Tech Center 2800 • Art Units: 2821 2893 2894 2897
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18526987 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18500797 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17977610 | LASING TO ATTACH DIE TO LEAD FRAME | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18518909 | DISPLAY DEVICE INCLUDING LENSES AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17796896 | SOLID-STATE IMAGING ELEMENT AND IMAGING SYSTEM | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18236922 | SINGLE GATE THREE-DIMENSIONAL (3D) DYNAMIC RANDOM-ACCESS MEMORY (DRAM) DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18541669 | COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK | Non-Final OA | International Business Machines Corporation |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18091034 | PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING | Non-Final OA | Intel Corporation |
| 18089483 | TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS | Non-Final OA | Intel Corporation |
| 18084275 | EMBEDDED MEMORY FOR GLASS CORE PACKAGES | Non-Final OA | Intel Corporation |
| 18072569 | INTEGRATED CIRCUIT STRUCTURE WITH RECESSED TRENCH CONTACT AND DEEP BOUNDARY VIA | Non-Final OA | Intel Corporation |
| 18525362 | THREE-DIMENSIONAL MEMORY ARRAY FORMATION TECHNIQUES | Non-Final OA | Micron Technology, Inc. |
| 18237206 | TRANSISTORS WITH MITIGATED FREE BODY EFFECT | Non-Final OA | Micron Technology, Inc. |
| 18264281 | SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, AND INTERPOSER GROUP | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18455993 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18514891 | LED WITH SEGMENTED SEMICONDUCTOR STRUCTURE | Non-Final OA | Lumileds LLC |
| 18107520 | SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE | Final Rejection | MEDIATEK INC. |
| 17938911 | SEMICONDUCTOR PACKAGE WITH TSV DIE | Non-Final OA | MEDIATEK INC. |
| 18499224 | SEMICONDUCTOR DEVICE INCLUDING A PLUG STRUCTURE | Non-Final OA | SK hynix Inc. |
| 18366255 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy