Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18458438 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18124973 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18091295 | WIRELESS SYSTEM PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18468773 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18368498 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18354810 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17634315 | IMAGING ELEMENT AND DISTANCE MEASURING APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18306487 | ELECTROSTATIC DISCHARGE USING BACKSIDE POWER DISTRIBUTION NETWORK | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18288492 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 17561845 | IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING | Non-Final OA | Intel Corporation |
| 18377513 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18371577 | RADIO FREQUENCY INDUCTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 19020626 | SEMICONDUCTOR DEVICE | Non-Final OA | Nuvoton Technology Corporation Japan |
| 18086062 | CERAMIC SUBSTRATE STRUCTURE AND POWER MODULE HAVING THE SAME | Final Rejection | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18186842 | HEAT TRANSFER FOR POWER MODULES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18452822 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | RENESAS ELECTRONICS CORPORATION |
| 18369144 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18388278 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF | Non-Final OA | FURUKAWA ELECTRIC CO., LTD. |
| 18487502 | METHOD FOR FABRICATING A FERROELECTRIC DEVICE | Non-Final OA | Ferroelectric Memory GmbH |
| 17943181 | LIGHT-EMITTING DEVICE, PROJECTOR, AND DISPLAY | Non-Final OA | SOPHIA SCHOOL CORPORATION |
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