Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2835 2895 2899
This examiner grants 88% of resolved cases
Christina A. Sylvia is a high-volume examiner in Tech Center 2800 and Art Unit 2800. She has 771 resolved cases and a very high allowance rate of 87.5%. This is a very favorable rate for applicants. The interview lift is 9.6%, which is a modest but positive increase in the likelihood of success.
The median days to allowance is 749, which is a relatively fast timeline for prosecution. The combination of an 87.5% allowance rate and a 749-day median makes this a very efficient environment for applicants. Practitioners in Art Unit 2800 should find these statistics very encouraging for their clients in Tech Center 2800. The 771 resolved cases provide a robust statistical basis for these favorable metrics and help in planning rapid prosecution strategies.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18320138 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18112107 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18675141 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18528823 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18500220 | DISPLAY PANEL | Final Rejection | Samsung Display Co., Ltd. |
| 18542603 | IMAGING DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18558917 | DISPLAY PANELS AND DISPLAY DEVICES | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18542764 | DIE PACKAGE STRUCTURE, METHOD FOR FABRICATING SAME, AND PACKAGE SYSTEM | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18534706 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18148338 | MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES | Non-Final OA | Intel Corporation |
| 17698928 | PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX | Final Rejection | Intel Corporation |
| 18390937 | Method For Manufacturing Display Device, Display Device, Display Module, and Electronic Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18709937 | SEMICONDUCTOR DEVICE AND PHOTODETECTOR | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18261713 | ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE | Non-Final OA | Resonac Corporation |
| 18494832 | Semiconductor Package Assembly | Non-Final OA | KYOCERA AVX Components Corporation |
| 18749516 | PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18491889 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
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