Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2826 2893
This examiner grants 86% of resolved cases
Eduardo A. Rodela works in Tech Center 2800 and Art Unit 2826. He has handled 1080 resolved cases. The allowance rate for this examiner is 86.3 percent. This 86.3 percent rate is based on the 1080 resolved cases.
The interview lift is 5.7 percent. This 5.7 percent lift measures the increase in the allowance rate for cases with an interview compared to cases without an interview. The median days to allowance is 813. This 813 day figure is the median time from filing to allowance. The 5.7 percent interview lift suggests that interviews correlate with a higher probability of grant. Practitioners should consider the 86.3 percent allowance rate when assessing their chances. The 813 days to allowance provides a timeline for the prosecution process. The 5.7 percent lift indicates that an interview is a tactic for securing an allowance. The 1080 resolved cases provide the foundation for these statistics.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18658593 | SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18643761 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18618477 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18336497 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18585834 | Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated Circuit | Non-Final OA | Apple Inc. |
| 18571105 | Displays that Overlap Light Sensors | Non-Final OA | Apple Inc. |
| 18746010 | DISPLAY PANEL, AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18763630 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18611385 | INTEGRATED DEVICE COMPRISING METALLIZATION PORTION WITH STEP PAD INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18609314 | INTEGRATED CIRCUITS (ICs) HAVING SEPARATE SIGNAL AND POWER DISTRIBUTION NETWORK (PDN) INTERCONNECT STRUCTURES FOR REDUCED POWER SIGNAL ROUTING CONGESTION AND PATH LENGTHS, AND RELATED THREE-DIMENSIONAL (3D) ICs (3DICs) AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18586351 | CIRCUIT AND SYSTEM INTEGRATION ONTO A MICRO-DEVICE SUBSTRATE | Final Rejection | VueReal Inc. |
| 18652772 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18605724 | PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18404187 | SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL GATE VIA AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18674634 | LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18501062 | PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE WITH A RECESSED PORTION AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18605344 | METHOD AND APPARATUS FOR ELECTRICAL BOND PROTECTION | Non-Final OA | Lumileds LLC |
| 18621622 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18585828 | LIGHT EMITTING MODULE AND SYSTEM INCLUDING THE SAME | Final Rejection | SEOUL VIOSYS CO., LTD. |
| 18662717 | PLANAR COMPLEMENTARY MOSFET STRUCTURE TO REDUCE LEAKAGES AND PLANAR AREAS | Non-Final OA | INVENTION AND COLLABORATION LABORATORY, INC. |
| 18422360 | PLANAR COMPLEMENTARY MOSFET STRUCTURE TO REDUCE LEAKAGES AND PLANAR AREAS | Non-Final OA | Invention And Collaboration Laboratory, Inc. |
| 18504911 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 18203688 | PLANAR COMPLEMENTARY MOSFET STRUCTURE TO REDUCE LEAKAGES AND PLANAR AREAS | Final Rejection | Invention And Collaboration Laboratory Pte. Ltd. |
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