Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2815 2817 2895 4100
This examiner grants 92% of resolved cases
Mikka H Liu examines cases in Tech Center 4100 and Art Unit 2815. With 613 resolved cases, the allowance rate is exceptionally high at 92.2 percent. The median days to allowance is 798, indicating that the prosecution process is both successful and efficient. This combination of metrics suggests a very favorable environment for applicants seeking patent protection within this specific art unit.
The interview lift is 3.8 percent. Although the 92.2 percent baseline leaves little room for statistical improvement, the positive lift indicates that interviews are a safe and potentially helpful way to move a case toward allowance. Practitioners can use interviews to clarify minor technical points or claim language, ensuring that the 798-day prosecution timeline remains efficient and leads to a successful grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18733327 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18659802 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18703291 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18025066 | DISPLAY PANEL HAVING OPTICAL ADJUSTMENT PATTERN OVERLAPPING LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18774931 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17978330 | LIGHT EMITTING DEVICE, OPTICAL DISTANCE-MEASURING DEVICE, AND IMAGE FORMING APPARATUS | Non-Final OA | FUJIFILM Business Innovation Corp. |
| 18677960 | MICROMECHANICAL COMPONENT WITH EXTERNAL CONTACTING | Non-Final OA | Robert Bosch GmbH |
| 18741784 | ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 18203868 | COVER STRUCTURE FOR BEAMSHAPING FOR LIGHT EMITTING DIODE PACKAGES | Non-Final OA | CreeLED, Inc. |
| 18469924 | HIGH DENSITY METAL-OXIDE-SEMICONDUCTOR (MOS) CAPACITOR (MOSCAP) AND METAL-OXIDE-METAL (MOM) CAPACITOR (MOMCAP) STACKING LAYOUT | Non-Final OA | QUALCOMM Incorporated |
| 18214244 | INTEGRATED CAPACITOR | Non-Final OA | Intel Corporation |
| 18212824 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH | Non-Final OA | Intel Corporation |
| 18338395 | INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES | Non-Final OA | Intel Corporation |
| 18750384 | Electronic Device, Light-Emitting Device, Electronic Appliance, and Lighting Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18404866 | AREA EFFECTIVE HEAT SINK | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18470354 | STRAIN INDUCING TRENCHES FOR SOURCE/DRAIN REGIONS | Final Rejection | International Business Machines Corporation |
| 18732634 | SEMICONDUCTOR DEVICE INCLUDING CRYSTALLINE OXIDE SEMICONDUCTOR AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18521549 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 18610219 | SEMICONDUCTOR DEVICES IN INTEGRATED CIRCUIT HAVING DIFFERENT THRESHOLD VOLTAGES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18443166 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND ASSOCIATED METHODS | Non-Final OA | Micron Technology, Inc. |
| 18776288 | METHOD OF MANUFACTURING AN OPTICAL SENSOR | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18333977 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE | Non-Final OA | ROHM Co., LTD. |
| 18475370 | Semiconductor Die Bonding | Final Rejection | Wolfspeed, Inc. |
| 18443283 | ARTIFICIAL SYNAPSE DEVICE BASED ON RESISTIVE CHANGE MEMORY DEVICE, AND METHOD FOR MANUFACTURING SAME | Non-Final OA | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
| 18635567 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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