Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 1745 2815 4100
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18626935 | INTEGRATED CIRCUITS INCLUDING BACKSIDE WIRING | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18592999 | INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THICK SOURCE/DRAIN ISOLATION LAYER AND METHODS OF FORMING TING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18441700 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18718507 | IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18468650 | CERAMIC SINTERED BODY SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF | Final Rejection | NICHIA CORPORATION |
| 18405484 | Semiconductor Device and Method of Stacking and Interconnecting Semiconductor Assemblies Using Conductive Layer with Graphene Core Shells | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18520977 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17997519 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS COMPRISING SAME | Final Rejection | Samsung Display Co., LTD. |
| 17856877 | BACKSIDE REVEAL FOR LAYERED MULTI-CAPACITOR SINGLE TRANSISTOR MEMORY SYSTEMS | Final Rejection | Intel Corporation |
| 18530905 | SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE | Final Rejection | Micron Technology, Inc. |
| 18537098 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18398213 | CONSUMABLE MEMBER, PLASMA PROCESSING APPARATUS, AND METHOD OF MANUFACTURING CONSUMABLE MEMBER | Final Rejection | Tokyo Electron Limited |
| 18332785 | SELF ALIGNED BACKSIDE CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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