Tech Center 2800 • Art Units: 2814
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396813 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18209820 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17931828 | Zinc Layer For A Semiconductor Die Pillar | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18751362 | METHOD OF FORMING SEMICONDUCTOR PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18361118 | Semiconductor Device Package with Coupled Substrates | Non-Final OA | Western Digital Technologies, Inc. |
| 17477323 | GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE | Final Rejection | Intel Corporation |
| 18335532 | SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 18335334 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
| 17680890 | SEMICONDUCTOR DEVICE HAVING AN OXIDE SEMICONDUCTING CHANNEL LAYER AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18355472 | VERTICAL ORIENTED SEMICONDUCTOR DEVICE COMPRISING WELL REGIONS HAVING A LATERAL DOPING GRADIENT WITH MONOTONIC DECREASING DOPING CONCENTRATION, AS WELL AS A CORRESPONDING METHOD OF MANUFACTURING SUCH A VERTICAL ORIENTED SEMICONDUCTOR DEVICE | Final Rejection | NEXPERIA B.V. |
| 18522040 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Renesas Electronics Corporation |
| 18215685 | HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK | Non-Final OA | XILINX, INC. |
| 18083763 | SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR DIE AND A GATE DRIVER SEMICONDUCTOR DIE, AND METHOD OF PRODUCING THE SEMICONDUCTOR PACKAGE | Final Rejection | Infineon Technologies Austria AG |
| 18346457 | PACKAGE MODULE INCLUDING AN INTERPOSER WITH A DUMMY VIA, PACKAGE STRUCTURE INCLUDING THE PACKAGE MODULE AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18303409 | ELECTRICAL CONNECTION AND ITS METHOD OF FABRICATION | Final Rejection | STMicroelectronics (Crolles 2) SAS |
| 18387697 | ANTI-STICTION LAYER DEPOSITION | Non-Final OA | SPTS Technologies Limited |
| 18239100 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | Final Rejection | Fujian Jinhua Integrated Circuit Co., Ltd. |
| 17041689 | METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A SEMICONDUCTOR POWER MODULE WITH SUCH A MODULE COMPONENT AND MANUFACTURING SYSTEM THEREFOR | Non-Final OA | Danfoss Silicon Power GmbH |
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