Tech Center 2800 • Art Units: 2818
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18538631 | SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18171864 | OPTOELECTRONIC DEVICE WITH SUB-WAVELENGTH ANTIREFLECTIVE STRUCTURE, ASSOCIATED SCREEN AND MANUFACTURING METHOD | Final Rejection | COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18630029 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18443013 | MERGED CAVITIES FOR CONDUCTOR FORMATION IN A MEMORY DIE | Non-Final OA | Micron Technology, Inc. |
| 17888650 | SILICIDE INTERFCACES OF DEVICE HAING DIFFERENT CONDUCTIVITY TYPE TRANSISTORS AND METHOD THEREOF | Final Rejection | Micron Technology, Inc. |
| 18782319 | A METHOD TO IMPROVE DATA RETENTION OF NON-VOLATILE MEMORY IN LOGIC PROCESSES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17747058 | SEMICONDUCTOR DEVICE HAVING NANOSHEET TRANSISTORS AND BACK-SIDE INTERCONNECT STRUCTURE COMPRISING POWER LINE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18593988 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Kioxia Corporation |
| 18485878 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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