Tech Center 2800 • Art Units: 1745 2815
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18095576 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18352572 | GROUP III NITRIDE-BASED SEMICONDUCTOR DEVICE | Final Rejection | Infineon Technologies AG |
| 17740363 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18459012 | Via To Avoid Local Interconnect Shorting | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18333819 | INVERTED GATE CUT REGION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18332785 | SELF ALIGNED BACKSIDE CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17845402 | GATE-ALL-AROUND DEVICES HAVING DIFFERENT SPACER THICKNESSES | Final Rejection | International Business Machines Corporation |
| 18468498 | ANTI-DOPED MOS DEVICE AND VOLTAGE REFERENCE CIRCUIT INCLUDING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18172703 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18164845 | MAGNETIC TUNNEL JUNCTION (MTJ) HAVING A DIFFUSION BLOCKING SPACER LAYER | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17957225 | INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS | Non-Final OA | Intel Corporation |
| 17955513 | INTEGRATED CIRCUIT STRUCTURES WITH UNIFORM EPITAXIAL SOURCE OR DRAIN CUT | Final Rejection | Intel Corporation |
| 18503560 | LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE | Non-Final OA | Micron Technology, Inc. |
| 17901312 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18468650 | CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF | Non-Final OA | NICHIA CORPORATION |
| 17990450 | LIGHT-EMITTING DIODE (LED) PACKAGE WITH REFLECTIVE COATING AND METHOD OF MANUFACTURE | Non-Final OA | LUMILEDS LLC |
| 18308355 | Transistor Gate Contacts and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co,. Ltd. |
| 18269646 | METHOD FOR PRODUCING AN EPITAXIAL WAFER | Final Rejection | SHIN-ETSU HANDOTAI CO., LTD. |
| 17599745 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 17767257 | SAFETY CIRCUITS FOR IMAGING WITH SENSOR INTEGRATED DRESSINGS AND SYSTEMS | Final Rejection | T.J.Smith and Nephew,Limited |
| 18396088 | DISPLAY PANELS AND MANUFACTURING METHODS THEREOF | Non-Final OA | GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18240041 | NON-VOLATILE MEMORY DEVICE | Non-Final OA | SAMSUNG ELECRTONICS CO., LTD. |
| 17212362 | LIGHT SENSING DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF | Final Rejection | SENSORTEK TECHNOLOGY CORP. |
| 17437426 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD. |
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