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Home / Akona Ip Pc - Intel / Complete list
Last updated: October 25, 2026

Akona Ip Pc - Intel: all pending office actions

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App #TitleClientExaminerArt UnitStatutesStatusDue inAIFiled
19251520 SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE Intel Corporation GUYTON, PHILIP A 2192 §102 Non-Final OA — Pending Jun 26, 2025
18997988 POINT GRID NETWORK WITH LEARNABLE SEMANTIC GRID TRANSFORMATION Intel Corporation OAKES, JUSTIN MONTGOMERY 2662 §103Other Non-Final OA — Pending Jan 23, 2025
18990080 MULTI-VARIATE STRIDED READ OPERATIONS FOR ACCESSING MATRIX OPERANDS Intel Corporation METZGER, MICHAEL J 2183 §103 Non-Final OA — Pending Dec 20, 2024
18944243 RADIO FREQUENCY FRONT-END STRUCTURES Intel Corporation DIAZ, JOSE 2875 DP Non-Final OA — Pending Nov 12, 2024
18922038 METHODS AND APPARATUS TO TILE WALK A TENSOR FOR CONVOLUTION OPERATIONS Intel Corporation JEON, JAE UK 2193 §101 Non-Final OA — Pending Oct 21, 2024
18855943 RESOLUTION-SWITCHABLE SEGMENTATION NETWORKS Intel Corporation YAO, JULIA ZHI-YI 2666 §103 Non-Final OA — Pending Oct 10, 2024
18907748 PERFORMANCE SCALING FOR DATAFLOW DEEP NEURAL NETWORK HARDWARE ACCELERATORS Intel Corporation TSENG, CHENG YUAN §102§103Other Non-Final OA — Pending Oct 07, 2024
18806287 IMPROVING SIZE AND EFFICIENCY OF DIES Intel Corporation NGUYEN, DUY T V 2818 DP Non-Final OA — Pending Aug 15, 2024
18761714 DYNAMIC PRUNING OF NEURONS ON-THE-FLY TO ACCELERATE NEURAL NETWORK INFERENCES Intel Corporation LEE, TSU-CHANG §103§112 Non-Final OA — Pending Jul 02, 2024
18761453 HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES Intel Corporation ULLAH, ELIAS 2893 — Final Rejection — Pending Jul 02, 2024
18724510 DYNAMIC TRIPLET CONVOLUTION FOR CONVOLUTIONAL NEURAL NETWORKS Intel Corporation ELCHANTI, ZEINA 3628 §112 Non-Final OA — Pending Jun 26, 2024
18740743 TRANSISTOR CHANNEL STRUCTURES COMBINING GALLIUM NITRIDE AND SILICON CARBIDE Intel Corporation MATTABONI, TIMOTHY JAMES 2897 §103 Non-Final OA — Pending Jun 12, 2024
18630302 MICROELECTRONIC ASSEMBLIES Intel Corporation FAYETTE, NATHALIE RENEE 2812 §102§103 Non-Final OA — Pending Apr 09, 2024
18601774 PACKAGE STACKING USING CHIP TO WAFER BONDING Intel Corporation MUNOZ, ANDRES F 2818 §103§112 Final Rejection — AI Ready Mar 11, 2024
18423577 TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING Intel Corporation MACARTHUR, SYLVIA 2899 §103 Non-Final OA — Pending Jan 26, 2024
18411542 IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS Intel Corporation VARNDELL, ROSS E 2674 §103 Final Rejection 40d AI Ready Jan 12, 2024
18539957 EMBEDDED SAR-ADC WITH LEAST SIGNIFICANT BIT SKIPPING BASED RELU ACTIVATION FUNCTION Intel Corporation JEANGLAUDE, JEAN BRUNER 2845 §102 Non-Final OA — Pending Dec 14, 2023
18527490 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS Intel Corporation VARNDELL, ROSS E 2674 §101§103Other Final Rejection 27d AI Ready Dec 04, 2023
18489327 SOLVING OPTIMIZATION PROBLEMS USING SPIKING NEUROMORPHIC NETWORK Intel Corporation KIM, SEHWAN 4100 §101§102§103 Non-Final OA — Pending Oct 18, 2023
18474564 REAL-TIME INFERENCE OF TEMPORAL DOWN-SAMPLING CONVOLUTIONAL NETWORKS Intel Corporation LEE, MICHAEL CHRISTOPHER 2128 — Non-Final OA — Pending Sep 26, 2023
18469674 LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES Intel Corporation DIALLO, MAMADOU L 2897 — Non-Final OA — Pending Sep 19, 2023
