Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2892 2894 2898 2899
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18735325 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSING DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18637022 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18544767 | GATE STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18532230 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17959892 | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18463819 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18533809 | POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE | Non-Final OA | Robert Bosch GmbH |
| 18357361 | Semiconductor Device and Method of Integrating eWLB with E-bar Structures and RF Antenna Interposer | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 17976869 | MANUFACTURING METHOD OF ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18535987 | STACKED MULTI-JUNCTION SOLAR CELL | Non-Final OA | AZUR SPACE Solar Power GmbH |
| 18777946 | METHOD OF MANUFACTURING A MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18357046 | IMAGE SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SK hynix Inc. |
| 18162079 | WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17951162 | NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTRUDED CONTACTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18426241 | STRING DRIVER WITH DEEP TRENCH ISOLATIONS | Non-Final OA | Micron Technology, Inc. |
| 18626638 | METHOD FOR TREATING TWO SUBSTRATES AND SEMICONDUCTOR APPARATUS FOR PERFORMING THE TREATMENT | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18410301 | Semiconductor Packages and Methods of Forming | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18410074 | MICRO LIGHT EMITTING DIODE WITH HIGH LIGHT EXTRACTION EFFICIENCY | Non-Final OA | Jade Bird Display (Shanghai) Limited |
| 18232133 | ADHESION IMPROVEMENTS IN METAL-CONTAINING HARDMASKS | Final Rejection | Applied Materials, Inc. |
| 18465268 | PROCESSING METHOD OF SUBSTRATE AND MANUFACTURING METHOD OF CHIPS | Non-Final OA | DISCO CORPORATION |
| 18535053 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18224576 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18161144 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPROVED ADHESION | Final Rejection | Wolfspeed, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy