Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18225768 | COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18332270 | IMAGE SENSOR | Final Rejection | Samsung Electronics Co., Ltd. |
| 18195618 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18100752 | IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18623839 | HIGH THERMAL CONDUCTIVITY BORON ARSENIDE FOR THERMAL MANAGEMENT, ELECTRONICS, OPTOELECTRONICS, AND PHOTONICS APPLICATIONS | Final Rejection | The Regents of the University of California |
| 18102209 | AIRBRIDGE, SUPERCONDUCTING CIRCUIT APPARATUS AND METHOD OF FABRICATION THE SAME | Final Rejection | NEC Corporation |
| 18001704 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18520606 | BACKSIDE DIELECTRIC LINERS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18574697 | LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18171119 | SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT | Final Rejection | Applied Materials, Inc. |
| 18180792 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18537297 | INSULATION MODULE | Non-Final OA | ROHM CO., LTD. |
| 18366887 | Efficient FET Body and Substrate Contacts | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18469911 | MEMORY DEVICES WITH A BACKSIDE READ WORD LINE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18362101 | CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18345844 | HIGH VOLTAGE TRANSISTOR STRUCTURE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18163746 | CFET SRAM WITH BUTT CONNECTION ON ACTIVE AREA | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18156978 | INTEGRATED CIRCUIT INCLUDING EFUSE CELL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18039048 | OPTICAL ELEMENT, IMAGE SENSOR AND IMAGING DEVICE | Non-Final OA | Nippon Telegraph and Telephone Corporation |
| 18185647 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | Kokusai Electric Corporation |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | Non-Final OA | Wolfspeed, Inc. |
| 18536249 | LIGHT EMITTING DIODE, MANUFACTURING METHOD AND LIGHT EMITTING DEVICE | Non-Final OA | Hubei Sanan Optoelectronics Co., Ltd. |
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