18460931 PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING MICROCHANNEL Intel Corporation KEBEDE, BROOK 2818 §112 Non-Final OA — Pending Sep 05, 2023
18459824 LONG DURATION STRUCTURED VIDEO ACTION SEGMENTATION Intel Corporation COUSO, JOSE L 2667 §102§103 Non-Final OA — Pending Sep 01, 2023
18459664 INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES Intel Corporation NGUYEN, DAO H 2818 §102§112 Non-Final OA — Pending Sep 01, 2023
18457002 TRAINING NEURAL NETWORK WITH BUDDING ENSEMBLE ARCHITECTURE BASED ON DIVERSITY LOSS Intel Corporation LEE, WILLIAM MICHAEL 2145 §101§103§112 Final Rejection — Pending Aug 28, 2023
18453715 PRUNING ACTIVATIONS AND WEIGHTS OF NEURAL NETWORKS WITH PROGRAMMABLE THRESHOLDS Intel Corporation PENG, STEVEN 2125 §101§103 Non-Final OA — Pending Aug 22, 2023
18451150 PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS Intel Corporation HSIEH, HSIN YI §103§112 Non-Final OA — Pending Aug 17, 2023
18233803 Method and System of Audio Detection of a Target Audio Source in Noisy Environments Intel Corporation SNIEZEK, ANDREW L 2693 §102§103 Non-Final OA — Pending Aug 14, 2023
18364814 PERFORMING OPERATION IN NEURAL NETWORK WITH STORAGE POINTER AND SPARSITY MAP Intel Corporation CADY, MATTHEW ALAN §102 Non-Final OA — Pending Aug 03, 2023
18360999 INTEGRATED PHOTONIC DEVICES AND SYSTEMS WITH THERMAL DRIFT COMPENSATION Intel Corporation GOLUB-MILLER, MARCIA A 2828 §103§112 Non-Final OA — Pending Jul 28, 2023
18346966 GRAPH SEARCH USING NEURAL NETWORK WITH SPIKING NEUROMORPHIC ARCHITECTURE Intel Corporation LE, HUNG VAN 2145 §101§103 Non-Final OA — Pending Jul 05, 2023
18345437 PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING Intel Corporation FOX, BRANDON C 2818 §102§103§112 Non-Final OA — Pending Jun 30, 2023
18344260 PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING Intel Corporation JUNG, MICHAEL YOO LIM 2817 §102§103 Non-Final OA — Pending Jun 29, 2023
18341875 ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS Intel Corporation STOYTCHEV, MARIN STOYTCHEV 2845 §103§112 Non-Final OA — Pending Jun 27, 2023
18214884 METHOD AND SYSTEM OF SOUND LOCALIZATION USING BINAURAL AUDIO CAPTURE Intel Corporation SUTHERS, DOUGLAS JOHN 2695 §101§102§103 Non-Final OA — Pending Jun 27, 2023
18341852 THREE-DIMENSIONAL FLOATING BODY MEMORY Intel Corporation IMTIAZ, S M SOHEL 2812 §103§112 Non-Final OA — Pending Jun 27, 2023
18342564 METHODS AND APPARATUS TO IMPROVE AUDIO QUALITY BASED ON LOAD IMPEDANCE SENSING Intel Corporation ADDY, THJUAN KNOWLIN 2693 §102 Non-Final OA — Pending Jun 27, 2023
18342112 Integrated Waveguides for Semiconductor Technology Intel Corporation MARUF, SHEIKH 2897 §103§112 Non-Final OA — Pending Jun 27, 2023
18340072 INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES Intel Corporation JANG, BO BIN 2818 §102§103 Non-Final OA — Pending Jun 23, 2023
18338404 MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS Intel Corporation WALL, VINCENT 2898 §102§103 Non-Final OA — Pending Jun 21, 2023
18338395 INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES Intel Corporation LIU, MIKKA H 2817 §102§112 Non-Final OA — Pending Jun 21, 2023
18337655 DEEP NEURAL NETWORK ACCELERATOR WITH MEMORY HAVING TWO-LEVEL TOPOLOGY Intel Corporation STANLEY, JEREMY L 2127 §103 Non-Final OA — Pending Jun 20, 2023
18333711 INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN Intel Corporation HIBBERT, DANIEL JOHNATHAN 2899 §102 Final Rejection 10d overdue AI Ready Jun 13, 2023
18333758 INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE Intel Corporation KOO, LAMONT B 2813 §102§103 Final Rejection 22d AI Ready Jun 13, 2023
18332918 TWO-TERMINAL INTEGRATED CIRCUIT DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION Intel Corporation MUSLIM, SHAWN SHAW 2897 §102§103 Non-Final OA — Pending Jun 12, 2023
18325267 CAUSAL EXPLANATION OF ATTENTION-BASED NEURAL NETWORK OUTPUT Intel Corporation SAX, STEVEN PAUL 2146 §101§103 Final Rejection 54d AI Ready May 30, 2023
18325374 FEDERATED LEARNING ADAPTIVE TO CAPABILITIES OF CONTRIBUTING DEVICES Intel Corporation GOLAN, MATTHEW BRYCE 2123 §103§112 Final Rejection — Pending May 30, 2023
18325298 SPARSITY-BASED REDUCTION OF GATE SWITCHING IN DEEP NEURAL NETWORK ACCELERATORS Intel Corporation MAIDO, MAGGIE T 2129 §101§102§103 Non-Final OA — Pending May 30, 2023
18306399 MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS Intel Corporation SMITH, SAMUEL JONATHAN 2817 §102§103 Non-Final OA — Pending Apr 25, 2023
18304659 INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN Intel Corporation KEAGY, ROSE ALYSSA 2818 §102§103 Non-Final OA — Pending Apr 21, 2023
18303932 NANORIBBON-BASED TRANSISTOR WITH UNIFORM OXIDE Intel Corporation CHOWDHARY, NIMARTA KAUR 2898 §103 Non-Final OA — Pending Apr 20, 2023
18194248 METHODS AND APPARATUS TO MODEL SPEAKER AUDIO Intel Corporation LEE, JANGWOEN 2656 §103 Final Rejection — Pending Mar 31, 2023
18191273 PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS Intel Corporation KIANNI, KAVEH C 2874 §103 Non-Final OA — Pending Mar 28, 2023
18187965 ROUNDED NANORIBBONS WITH REGROWN CAPS Intel Corporation NGUYEN, CUONG B 2818 §102§103§112 Final Rejection — Pending Mar 22, 2023
18187950 RECONFIGURABLE MULTIBIT ANALOG IN-MEMORY COMPUTING WITH COMPACT COMPUTATION Intel Corporation VILLANUEVA, MARKUS ANTHONY 2151 §102§103 Non-Final OA — Pending Mar 22, 2023
18184921 DYNAMIC UNCOMPRESSION FOR CHANNEL-SEPARABLE OPERATION IN NEURAL NETWORK Intel Corporation CADY, MATTHEW ALAN 2145 §103 Final Rejection — Pending Mar 16, 2023
18181155 INTEGRATED CIRCUIT DEVICE WITH BACKSIDE FIN TRIM ISOLATION Intel Corporation RIRIE, EVERETT TRAJAN 2876 §102§103§112 Non-Final OA — Pending Mar 09, 2023
18180415 SCHEDULING COMPUTATIONS IN DEEP NEURAL NETWORK BASED ON SPARSITY Intel Corporation DASCOMB, JACOB D 2195 §103 Final Rejection — Pending Mar 08, 2023
18175591 METAL GATE FABRICATION FOR NANORIBBON-BASED TRANSISTORS Intel Corporation SEVEN, EVREN 2812 §102§103 Final Rejection — Pending Feb 28, 2023
18159220 TECHNOLOGY TO REALIZE SIGNED MULTIPLY-ACCUMULATE OPERATION IN THE ANALOG DOMAIN WITH A DIFFERENTIAL SIGNAL PATH AND INTRINSIC PROCESS, VOLTAGE AND TEMPERATURE VARIATION TOLERANCE Intel Corporation STRAPP, MATTHEW JACOB 2182 §103 Non-Final OA — Pending Jan 25, 2023
18091555 APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING Intel Corporation TIVARUS, CRISTIAN ALEXANDRU 2899 §103 Final Rejection — Pending Dec 30, 2022
18090879 MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES Intel Corporation DINKE, BITEW A 2812 §103 Non-Final OA — AI Ready Dec 29, 2022
18148358 END-TO-END NEUROMORPHIC ACOUSTIC PROCESSING Intel Corporation BECKER, TYLER JUSTIN 2657 §103 Final Rejection 6d AI Ready Dec 29, 2022
18089871 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation JORDAN, ANDREW 2874 §102§103 Final Rejection 30d AI Ready Dec 28, 2022
18089916 OPTICAL SEMICONDUCTOR PACKAGE AND METHOD Intel Corporation TRAN, HOANG Q 2874 §103 Final Rejection 19d AI Ready Dec 28, 2022
18145038 PRECURSORS AND METHODS FOR PRODUCING BISMUTH-OXY-CARBIDE-BASED PHOTORESIST Intel Corporation COSGROVE, JAYSON D 1737 — Final Rejection 1d overdue AI Ready Dec 22, 2022
18068732 PRECURSORS AND METHODS FOR PRODUCING TIN-BASED PHOTORESIST Intel Corporation ANGEBRANNDT, MARTIN J 1737 §103 Final Rejection — AI Ready Dec 20, 2022
18067031 INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES Intel Corporation VU, HUNG K 2897 §102§103 Final Rejection — Pending Dec 16, 2022
18066301 SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAYER WITH CUT Intel Corporation SHEKER, RHYS PONIENTE 2813 §102§103 Non-Final OA — Pending Dec 15, 2022
18066307 DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MARGIN OF VIA Intel Corporation PALANISWAMY, KRISHNA JAYANTHI 2899 §103§112 Final Rejection — Pending Dec 15, 2022
18065657 TRANSISTOR GATE-CHANNEL ARRANGEMENTS WITH MULTIPLE DIPOLE MATERIALS Intel Corporation ROLAND, CHRISTOPHER M 2893 §103 Final Rejection — Pending Dec 14, 2022
18064362 MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW Intel Corporation WALL, VINCENT 2898 §103§112 Final Rejection — AI Ready Dec 12, 2022
18050944 DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING ACTIVATION COMPRESSION Intel Corporation BOSTWICK, SIDNEY VINCENT 2124 §103 Non-Final OA 34d Pending Oct 28, 2022
17972923 COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE Intel Corporation MCDONALD, JASON ANDREW 2898 §103 Final Rejection 57d AI Ready Oct 25, 2022
17972975 INTEGRATED INDUCTOR OVER TRANSISTOR LAYER Intel Corporation MCDONALD, JASON ANDREW 2898 §103 Final Rejection — Pending Oct 25, 2022
18047415 DEEP NEURAL NETWORK (DNN) ACCELERATOR FACILITATING QUANTIZED INFERENCE Intel Corporation SANKS, SCHYLER S 2129 §103 Non-Final OA — AI Ready Oct 18, 2022
18047033 PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS Intel Corporation SRINIVASAN, SESHA SAIRAMAN 2812 §103 Non-Final OA — Pending Oct 17, 2022
17938784 PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS Intel Corporation RAMOS-DIAZ, FERNANDO JOSE 2814 §102§103 Final Rejection — AI Ready Oct 07, 2022
17935627 INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS Intel Corporation MCCOY, THOMAS WILSON 2814 §103§112 Final Rejection 13d AI Ready Sep 27, 2022
17953511 OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS Intel Corporation CHEN, YU 2896 §102§103§112 Final Rejection 4d overdue AI Ready Sep 27, 2022
17935647 INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM Intel Corporation HATFIELD, MARSHALL MU-NUO 2897 §103 Non-Final OA — AI Ready Sep 27, 2022
17934721 MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT Intel Corporation PIZARRO CRESPO, MARCOS D 2814 §103 Non-Final OA — Pending Sep 23, 2022
17932624 MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES Intel Corporation IQBAL, HAMNA FATHIMA 2817 §102§103 Non-Final OA — AI Ready Sep 15, 2022
17930801 FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS Intel Corporation LEE, ALVIN LYNGHI 2813 §103 Final Rejection 10d overdue AI Ready Sep 09, 2022
17929749 NEURAL NETWORK FACILITATING FIXED-POINT EMULATION OF FLOATING-POINT COMPUTATION Intel Corporation BUI, KENNY KIM 2182 §101§103§112 Final Rejection 28d AI Ready Sep 05, 2022
17823602 THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES Intel Corporation LIU, BENJAMIN T 2893 §103 Non-Final OA — AI Ready Aug 31, 2022
