Prosecution Insights
Last updated: August 18, 2026

Examiner: SYLVIA, CHRISTINA A

Tech Center 2800 • Art Units: 2800 2817 2895

This examiner grants 88% of resolved cases

Performance Statistics

87.6%
Allow Rate
+19.6% vs TC avg
790
Total Applications
+9.5%
Interview Lift
746
Avg Prosecution Days
Based on 765 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
23.3%
§102 Novelty
58.9%
§103 Obviousness
17.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18409347 IMAGE SENSOR HAVING NANO-PHOTONIC LENS ARRAY AND ELECTRONIC APPARATUS INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18494792 SEMICONDUCTOR DEVICES Final Rejection Samsung Electronics Co., Ltd.
18112107 SEMICONDUCTOR PACKAGE Non-Final OA Samsung Electronics Co., Ltd.
18542603 IMAGING DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA Panasonic Intellectual Property Management Co., Ltd.
18558917 DISPLAY PANELS AND DISPLAY DEVICES Final Rejection WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
18542764 DIE PACKAGE STRUCTURE, METHOD FOR FABRICATING SAME, AND PACKAGE SYSTEM Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18528823 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., Ltd.
18500220 DISPLAY PANEL Final Rejection Samsung Display Co., Ltd.
18148338 MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES Non-Final OA Intel Corporation
18424846 DISPLAY DEVICE AND ELECTRONIC APPARATUS Non-Final OA SEIKO EPSON CORPORATION
18617858 SEMICONDUCTOR DEVICE AND DISPLAY DEVICE Non-Final OA Japan Display Inc.
18749516 PACKAGE STRUCTURE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18498293 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18194709 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18478592 INTEGRATED CIRCUIT PACKAGE AND METHOD Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
18518568 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS Final Rejection FUJI ELECTRIC CO., LTD.
18261713 ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE Non-Final OA Resonac Corporation

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