Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18361118 | Semiconductor Device Package with Coupled Substrates | Non-Final OA | Western Digital Technologies, Inc. |
| 17709360 | BARRIERS TO MODULATE UNDERFILL FLOW | Final Rejection | Intel Corporation |
| 17477323 | GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHITECTURE | Final Rejection | Intel Corporation |
| 17680890 | SEMICONDUCTOR DEVICE HAVING AN OXIDE SEMICONDUCTING CHANNEL LAYER AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18215685 | HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK | Non-Final OA | XILINX, INC. |
| 18083763 | SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR DIE AND A GATE DRIVER SEMICONDUCTOR DIE, AND METHOD OF PRODUCING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Infineon Technologies Austria AG |
| 18303409 | ELECTRICAL CONNECTION AND ITS METHOD OF FABRICATION | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18387697 | ANTI-STICTION LAYER DEPOSITION | Non-Final OA | SPTS Technologies Limited |
| 17041689 | METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A SEMICONDUCTOR POWER MODULE WITH SUCH A MODULE COMPONENT AND MANUFACTURING SYSTEM THEREFOR | Non-Final OA | Danfoss Silicon Power GmbH |
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