Tech Center 2800 • Art Units: 2800 2812 2814 2826 2834 2872
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18656933 | SEMICONDUCTOR DEVICE INCLUDING BIT LINE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18639141 | CUT-MASK PATTERNING TO REMOVE CORNER- ROUNDING OF ACTIVE REGIONS OF SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18627797 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18587785 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18435414 | SEMICONDUCTOR STACKED STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18397837 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18242399 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18235627 | IMAGE SENSOR HAVING NANO-PHOTONIC LENS ARRAY AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17293521 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18833503 | Display Panel and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18659522 | LIGHT-EMITTING DEVICE | Non-Final OA | Nichia Corporation |
| 18662801 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17549550 | INTEGRATED CIRCUIT STRUCTURES HAVING VERSATILE CHANNEL PLACEMENT | Final Rejection | Intel Corporation |
| 18534682 | LIGHT EMITTING DEVICE AND PROJECTOR | Non-Final OA | SEIKO EPSON CORPORATION |
| 18763467 | BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE COPPER BONDING | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18648836 | STRUCTURES AND METHODS TO PROVIDE CONNECTIONS ACROSS CHANNELS | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18782358 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18499985 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18460008 | IMAGE SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18397453 | HEMT Device with Unmetallized Gate | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18538557 | DIE WITH BOND PAD | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18498144 | DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18777870 | THERMAL DISSIPATION IN STACKED MEMORY DEVICES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18536026 | APPARATUSES INCLUDING SHALLOW TRENCH ISOLATION AND METHODS FOR FORMING SAME | Final Rejection | MICRON TECHNOLOGY, INC. |
| 18771599 | Multi-Gate Field-Effect Transistors and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770408 | INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18780927 | GATE-ALL-AROUND DEVICES HAVING SELF-ALIGNED CAPPING BETWEEN CHANNEL AND BACKSIDE POWER RAIL | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18775808 | Nanostructure Field-Effect Transistor Device and Method of Forming | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18771674 | SEMICONDUCTOR DEVICE GATE STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18771551 | INTERFACE PROFILE CONTROL IN EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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