Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2892 2897 2898
This examiner grants 100% of resolved cases
Gabriel Sebastian Minney is an examiner in Tech Center 2800 and Art Unit 2800. His current record includes 1 resolved case. This resolution resulted in an allowance, which is reflected in his 100.0 percent allowance rate. This baseline is highly favorable but is based on a very limited volume of data.
The interview lift for Minney is 0.0 percent. Because his allowance rate is already 100.0 percent for the 1 resolved case on record, the data does not show any additional statistical benefit from conducting interviews. This 0.0 percent figure may change as more applications are processed in Art Unit 2800.
The median days to allowance for this examiner is 908. This duration represents the time taken to reach a grant for the 1 resolved case in his portfolio. This 908 day figure serves as the current indicator of the expected pendency for applications assigned to him in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18659483 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18588462 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18634761 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18616610 | DISPLAY PANEL, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18424126 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18487985 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18824581 | DISPLAY DEVICE | Non-Final OA | Panasonic Automotive Systems Co., Ltd. |
| 18393403 | DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 18323521 | SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE | Non-Final OA | Intel Corporation |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Non-Final OA | Intel Corporation |
| 17684841 | CONTACT STRUCTURES FOR DIRECT BONDING | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18633399 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18710320 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18186236 | BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT | Non-Final OA | International Business Machines Corporation |
| 18488084 | PACKAGE FOR A LATERAL POWER TRANSISTOR | Final Rejection | Infineon Technologies Austria AG |
| 18488036 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18488278 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18630911 | ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES AND HAVING IRREGULAR SURFACE TOPOGRAPHY, AND RELATED METHODS AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18658786 | DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18629474 | FRONTSIDE AND BACKSIDE BIT LINES IN A MEMORY ARRAY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18488028 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18609650 | METHODS OF REDUCING BACKSIDE CONTACT RESISTANCE | Non-Final OA | Applied Materials, Inc. |
| 18488026 | PACKAGE STRUCTURE | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18629953 | DISPLAY PANEL | Non-Final OA | HannStar Display Corporation |
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