Tech Center 2800 • Art Units: 2892
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18142421 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | LG Display Co., Ltd. |
| 17868240 | TRANSPARENT DISPLAY APPARATUS WITH SLIT OVERLAPPING GIP LINES | Non-Final OA | LG Display Co., Ltd. |
| 18565294 | DISPLAYING BASE PLATE AND DISPLAYING DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18565256 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18549041 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18277228 | Display Panel and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18277086 | Display Substrate and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18264484 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18262386 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18261753 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18565295 | BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DIFFERENT TYPE, METHOD FOR PRODUCING SAME, AND MOSAIC DIAMOND WAFER FOR USE IN BONDED BODY WITH SEMICONDUCTOR OF DIFFERENT TYPE | Non-Final OA | MITSUBISHI ELECTRIC CORPORATION |
| 18565355 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18505557 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18365714 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 17690973 | DISPLAY PANEL WITH A PERIPHERAL AREA INCLUDING A PIXEL CIRCUIT, AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18278479 | DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18565403 | DISPLAY DEVICE | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18565389 | DISPLAY PANEL AND PREPARATION METHOD THEREOF | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18342071 | DISPLAY PANEL AND DISPLAY APPARATUS | Final Rejection | Hefei Visionox Technology Co., Ltd. |
| 18384448 | METHOD AND SYSTEM FOR TUNING PHOTORESIST ADHESION LAYER PROPERTIES | Non-Final OA | ASM IP Holding B.V. |
| 18565309 | GLASS SUBSTRATE WITH SEALING MATERIAL LAYER, AND HERMETIC PACKAGING MANUFACTURING METHOD | Non-Final OA | Nippon Electric Glass Co., Ltd. |
| 18022256 | POWER MODULE INCLUDING MULTIPLE LAYERS AND MANUFACTURING METHOD THEREFOR | Non-Final OA | AMOSENSE CO., LTD. |
| 18561180 | DISPLAY PANEL AND ELECTRONIC TERMINAL | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18419014 | LOCAL INTERCONNECT STRUCTURE | Non-Final OA | Tiawan Semiconductor Manufacturing Co., Ltd. |
| 17588888 | MICRO-TRANSFER-PRINTABLE COMPONENT MODULES WITH A MODULE TETHER AND MICRO-COMPONENT ON A FLEXIBLE, POLYMER, OR ORGANIC MODULE SUBSTRATE | Non-Final OA | X-Celeprint Limited |
| 18565406 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
| 17873474 | LIGHT-EMITTING DIODE, LIGHT-EMITTING MODULE, AND DISPLAY DEVICE WITH RECTANGULAR-LIKE ELECTRODE HAVING ARC SIDES | Non-Final OA | XIAMEN SAN’AN OPTOELECTRONICS CO., LTD. |
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