Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18738574 | HIGH BANDWIDTH MEMORY | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18523970 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17634315 | IMAGING ELEMENT AND DISTANCE MEASURING APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18676007 | Display Panel and Display Apparatus Including Same | Non-Final OA | LG Display Co., Ltd. |
| 18463231 | CAPACITOR | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18529958 | DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18368494 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18458563 | FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MEMORY SYSTEM | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18468773 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18418320 | BUMP STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | MEDIATEK INC. |
| 18388278 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF | Final Rejection | FURUKAWA ELECTRIC CO., LTD. |
| 18403747 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18509235 | SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18371577 | RADIO FREQUENCY INDUCTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18501434 | JUNCTION STRUCTURE ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IN-MEMORY COMPUTING DEVICE INCLUDING THE SAME | Non-Final OA | RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
| 18437947 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Renesas Electronics Corporation |
| 18399996 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18586569 | SEMICONDUCTOR DEVICE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18523924 | SEMICONDUCTOR STRUCTURE | Non-Final OA | Powerchip Semiconductor Manufacturing Corporation |
| 18086062 | CERAMIC SUBSTRATE STRUCTURE AND POWER MODULE HAVING THE SAME | Final Rejection | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
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