Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2115 2116 2121 2125 2898
This examiner grants 87% of resolved cases
RAHMAN, MOHAMMAD A is an examiner in Tech Center 2800 and Art Unit 2115. The examiner has 572 resolved cases. The allowance rate for these cases is 87.1 percent. Practitioners should use this information when advising clients on the likelihood of a patent grant. The volume of dispositions provides a basis for statistical analysis of the examiner's record. This percentage informs the expectations for an outcome during the prosecution process.
The median days to allowance is 979. This timeline represents the duration from filing to a grant. The pendency figure is a factor for managing portfolio expectations and planning filings. Applicants should prepare for the prosecution process by considering this time requirement. The duration of the examination is a component of the experience in Tech Center 2800.
The interview lift is 10.8 percent. This figure indicates the correlation between an interview and an allowance. Engaging in dialogue with the examiner is a factor to consider for applicants in Art Unit 2115. The impact of interviews is a metric for this docket. This 10.8 percent lift is a data point for strategy development. These statistics offer a view of the examiner's performance and tendencies. This analysis provides a baseline for expectations during the patent examination process.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18706613 | DISPLAY DEVICE USING LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR | Non-Final OA | LG ELECTRONICS INC. |
| 18756169 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18744813 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18680554 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18729327 | Light-Emitting Device, Manufacturing Method Therefor, Display Panel and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18729123 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18729121 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18656839 | LIGHT COLLECTOR FOR LIGHT MIXING IN LIGHT EMITTING DIODE PACKAGES | Non-Final OA | CreeLED, Inc. |
| 18590637 | PACKAGE COMPRISING A BASE PORTION AND INTEGRATED DEVICES | Final Rejection | QUALCOMM Incorporated |
| 18120172 | HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER | Non-Final OA | Intel Corporation |
| 18657155 | STRAIN-RELAXED PSEUDO-SUBSTRATES AND METHODS OF MAKING SAME USING THERMAL POROSIFICATION | Non-Final OA | Wisconsin Alumni Research Foundation |
| 18716880 | OPTOELECTRONIC COMPONENT, OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING A COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18794460 | SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETWEEN TWO LEADFRAMES AND A METHOD FOR FABRICATING THE SAME | Non-Final OA | Infineon Technologies AG |
| 18751360 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18649170 | THIN FILM RESISTOR INTEGRATION WITHIN A COPPER INTERCONNECT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18416513 | IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18616674 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18609456 | INTERCONNECT STRUCTURE AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785596 | SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18661969 | AIR SPACER FOR A GATE STRUCTURE OF A TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18493187 | SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18670061 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF | Non-Final OA | Winbond Electronics Corp. |
| 18609178 | Component Carrier and Method of Manufacturing the Component Carrier | Final Rejection | AT&S Austria Technologie & Systemtechnik AG |
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