Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2892 2894 2898 2899
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17959892 | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18277443 | POWER MODULE, ELECTRICAL DEVICE AND METHOD FOR PRODUCING A POWER MODULE | Non-Final OA | SIEMENS AKTIENGESELLSCHAFT |
| 18192849 | INTEGRATED CIRCUIT (IC) FABRICATED IN A HIGH MIX ENVIRONMENT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18410074 | MICRO LIGHT EMITTING DIODE WITH HIGH LIGHT EXTRACTION EFFICIENCY | Non-Final OA | Jade Bird Display (Shanghai) Limited |
| 18232990 | SUBSTRATE PROCESSING METHOD | Non-Final OA | ASM IP Holding B.V. |
| 17976869 | MANUFACTURING METHOD OF ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18232133 | ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS | Non-Final OA | Applied Materials, Inc. |
| 18224996 | METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS, FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18091026 | ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES | Non-Final OA | Intel Corporation |
| 18089417 | INTERCONNECT DEVICE AND METHOD | Non-Final OA | Intel Corporation |
| 18533809 | POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE | Non-Final OA | Robert Bosch GmbH |
| 18544861 | DETECTION DEVICE | Non-Final OA | Japan Display Inc. |
| 18463819 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 17980695 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18350595 | THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC FINS IN STAIRCASE REGION AND METHODS OF MAKING THEREOF | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | Non-Final OA | Wolfspeed, Inc. |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18544815 | BIOMETRIC INFORMATION MEASUREMENT DEVICE AND METHOD OF MANUFACTURING BIOMETRIC INFORMATION MEASUREMENT DEVICE | Non-Final OA | Sharp Semiconductor Innovation Corporation |
| 18357898 | METHOD OF FABRICATING A CAPACITOR | Non-Final OA | STMICROELECTRONICS (TOURS) SAS |
| 18262167 | METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR SINGLE CRYSTAL SUBSTRATE | Non-Final OA | TOYOTA TSUSHO CORPORATION |
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