Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2898 4100
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18517126 | SEMICONDUCTOR MEMORY DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515412 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18385082 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18369248 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18468992 | SEMICONDUCTOR PACKAGES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18242628 | MANUFACTURING METHOD OF INTEGRATED CIRCUIT DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18161303 | FERROELECTRIC FIELD EFFECT TRANSISTOR, NEURAL NETWORK APPARATUS, AND ELECTRONIC APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18060037 | METHOD FOR PATTERNING AND REDUCING A THICKNESS OF A PHOTORESIST PATTERN IN A SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17900193 | SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18041870 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS | Final Rejection | SONY GROUP CORPORATION |
| 18362825 | QUANTUM DOT, AND DISPLAY DEVICE COMPRISING THE QUANTUM DOT | Final Rejection | Samsung Display Co., Ltd. |
| 17992421 | METHOD OF MANUFACTURING AN ELECTRODE OF A DISPLAY DEVICE THROUGH PATTERNING A PHOTORESIST | Non-Final OA | Samsung Display Co., Ltd. |
| 17959428 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18378165 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18091543 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY | Non-Final OA | Intel Corporation |
| 17855573 | INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL TRANSISTOR | Non-Final OA | Intel Corporation |
| 17554456 | ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Final Rejection | Intel Corporation |
| 17546461 | METAL CARBON BARRIER REGION FOR NMOS DEVICE CONTACTS | Non-Final OA | Intel Corporation |
| 18604744 | LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18234337 | CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18468958 | SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR | Non-Final OA | NXP B.V. |
| 18362936 | Converter Package with Integrated Inductor | Final Rejection | Texas Instruments Incorporated |
| 18510464 | MEMORY STRUCTURES WITH VOIDS | Non-Final OA | Micron Technology, Inc. |
| 18151843 | DUAL BAND FAN OUT DEVICE AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18348702 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DISCRETE CHARGE STORAGE ELEMENTS AND METHODS FOR FORMING THE SAME | Final Rejection | SANDISK TECHNOLOGIES LLC |
| 17563714 | NANOSHEET DEVICE HAVING TWO BOTTOM ISOLATION LAYERS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17552429 | SELECTIVE ENCAPSULATION OF MEMRISTIVE ELEMENT | Non-Final OA | International Business Machines Corporation |
| 18489459 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18370997 | SEMICONDUCTOR DEVICE INCLUDING VERTICAL SUPPORTING STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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