Tech Center 2800 • Art Units: 2898
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18242628 | MANUFACTURING METHOD OF INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18239191 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18150415 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18021688 | COLOR FILM SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18362936 | Converter Package with Integrated Inductor | Non-Final OA | Texas Instruments Incorporated |
| 18235797 | LASER ANNEALING METHOD AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18362825 | QUANTUM DOT, AND DISPLAY DEVICE COMPRISING THE QUANTUM DOT | Non-Final OA | Samsung Display Co., Ltd. |
| 18337028 | MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18284681 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17563714 | NANOSHEET DEVICE HAVING TWO BOTTOM ISOLATION LAYERS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17552429 | SELECTIVE ENCAPSULATION OF MEMRISTIVE ELEMENT | Non-Final OA | International Business Machines Corporation |
| 18378165 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18240033 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17955245 | SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS | Non-Final OA | Intel Corporation |
| 17554456 | ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18234337 | CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18468904 | STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED CIRCUIT | Non-Final OA | Sandisk Technologies, Inc. |
| 17953636 | SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18057231 | LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND LED PIXEL PACKAGE | Non-Final OA | INGENTEC CORPORATION |
| 17440794 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD. |
| 17798015 | NANOTUBE SEMICONDUCTOR DEVICE AND SHEAR FORCE SENSOR INCLUDING THE SAME | Final Rejection | FOUNDATION OF SOONGSIL UNIVERSITY - INDUSTRY COOPERATION |
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