15 pending office actions • 11 art units • 15 examiners • 0 of 15 (0%) have an AI response strategy ready • 43 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 14 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 14 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 2 (13%) |
| §103 only | 11 (73%) |
| §112 only | 2 (13%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| COCHRAN, BRIANNA RENAE | 1 | 50.0% | +0.0% |
| DU, HAIXIA | 1 | 86.4% | +18.1% |
| SREEVATSA, SREEYA | 1 | 85.6% | +3.5% |
| NGUYEN, SANG H | 1 | 88.6% | +11.8% |
| LI, RUIPING | 1 | 77.1% | +18.5% |
| DIGUGLIELMO, DANIELLA MARIE | 1 | 81.0% | +25.9% |
| SHEN, QUN | 1 | 76.2% | +38.4% |
| RIZVI, AKBAR HASSAN | 1 | 87.7% | +14.9% |
| SMITH, DAVID E | 1 | 84.9% | +7.3% |
| TON, TRI T | 1 | 86.4% | +11.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18510505 | VACUUM CHUCK FOR HIGH WARPAGE WAFERS | TON, TRI T | 142d overdue |
| 18749474 | HYBRID VACUUM ELECTROSTATIC CHUCK CARRIER FOR HIGH WARPAGE WAFERS | SREEVATSA, SREEYA | 8d overdue |
| 18754131 | ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE | DU, HAIXIA | 12d |
| 18528737 | CALIBRATION OF AN EXAMINATION SYSTEM | SMITH, DAVID E | 19d |
| 18391562 | MIRROR-BASED RELAY FOR AN OPTICAL INSPECTION SYSTEM | RIZVI, AKBAR HASSAN | 28d |
| 18610135 | CALIBRATION OF THE TILT ANGLE OF AN INCIDENT BEAM OF AN EXAMINATION SYSTEM | NGUYEN, SANG H | 47d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18411009 | DETERMINATION OF UNDERCUT SIDEWALLS BASED ON AN IMAGE OF A SEMICONDUCTOR SPECIMEN | DIGUGLIELMO, DANIELLA MARIE | 6d |
| 18582549 | REGISTRATION BETWEEN AN INSPECTION IMAGE AND A DESIGN IMAGE | LI, RUIPING | 7d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18510505 | VACUUM CHUCK FOR HIGH WARPAGE WAFERS | TON, TRI T | 142d overdue |
| 18411009 | DETERMINATION OF UNDERCUT SIDEWALLS BASED ON AN IMAGE OF A SEMICONDUCTOR SPECIMEN | DIGUGLIELMO, DANIELLA MARIE | 6d |
| 18582549 | REGISTRATION BETWEEN AN INSPECTION IMAGE AND A DESIGN IMAGE | LI, RUIPING | 7d |
| 18754131 | ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE | DU, HAIXIA | 12d |
| 18393570 | CROSSTALK CORRECTION FOR IMAGES OF SEMICONDUCTOR SPECIMENS | SHEN, QUN | 15d |
| 18391562 | MIRROR-BASED RELAY FOR AN OPTICAL INSPECTION SYSTEM | RIZVI, AKBAR HASSAN | 28d |
| 18610135 | CALIBRATION OF THE TILT ANGLE OF AN INCIDENT BEAM OF AN EXAMINATION SYSTEM | NGUYEN, SANG H | 47d |
| Art Unit | Apps |
|---|---|
| 2877 | 3 |
| 2881 | 2 |
| 2857 | 2 |
| 2615 | 1 |
| 2611 | 1 |
| 2838 | 1 |
| 2676 | 1 |
| 2666 | 1 |
| 2662 | 1 |
| 2872 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18774820 | AN ARTIFICIAL INTELLIGENCE BASED METHOD FOR PRESENTING DATA RELATED TO DEFECTS DISCOVERED BY AN INSPECTION SYSTEM | COCHRAN, BRIANNA RENAE | 2615 | §103 | Non-Final OA | 26d | Pending | Jul 16, 2024 |
| 18754131 | ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE | DU, HAIXIA | 2611 | §112 | Non-Final OA | 12d | Pending | Jun 25, 2024 |
| 18749474 | HYBRID VACUUM ELECTROSTATIC CHUCK CARRIER FOR HIGH WARPAGE WAFERS | SREEVATSA, SREEYA | 2838 | §103 | Non-Final OA | 8d overdue | Pending | Jun 20, 2024 |
| 18610135 | CALIBRATION OF THE TILT ANGLE OF AN INCIDENT BEAM OF AN EXAMINATION SYSTEM | NGUYEN, SANG H | 2877 | §103 | Non-Final OA | 47d | Pending | Mar 19, 2024 |
| 18582549 | REGISTRATION BETWEEN AN INSPECTION IMAGE AND A DESIGN IMAGE | LI, RUIPING | 2676 | §101 | Non-Final OA | 7d | Pending | Feb 20, 2024 |
| 18411009 | DETERMINATION OF UNDERCUT SIDEWALLS BASED ON AN IMAGE OF A SEMICONDUCTOR SPECIMEN | DIGUGLIELMO, DANIELLA MARIE | 2666 | §101 | Non-Final OA | 6d | Pending | Jan 11, 2024 |
| 18393570 | CROSSTALK CORRECTION FOR IMAGES OF SEMICONDUCTOR SPECIMENS | SHEN, QUN | 2662 | §103 | Final Rejection | 15d | Pending | Dec 21, 2023 |
| 18391562 | MIRROR-BASED RELAY FOR AN OPTICAL INSPECTION SYSTEM | RIZVI, AKBAR HASSAN | 2877 | §103 | Final Rejection | 28d | Pending | Dec 20, 2023 |
| 18528737 | CALIBRATION OF AN EXAMINATION SYSTEM | SMITH, DAVID E | 2881 | §103 | Non-Final OA | 19d | Pending | Dec 04, 2023 |
| 18510505 | VACUUM CHUCK FOR HIGH WARPAGE WAFERS | TON, TRI T | 2877 | §103 | Final Rejection | 142d overdue | Pending | Nov 15, 2023 |
| 18485308 | AUTOMATIC CALIBRATION OF AN EXAMINATION TOOL | SAUNCY, TONI DIAN | 2857 | §103 | Non-Final OA | 40d | Pending | Oct 11, 2023 |
| 18237854 | NON-DESTRUCTIVE SEM-BASED DEPTH-PROFILING OF SAMPLES | GASSEN, CHRISTOPHER J | 2881 | §103 | Non-Final OA | 80d overdue | Pending | Aug 24, 2023 |
| 18231567 | DEPTH-PROFILING OF SAMPLES BASED ON X-RAY MEASUREMENTS | DALBO, MICHAEL J | 2857 | §103 | Non-Final OA | 22d | Pending | Aug 08, 2023 |
| 18112876 | METHODS AND SYSTEMS FOR MICROSCOPY | NGUYEN, THONG Q | 2872 | §112 | Non-Final OA | 12d | Pending | Feb 22, 2023 |
| 17950960 | ENHANCED DEPOSITION RATE BY APPLYING A NEGATIVE VOLTAGE TO A GAS INJECTION NOZZLE IN FIB SYSTEMS | LAW, NGA LEUNG V | 1717 | §103 | Final Rejection | — | Pending | Sep 22, 2022 |
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