Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2898
This examiner grants 53% of resolved cases
Christopher A. Schodde is an examiner in Tech Center 2800 and Art Unit 2822. He has 93 resolved cases. The allowance rate for these cases is 52.7 percent. This 52.7 percent rate indicates the proportion of applications that result in a patent grant. Practitioners can use this 93-case history to understand the examiner's general tendencies in Art Unit 2822.
The interview lift is 33.9 percent. This 33.9 percent figure represents the difference in allowance probability when an interview is conducted. A positive value like 33.9 percent indicates that interviews are associated with a higher likelihood of allowance. This suggests that requesting an interview is an effective strategy for this docket.
The median days to allowance is 1263. This 1263-day duration is the middle value for the time from filing to grant. For applicants, this 1263-day median is a key metric for planning the prosecution timeline. By combining the 52.7 percent allowance rate with the 1263-day median, practitioners can develop a data-grounded strategy for their applications.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17956956 | ELECTROLUMINESCENT DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17770045 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18312192 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18309873 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18589630 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 17468609 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18556293 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| 18556270 | INTEGRATING COLOR CONVERSION MATERIAL IN A MICRODEVICE | Final Rejection | VueReal Inc. |
| 18062446 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18191250 | DONOR SUBSTRATE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Postech Research and Business Development Foundation |
| 18766268 | AUXILIARY ELECTRODE STRUCTURE COVERING AN OUTER PERIPHERAL END SURFACE OF A LOWER ELECTRODE | Non-Final OA | Sharp Display Technology Corporation |
| 17875933 | SENSOR CHIP WITH A PLURALITY OF INTEGRATED SENSOR CIRCUITS | Non-Final OA | Infineon Technologies AG |
| 18625666 | MEMORY INCLUDING BIT LINE PILLAR | Final Rejection | SK hynix Inc. |
| 18490976 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 17883919 | FINFETS WITH REDUCED PARASITICS | Final Rejection | Micron Technology, Inc. |
| 17741200 | WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INTO MOLD | Non-Final OA | Micron Technology, Inc. |
| 17812700 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17340069 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17663683 | Semiconductor Package and Method | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17562794 | SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18786520 | METAL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18422787 | NITRIDE SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18740556 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18231806 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17967933 | RADIO FREQUENCY DEVICES, SILICON CARBIDE HOMOEPITAXIAL SUBSTRATES AND MANUFACTURING METHODS THEREOF | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
| 18242758 | SEMICONDUCTOR DEVICE | Final Rejection | EPISTAR CORPORATION |
| 17875395 | TRANSISTOR STRUCTURE | Non-Final OA | Invention And Collaboration Laboratory Pte. Ltd. |
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