Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2842 2892
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18616279 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18683224 | DISPLAY MODULE, DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18549041 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18277228 | Display Panel and Display Apparatus | Final Rejection | BOE Technology Group Co., Ltd. |
| 18277086 | Display Substrate and Display Device | Final Rejection | BOE Technology Group Co., Ltd. |
| 18264484 | DISPLAY PANEL AND DISPLAY APPARATUS | Final Rejection | BOE Technology Group Co., Ltd. |
| 18142421 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | LG Display Co., Ltd. |
| 18437854 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18407707 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18384448 | METHOD AND SYSTEM FOR TUNING PHOTORESIST ADHESION LAYER PROPERTIES | Final Rejection | ASM IP Holding B.V. |
| 18565295 | BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DIFFERENT TYPE, METHOD FOR PRODUCING SAME, AND MOSAIC DIAMOND WAFER FOR USE IN BONDED BODY WITH SEMICONDUCTOR OF DIFFERENT TYPE | Non-Final OA | MITSUBISHI ELECTRIC CORPORATION |
| 18605896 | BOTTOM CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR (FET) | Non-Final OA | International Business Machines Corporation |
| 18533148 | WRAP-AROUND DIELECTRIC LINER TO PREVENT BACKSIDE CONTACT TO GATE SHORT | Non-Final OA | International Business Machines Corporation |
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