Tech Center 2800 • Art Units: 2821 2893 2894 2897
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18627071 | SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18581676 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18529087 | ELECTRONIC DEVICES EMPLOYING THIN-GATE INSULATOR TRANSISTORS COUPLED TO VARACTORS TO REDUCE GATE-TO-SOURCE/DRAIN VOLTAGE TO AVOID VOLTAGE BREAKDOWN, AND RELATED FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18084275 | EMBEDDED MEMORY FOR GLASS CORE PACKAGES | Final Rejection | Intel Corporation |
| 18726265 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17938911 | SEMICONDUCTOR PACKAGE WITH TSV DIE | Final Rejection | MEDIATEK INC. |
| 18787831 | FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH | Non-Final OA | Micron Technology, Inc. |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18572699 | OPTOELECTRONIC SEMICONDUCTOR DEVICE, ARRAY OF OPTOELECTRONIC SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18679869 | SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18632293 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | MACRONIX International Co., Ltd. |
| 18712710 | THIN FILM TRANSISTOR HAVING SPINEL SINGLE-PHASE CRYSTALLINE IZTO OXIDE SEMICONDUCTOR | Non-Final OA | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
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