Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2812 2814 2826 2834 2872
This examiner grants 94% of resolved cases
Changhyun Yi is an examiner in Tech Center 2800, Art Unit 2800. With 1092 resolved cases, he has a very high allowance rate of 94.0 percent. This indicates that nearly all applications reaching a final disposition are allowed. The 94.0 percent allowance rate is among the highest for examiners with a similar case volume, suggesting a very favorable environment for applicants.
The median days to allowance is 650, which is significantly faster than many other examiners. The interview lift is 4.1 percent. Given the already high allowance rate and the rapid timeline of 650 days, practitioners may find that written prosecution is highly effective without the need for extensive verbal negotiation. The 4.1 percent lift provides only a minor benefit compared to the 94.0 percent baseline. With 1092 resolved cases, the examiner has a proven track record of efficient and favorable examination. Applicants can expect a relatively quick path to a patent grant. The data reflects a highly streamlined process in Art Unit 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18242399 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18534682 | LIGHT EMITTING DEVICE AND PROJECTOR | Non-Final OA | SEIKO EPSON CORPORATION |
| 18833503 | Display Panel and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18597124 | DISPLAY DEVICE FOR VEHICLE AND VEHICLE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18659522 | LIGHT-EMITTING DEVICE | Non-Final OA | Nichia Corporation |
| 17549550 | INTEGRATED CIRCUIT STRUCTURES HAVING VERSATILE CHANNEL PLACEMENT | Non-Final OA | Intel Corporation |
| 18763467 | BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE COPPER BONDING | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18648836 | STRUCTURES AND METHODS TO PROVIDE CONNECTIONS ACROSS CHANNELS | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18782358 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18397252 | SEMICONDUCTOR DEVICE | Final Rejection | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 18668475 | DIELECTRIC INNER SPACERS FOR NANOSHEET TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18491920 | ACTIVE PIXEL SENSOR AND METHOD FOR FABRICATING AN ACTIVE PIXEL SENSOR | Non-Final OA | Infineon Technologies AG |
| 18397453 | HEMT Device with Unmetallized Gate | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18538557 | DIE WITH BOND PAD | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18777870 | THERMAL DISSIPATION IN STACKED MEMORY DEVICES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18781815 | HEMT TRANSISTOR WITH ADJUSTED GATE-SOURCE DISTANCE, AND MANUFACTURING METHOD THEREOF | Non-Final OA | STMicroelectronics S.r.l. |
| 18787572 | FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18782962 | HYBRID SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18780969 | Protective Liner for Source/Drain Contact to Prevent Electrical Bridging While Minimizing Resistance | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18596416 | METHOD OF FORMING NANOSTRUCTURE DEVICE AND RELATED STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18789176 | SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18787531 | Semiconductor Devices and Methods | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18787838 | BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780927 | GATE-ALL-AROUND DEVICES HAVING SELF-ALIGNED CAPPING BETWEEN CHANNEL AND BACKSIDE POWER RAIL | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780592 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18620296 | 4F2 VERTICAL ACCESS TRANSISTOR WITH REDUCED FLOATING BODY EFFECT | Non-Final OA | Applied Materials, Inc. |
| 18470217 | BARRIER STRUCTURE FOR DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| 18435505 | SEMICONDUCTOR DEVICE HAVING STACKED CAPACITOR AND METHOD FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18631070 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18563744 | QUBIT ELEMENT | Final Rejection | Rheinisch-Westfälische Technische Hochschule (RWTH Aachen) |
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