Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 67% of resolved cases
Marcos D. Pizarro Crespo is an examiner in Tech Center 2800 and Art Unit 2814. The examiner has 568 resolved cases and an allowance rate of 66.7 percent. This rate indicates a moderate likelihood of success. The median days to allowance is 1332, which serves as a benchmark for the time required to reach a grant. With 568 resolved cases, the data provides a reliable perspective on the examiner's tendencies.
The interview lift for this examiner is 14.3 percent. This indicates that an interview is associated with a higher probability of success than the 66.7 percent baseline allowance rate. Practitioners should consider the 14.3 percent lift as a useful tool for securing a grant. The 1332 median days to allowance is an important metric for managing expectations in Art Unit 2814. By combining the 66.7 percent allowance rate with the 14.3 percent interview lift, applicants can develop a robust strategy for the 568 resolved cases.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18450730 | IMAGE SENSOR WITH ENHANCED MULTI-SUBSTRATE STRUCTURES AND INTERCONNECTS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18143735 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18312191 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17476373 | INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES | Non-Final OA | QUALCOMM Incorporated |
| 17934721 | MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT | Final Rejection | Intel Corporation |
| 17126636 | MICROELECTRONIC STRUCTURES INCLUDING BRIDGES | Non-Final OA | Intel Corporation |
| 17567812 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18253628 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY GROUP CORPORATION |
| 17980010 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18043730 | ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | Non-Final OA | Resonac Corporation |
| 17514984 | CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTACH IN FLIP CHIP PACKAGES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17504182 | ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18543110 | CHIP STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18311243 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17859982 | Strained Channel Field Effect Transistor | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17879097 | SELECTION GATE STRUCTURE AND FABRICATION METHOD FOR 3D MEMORY | Final Rejection | Applied Materials, Inc. |
| 17089047 | PMOS High-K Metal Gates | Non-Final OA | Applied Materials, Inc. |
| 18421011 | LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY | Final Rejection | LUMILEDS LLC |
| 18097939 | LOW Z-HEIGHT LED ARRAY PACKAGE HAVING TSV SUPPORT STRUCTURE | Final Rejection | Lumileds LLC |
| 18214381 | BUILDING MULTI-DIE FPGAS USING CHIP-ON-WAFER TECHNOLOGY | Final Rejection | XILINX, INC. |
| 18162183 | JOINT STRUCTURE | Final Rejection | TDK CORPORATION |
| 18166517 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Industrial Technology Research Institute |
| 18116268 | INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17227383 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18218599 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17315740 | SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
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