Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2898 4100
This examiner grants 86% of resolved cases
Alexander Michael Miller works in Tech Center 4100 and Art Unit 2898, where he has resolved 7 cases. Despite the small sample size, his allowance rate is 85.7%, which is notably high for applicants. The median days to allowance for these cases is 1259, providing a preliminary look at the expected duration of prosecution under his review.
The interview lift of 33.3% is particularly striking, suggesting that interviews are a powerful tool when working with this examiner. This lift indicates that the chance of allowance rises substantially above the 85.7% baseline when an interview is conducted. For practitioners, this suggests that even with a high initial allowance rate, verbal communication can further secure a positive result in Tech Center 4100.
With 7 resolved cases, the data for Miller is still emerging, yet the 1259-day median pendency offers useful initial insights. The 33.3% lift highlights a strong responsiveness to interviews in Art Unit 2898. Applicants should consider early engagement to capitalize on this trend and navigate the tech center's requirements as the examiner's portfolio grows.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18588902 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND A DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18677392 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18517126 | SEMICONDUCTOR MEMORY DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515412 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18468992 | SEMICONDUCTOR PACKAGES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18242628 | MANUFACTURING METHOD OF INTEGRATED CIRCUIT DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18239191 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18150415 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18060037 | METHOD FOR PATTERNING AND REDUCING A THICKNESS OF A PHOTORESIST PATTERN IN A SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17900193 | SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER AND METHOD OF FABRICATING ELECTRONIC APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18369226 | POWER SEMICONDUCTOR DEVICE AND POWER CONVERTER | Final Rejection | LX SEMICON CO., LTD. |
| 18604744 | LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18235797 | LASER ANNEALING METHOD AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18362825 | QUANTUM DOT, AND DISPLAY DEVICE COMPRISING THE QUANTUM DOT | Non-Final OA | Samsung Display Co., Ltd. |
| 18279573 | LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING DISPLAY DEVICE, METHOD FOR MANUFACTURING QUANTUM DOT COLLOIDAL SOLUTION, AND QUANTUM DOT COLLOIDAL SOLUTION | Final Rejection | SHARP KABUSHIKI KAISHA |
| 17955245 | SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS | Final Rejection | Intel Corporation |
| 17554456 | ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18284681 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17288675 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18041870 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18489574 | HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPLE COPPER CLIPS, REPLICA DEVICES | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18527716 | METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE | Non-Final OA | Sumitomo Electric Industries, Ltd. |
| 18274803 | LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING DEVICE COMPRISING SAME | Final Rejection | LG INNOTEK CO., LTD. |
| 18468977 | NANOSHEET DEVICE WITH ALIGNED ISOLATION AND EPITAXIAL GROWTH | Final Rejection | International Business Machines Corporation |
| 17552429 | SELECTIVE ENCAPSULATION OF MEMRISTIVE ELEMENT | Non-Final OA | International Business Machines Corporation |
| 18378165 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18362936 | Converter Package with Integrated Inductor | Final Rejection | Texas Instruments Incorporated |
| 18240033 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18165790 | CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A BOTTOM STIFFENER TO A PRINTED CIRCUIT BOARD | Non-Final OA | Juniper Networks, Inc. |
| 18526364 | SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES | Non-Final OA | XILINX, INC. |
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