Tech Center 2800 • Art Units: 2115 2116 2121 2125 2898
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18500098 | SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18465550 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18455643 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18450445 | INTEGRATION OF STACKED LOGIC DEVICE WITH PASSIVE DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18460154 | METHODS AND STRUCTURES FOR HIGH STRENGTH DIELECTRIC IN HYBRID BONDING | Non-Final OA | Applied Materials, Inc. |
| 18470437 | MANUFACTURING DEVICE OF DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 17955511 | MUSHROOMED VIA STRUCTURES FOR TRENCH CONTACT OR GATE CONTACT | Non-Final OA | Intel Corporation |
| 17953648 | STACKED PEROVSKITE FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICES | Non-Final OA | Intel Corporation |
| 18460236 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18404939 | COMPOSITE ELECTRONIC COMPONENT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18459531 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF WITH DIFFUSION CAP LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18472343 | BURIED SHIELD STRUCTURES FOR POWER SEMICONDUCTOR DEVICES INCLUDING SEGMENTED SUPPORT SHIELD STRUCTURES FOR REDUCED ON-RESISTANCE AND RELATED FABRICATION METHODS | Non-Final OA | Wolfspeed, Inc. |
| 18279706 | MANUFACTURING METHOD OF CIRCUITRY INCLUDING PLANAR DIODE | Non-Final OA | Space Power Technologies Inc. |
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