17821009 QUASI-MONOLITHIC DIE ARCHITECTURES Intel Corporation RODRIGUEZ VILLANU, SANDRA MILENA 2898 §103 Non-Final OA 61d Pending Aug 19, 2022
17820593 NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS Intel Corporation SPRAUL III, VINCENT ANTON 2129 §101§103 Non-Final OA 19d overdue AI Ready Aug 18, 2022
17848660 VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT Intel Corporation WARD, DAVID WILLIAM 2891 §103 Final Rejection — AI Ready Jun 24, 2022
17846303 SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES Intel Corporation JUNG, MICHAEL YOO LIM 2817 §102§103 Final Rejection — Pending Jun 22, 2022
17829706 INTEGRATED CIRCUIT DEVICES WITH TRANSISTORS HAVING ANGLED GATES Intel Corporation GREWAL, HEIM KIRIN 2812 §103 Final Rejection — Pending Jun 01, 2022
17702593 TRANSISTOR GATE STACKS WITH THICK HYSTERETIC ELEMENTS Intel Corporation RAHIM, NILUFA 2893 §103§112 Final Rejection — Pending Mar 23, 2022
17698430 MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 §103 Final Rejection 4d overdue AI Ready Mar 18, 2022
17678928 SHARED CONTACT DEVICES WITH CONTACTS EXTENDING INTO A CHANNEL LAYER Intel Corporation CRAMER, HALEE PAIGE 2891 §102§103 Final Rejection 75d AI Ready Feb 23, 2022
17555401 MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER Intel Corporation IQBAL, HAMNA FATHIMA 2817 §103 Final Rejection 1d overdue AI Ready Dec 18, 2021
17552581 MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 §102§103 Non-Final OA 29d AI Ready Dec 16, 2021
17550236 MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS Intel Corporation BULLARD-CONNOR, GENEVIEVE GRACE 2899 §103 Non-Final OA — Pending Dec 14, 2021
17550520 OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD Intel Corporation THOMASON, DARBY MARGARET 2874 §102§103 Non-Final OA — Pending Dec 14, 2021
17544506 SYSTEM AND METHOD OF USING NEUROEVOLUTION-ENHANCED MULTI-OBJECTIVE OPTIMIZATION FOR MIXED-PRECISION QUANTIZATION OF DEEP NEURAL NETWORKS Intel Corporation PHUNG, QUOC LY PHU 2156 §101§103 Non-Final OA — Pending Dec 07, 2021
17544598 SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS Intel Corporation MARU, MATIYAS T 2148 §101§103 Non-Final OA 25d overdue Pending Dec 07, 2021
17530156 RUNTIME CONFIGURABLE REGISTER FILES FOR ARTIFICIAL INTELLIGENCE WORKLOADS Intel Corporation HUISMAN, DAVID J 2183 §102§103§112 Non-Final OA — Pending Nov 18, 2021
17518376 SOUND MODIFICATION OF SPEECH IN AUDIO SIGNALS OVER MACHINE COMMUNICATION CHANNELS Intel Corporation ZEVITZ, DANIELLE ELIZABETH 2655 §103 Non-Final OA — Pending Nov 03, 2021
17482681 MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES Intel Corporation TIVARUS, CRISTIAN ALEXANDRU 2899 §103§112 Final Rejection 7d AI Ready Sep 23, 2021
17473414 PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE Intel Corporation NGUYEN, DUY T V 2818 §103 Final Rejection 29d AI Ready Sep 13, 2021
17372612 MEMORY CELLS WITH NON-PLANAR FERROELECTRIC OR ANTIFERROELECTRIC MATERIALS Intel Corporation JONES, ERIC W 2892 §103 Final Rejection — Pending Jul 12, 2021
17345969 SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES Intel Corporation PURVIS, SUE A 2800 §102§103 Final Rejection — Pending Jun 11, 2021

Data sourced from USPTO Patent File Wrapper (daily) and Office Action Archive (weekly). Analysis generated by IP Author.

Data: USPTO Patent File Wrapper (daily) • Office Action Archive (weekly) • 89M+ prosecution events

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