Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2892 2897 2898
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18659483 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18642633 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18588462 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18488229 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18424126 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18112728 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Non-Final OA | Intel Corporation |
| 17684841 | CONTACT STRUCTURES FOR DIRECT BONDING | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18488278 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18629474 | FRONTSIDE AND BACKSIDE BIT LINES IN A MEMORY ARRAY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18365667 | METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18645867 | HYBRID COMBINATION OF THERMAL INTERFACE MATERIALS TO MITIGATE THERMAL GREASE PUMP-OUT | Non-Final OA | DELL PRODUCTS L.P. |
| 18186236 | BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT | Non-Final OA | International Business Machines Corporation |
| 18488026 | PACKAGE STRUCTURE | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
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