Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1787 2811 2812
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18777978 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18521209 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18488412 | INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18236190 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17875730 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18697009 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18574299 | LIGHT-EMITTING BASEPLATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18798654 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18791245 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18740701 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18396236 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18680875 | PACKAGE COMPRISING A TRENCH CAPACITOR DEVICE WITH A METALLIZATION PORTION COMPRISING BAR METALLIZATION INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18129688 | BACKSIDE CONTACT ETCH BEFORE CAVITY SPACER FORMATION FOR BACKSIDE CONTACT OF TRANSISTOR SOURCE/DRAIN | Non-Final OA | Intel Corporation |
| 17958279 | GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM | Final Rejection | Intel Corporation |
| 18442073 | STACK TYPE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18648965 | THIN FILM RESISTOR INTEGRATION WITH TERMINALS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18050338 | TRANSISTOR WITH DISTRIBUTED THERMAL FEEDBACK | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18784089 | Ferroelectric Memory Device and Method of Manufacturing the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18596213 | CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND DIFFUSION SOLDERING | Non-Final OA | Infineon Technologies Austria AG |
| 18637865 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | STMicroelectronics International N.V. |
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