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Last updated: August 17, 2026

Examiner: BRASFIELD, QUINTON A

Tech Center 2800 • Art Units: 2814

This examiner grants 72% of resolved cases

Performance Statistics

72.1%

Allow Rate

+4.1% vs TC avg

470

Total Applications

+17.6%

Interview Lift

1045

Avg Prosecution Days

Based on 448 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%

§101 Eligibility

14.1%

§102 Novelty

72.5%

§103 Obviousness

12.7%

§112 Clarity

Currently Pending Office Actions

App #	Title	Status	Assignee
18638205	INTEGRATED CIRCUIT DEVICE	Non-Final OA	Samsung Electronics Co., Ltd.
18444874	INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME	Non-Final OA	Samsung Electronics Co., Ltd.
18424222	DISPLAY DEVICE HAVING PERPENDICULAR ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE	Non-Final OA	SAMSUNG ELECTRONICS CO., LTD.
18335532	SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES	Final Rejection	QUALCOMM Incorporated
18309642	EFFICIENT REDISTRIBUTION LAYER TOPOLOGY FOR HIGH-POWER SEMICONDUCTOR PACKAGES	Non-Final OA	TEXAS INSTRUMENTS INCORPORATED
17931828	Zinc Layer For A Semiconductor Die Pillar	Final Rejection	TEXAS INSTRUMENTS INCORPORATED
18424713	METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS	Non-Final OA	Micron Technology, Inc.
18335334	SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD	Non-Final OA	Kioxia Corporation
18466929	SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF	Non-Final OA	Infineon Technologies AG
18083763	SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR DIE AND A GATE DRIVER SEMICONDUCTOR DIE, AND METHOD OF PRODUCING THE SEMICONDUCTOR PACKAGE	Non-Final OA	Infineon Technologies Austria AG
18303409	ELECTRICAL CONNECTION AND ITS METHOD OF FABRICATION	Non-Final OA	STMicroelectronics (Crolles 2) SAS
18542704	DRIVING BACKPLANE AND DISPLAY PANEL	Non-Final OA	Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
18522040	METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE	Final Rejection	Renesas Electronics Corporation
18215685	HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK	Final Rejection	XILINX, INC.
18617852	SEMICONDUCTOR STRUCTURE FOR 3D MEMORY AND MANUFACTURING METHOD THEREOF	Non-Final OA	MACRONIX International Co., Ltd.

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