Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2881 2898
This examiner grants 75% of resolved cases
Alia Sabur is an examiner in Tech Center 2800 and Art Unit 2812. The examiner has 603 resolved cases. The allowance rate for these matters is 74.6%. This metric provides a baseline for the likelihood of securing a patent grant during prosecution. The 74.6% rate is a primary data point for evaluating the probability of success in this specific Art Unit.
The interview lift is 6.3%. This value measures the increase in the probability of allowance following an interview. A lift of 6.3% indicates that engaging in a direct dialogue with the examiner can be a factor in the progression of cases. Practitioners should weigh this 6.3% figure when deciding whether to request a formal interview for their 603 resolved cases.
The median days to allowance is 839. This figure represents the typical time span from filing to the issuance of a patent. A median of 839 days informs the scheduling and budget expectations for applicants. This 839 days duration is a factor in the overall prosecution timeline.
In Tech Center 2800, the examiner's 74.6% allowance rate and 603 resolved cases define the current landscape. The interview lift serves as a tool for navigating the prosecution process toward a grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18781152 | BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18763349 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18755840 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18671011 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18537546 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18769173 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18441404 | COVER WINDOW, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18403505 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18423576 | DISPLAY DEVICE AND TILING DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18378482 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME | Final Rejection | LG DISPLAY CO., LTD. |
| 18671243 | CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, AND ELECTRONIC DEVICE | Final Rejection | Huawei Digital Power Technologies Co., Ltd. |
| 18598066 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18107486 | SEMICONDUCTOR ELEMENT AND METHOD FOR FABRICATING THE SAME | Final Rejection | InnoLux Corporation |
| 18051909 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18510858 | MICROELECTRONIC DEVICE WITH IMPROVED VERTICAL BREAKDOWN VOLTAGE | Final Rejection | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18776352 | OPTICAL SENSOR | Non-Final OA | Magnolia White Corporation |
| 18129879 | SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES | Final Rejection | Intel Corporation |
| 18806545 | SEMICONDUCTOR ELEMENTS WITH HYBRID BONDING LAYERS | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18805622 | ANALOG CIRCUIT AND SEMICONDUCTOR DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18707700 | DISPLAY APPARATUS | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18843391 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18004778 | LIGHT-RECEIVING ELEMENT AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18755895 | Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18738634 | SEMICONDUCTOR DEVICE INCLUDING EMBEDDED SEMICONDUCTOR DIES | Non-Final OA | Sandisk Technologies, Inc. |
| 18277853 | ADHESIVE SHEET AND DISPLAY BODY | Final Rejection | LINTEC CORPORATION |
| 18582608 | ANALYSIS METHOD, COMPUTER-READABLE MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18793304 | LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18795612 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREOF | Non-Final OA | Enkris Semiconductor, Inc. |
| 18426051 | METHOD OF PEAK ON-STATE VOLTAGE REDUCTION FOR SEMICONDUCTOR DEVICE FABRICATION | Non-Final OA | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
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