Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 72% of resolved cases
Quinton A. Brasfield, an examiner in Tech Center 2800, has resolved 450 cases. His allowance rate pct of 72.2% in Art Unit 2814 is quite high, suggesting a favorable environment for applicants. The median days to allowance is 1046, which is a standard duration for the prosecution process in this technical area.
The interview lift pct of 17.2 indicates that interviews are a productive way to resolve issues and move applications toward a grant. While the 72.2% allowance rate is already strong, the 17.2% lift shows that direct communication remains a valuable strategy. With 450 resolved cases, the data is robust and provides a reliable basis for planning. Practitioners should account for the 1046-day median timeline and use interviews as a tactical tool to ensure the best possible outcome for their clients.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18892965 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18816215 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18799579 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18659864 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18444874 | INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM HAVING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18424222 | DISPLAY DEVICE HAVING PERPENDICULAR ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18733914 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18599269 | MOTHERBOARD FOR DISPLAY DEVICE AND DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18335532 | SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES | Final Rejection | QUALCOMM Incorporated |
| 17709360 | BARRIERS TO MODULATE UNDERFILL FLOW | Non-Final OA | Intel Corporation |
| 18361118 | Semiconductor Device Package with Coupled Substrates | Final Rejection | Western Digital Technologies, Inc. |
| 18470655 | BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18466929 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF | Non-Final OA | Infineon Technologies AG |
| 17931828 | Zinc Layer For A Semiconductor Die Pillar | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18303409 | ELECTRICAL CONNECTION AND ITS METHOD OF FABRICATION | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18787212 | PACKAGE STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779954 | FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18738443 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18599221 | OPTICAL DEVICE | Final Rejection | Asahi Kasei Microdevices Corporation |
| 18215685 | HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK | Final Rejection | XILINX, INC. |
| 18542704 | DRIVING BACKPLANE AND DISPLAY PANEL | Final Rejection | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18649311 | SEMICONDUCTOR DEVICE AND VEHICLE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18349719 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
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