Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2821 2893 2894 2897
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18526987 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18500797 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18518909 | DISPLAY DEVICE INCLUDING LENSES AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18541669 | COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK | Non-Final OA | International Business Machines Corporation |
| 18236922 | SINGLE GATE THREE-DIMENSIONAL (3D) DYNAMIC RANDOM-ACCESS MEMORY (DRAM) DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18525362 | THREE-DIMENSIONAL MEMORY ARRAY FORMATION TECHNIQUES | Non-Final OA | Micron Technology, Inc. |
| 18264281 | SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, AND INTERPOSER GROUP | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18107520 | SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE | Final Rejection | MEDIATEK INC. |
| 18332761 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366255 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18572949 | SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | Non-Final OA | UNIVERSITY PUBLIC CORPORATION OSAKA |
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