Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18419084 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18494792 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18356682 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18219211 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18320138 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18424846 | DISPLAY DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18374582 | INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES | Non-Final OA | Intel Corporation |
| 17856830 | METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES | Non-Final OA | Intel Corporation |
| 17698928 | PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE COMPLEX | Non-Final OA | Intel Corporation |
| 18482015 | SEMICONDUCTOR DEVICE USING HARD MASK AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18232713 | Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18584050 | DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | AG MATERIALS TECHNOLOGY CO., LTD. |
| 18555504 | STRESS-STRAIN ENGINEERING OF SEMICONDUCTOR MEMBRANES | Non-Final OA | University of Surrey |
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