Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18685475 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18442590 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18541630 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18475322 | STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18225768 | COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18213850 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18332270 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18315982 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18100752 | IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE IMAGE SENSOR | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17981354 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18442629 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18117211 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17702593 | TRANSISTOR GATE STACKS WITH THICK HYSTERETIC ELEMENTS | Final Rejection | Intel Corporation |
| 17688495 | INTERCONNECTS WITH SPINTRONIC LOGIC DEVICES | Final Rejection | Intel Corporation |
| 18102209 | AIRBRIDGE, SUPERCONDUCTING CIRCUIT APPARATUS AND METHOD OF FABRICATION THE SAME | Final Rejection | NEC Corporation |
| 18623839 | HIGH THERMAL CONDUCTIVITY BORON ARSENIDE FOR THERMAL MANAGEMENT, ELECTRONICS, OPTOELECTRONICS, AND PHOTONICS APPLICATIONS | Non-Final OA | The Regents of the University of California |
| 18320724 | MOS-BASED DESIGN SOLUTIONS FOR SOLVING WELL-PID | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18782900 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING DEPOSITION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18415426 | PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18156978 | INTEGRATED CIRCUIT INCLUDING EFUSE CELL | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18475292 | SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18171119 | SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT | Non-Final OA | Applied Materials, Inc. |
| 18180792 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18520606 | BACKSIDE DIELECTRIC LINERS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18642184 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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