Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17391342 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 17306267 | IMAGE SENSOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17504182 | ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17980010 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17567812 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17879097 | SELECTION GATE STRUCTURE AND FABRICATION METHOD FOR 3D MEMORY | Non-Final OA | Applied Materials, Inc. |
| 17089047 | PMOS High-K Metal Gates | Final Rejection | Applied Materials, Inc. |
| 17547980 | WRAP-AROUND CONTACT WITH REDUCED RESISTANCE | Final Rejection | Intel Corporation |
| 18118021 | SEMICONDUCTOR DEVICE | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18097939 | LOW Z-HEIGHT LED ARRAY PACKAGE HAVING TSV SUPPORT STRUCTURE | Non-Final OA | Lumileds LLC |
| 18156414 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18083576 | FINFET HAVING A GATE DIELECTRIC COMPRISING A MULTI-LAYER STRUCTURE INCLUDING AN OXIDE LAYER WITH DIFFERENT THICKNESSES ON SIDE AND TOP SURFACES OF THE FINS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17859982 | Strained Channel Field Effect Transistor | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18043730 | ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | Final Rejection | Resonac Corporation |
| 18518081 | Metal Contact Structure and Method of Forming the Same in a Semiconductor Device | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18335741 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18166517 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Industrial Technology Research Institute |
| 17227383 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Winbond Electronics Corp. |
| 18377367 | FORMING VIRTUAL MICROPHONE ARRAYS USING DUAL OMNIDIRECTIONAL MICROPHONE ARRAY (DOMA) | Non-Final OA | Jawbone Innovations, LLC |
| 17315740 | SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
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