA | — | Pending | Jan 07, 2022 |
| 17393619 | VIA RAIL SOLUTION FOR HIGH POWER ELECTROMIGRATION | Taiwan Semiconductor Manufacturing Company, Ltd. | LIN, JOHN | 2815 | §103§112 | Non-Final OA | 72d overdue | Pending | Aug 04, 2021 |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | Taiwan Semiconductor Manufacturing Co., Ltd. | WOLDEGEORGIS, ERMIAS T | 2893 | §103 | Final Rejection | 4d overdue | Pending | Jun 04, 2021 |
| 17210938 | INVERTER WITH A HOUSING HAVING A COOLING UNIT | Sma Solar Technology AG | RALIS, STEPHEN J | 3992 | §103§112 | Final Rejection | 175d overdue | Pending | Mar 24, 2021 |
| 16525978 | METAL FILAMENT VIAS FOR INTERCONNECT STRUCTURE | Taiwan Semiconductor Manufacturing Co., Ltd. | LIN, JOHN | 2815 | §103§112 | Non-Final OA | — | Pending | Jul 30, 2019 |
