Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2898
This examiner grants 52% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18441327 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17956956 | ELECTROLUMINESCENT DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17718795 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17549323 | WHITE LIGHT EMITTING DEVICE AND LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 17468609 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18659484 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18312192 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18309873 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 17571322 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18528261 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18191250 | DONOR SUBSTRATE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Postech Research and Business Development Foundation |
| 18623267 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18062446 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18625666 | MEMORY INCLUDING BIT LINE PILLAR | Non-Final OA | SK hynix Inc. |
| 18490976 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 17669143 | SINGULATING SEMICONDUCTOR WAFERS | Non-Final OA | Texas Instruments Incorporated |
| 17741200 | WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INTO MOLD | Non-Final OA | Micron Technology, Inc. |
| 17812700 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17460742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17663683 | Semiconductor Package and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17562794 | SEMICONDUCTOR DEVICE WITH WRAP AROUND SILICIDE LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17875933 | SENSOR CHIP WITH A PLURALITY OF INTEGRATED SENSOR CIRCUITS | Non-Final OA | Infineon Technologies AG |
| 18740556 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18231806 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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