Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18517325 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18332784 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18555905 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17511531 | DISPLAY DEVICE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17479794 | BOTTOM JUNCTION AND CONTACT AREA STRUCTURES FOR VERTICAL TRANSPORT FIELD-EFFECT TRANSISTORS | Final Rejection | International Business Machines Corporation |
| 18197545 | FORMATION OF SILICON-AND-METAL-CONTAINING MATERIALS FOR HARDMASK APPLICATIONS | Final Rejection | Applied Materials, Inc. |
| 17900386 | FDSOI DEVICE INCLUDING SELF-ALIGNED DIFFUSION BREAK | Non-Final OA | Applied Materials, Inc. |
| 18467581 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18321609 | METHOD OF FORMING CONTACT STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17464980 | Semiconductor Structures With Densly Spaced Contact Features | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17991365 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17481971 | MEMORY PERIPHERAL CIRCUIT HAVING THREE-DIMENSIONAL TRANSISTORS AND METHOD FOR FORMING THE SAME | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18562749 | Semiconductor Device | Non-Final OA | NTT, Inc. |
| 18305403 | Heterojunction-Based Vacuum Field Effect Transistors | Non-Final OA | Government of the United States, as represented by the Secretary of the Air Force |
| 17528481 | MANUFACTURE METHOD FOR INTERCONNECTION STRUCTURE | Non-Final OA | Invention And Collaboration Laboratory Pte. Ltd. |
| 17877324 | Method for Manufacturing Integrated Metal Resistance Layer | Non-Final OA | Shanghai Huali Integrated Circuit Corporation |
| 18324327 | SEMICONDUCTOR DEVICE OF THE SILICON ON INSULATOR TYPE AND CORRESPONDING MANUFACTURING METHOD | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 17865544 | SEMICONDUCTOR PACKAGE | Non-Final OA | NEPES HAYYIM |
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