Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2893
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18685475 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18541630 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18541649 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18475322 | STACKED INTEGRATED CIRCUIT DEVICES INCLUDING STAGGERED GATE STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18225768 | COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18332270 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18315982 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18112202 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18102209 | AIRBRIDGE, SUPERCONDUCTING CIRCUIT APPARATUS AND METHOD OF FABRICATION THE SAME | Final Rejection | NEC Corporation |
| 17702593 | TRANSISTOR GATE STACKS WITH THICK HYSTERETIC ELEMENTS | Final Rejection | Intel Corporation |
| 17688495 | INTERCONNECTS WITH SPINTRONIC LOGIC DEVICES | Final Rejection | Intel Corporation |
| 18623839 | HIGH THERMAL CONDUCTIVITY BORON ARSENIDE FOR THERMAL MANAGEMENT, ELECTRONICS, OPTOELECTRONICS, AND PHOTONICS APPLICATIONS | Non-Final OA | The Regents of the University of California |
| 17891655 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18596514 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18589300 | SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18521547 | LIGHT DETECTING PIXEL USING VERTICAL GATES AND PLANAR GATES | Non-Final OA | STMICROELECTRONICS INTERNATIONAL N.V. |
| 18415426 | PASSIVATION STRUCTURE AND THE METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18171119 | SILICON SUPER JUNCTION STRUCTURES FOR INCREASED THROUGHPUT | Non-Final OA | Applied Materials, Inc. |
| 18185647 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 18475298 | Power Semiconductor Device Having Shaped Trench Ends | Final Rejection | Wolfspeed, Inc. |
| 18579009 | SUBSTRATE FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 17759039 | PHOTOELECTRIC CONVERSION ELEMENT AND METHOD OF PRODUCING SAME | Non-Final OA | ZEON CORPORATION |
| 17817430 | RESISTIVE MEMORY DEVICES WITH A CAVITY BETWEEN ELECTRODES | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
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