Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18143735 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18312191 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18253628 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY GROUP CORPORATION |
| 17514984 | CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTACH IN FLIP CHIP PACKAGES | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18543110 | CHIP STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18302775 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18167081 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366848 | GATE STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18116268 | INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18218599 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18166517 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Industrial Technology Research Institute |
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