Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2892
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18767607 | IMAGE SENSOR INCLUDING GRID STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18624828 | SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18610338 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO, ltd. |
| 18591298 | DISPLAY DEVICE AND TILED DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18767579 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18774285 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18784252 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | Fujitsu Limited |
| 18498679 | ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18774763 | LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18602313 | Memory Circuitry And Methods Used In Forming Memory Circuitry | Non-Final OA | Micron Technology, Inc. |
| 18788322 | CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18432386 | CHIP PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18788363 | DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18777194 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18480273 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18733292 | WAFER WITH MICRO INTEGRATED CIRCUITS | Non-Final OA | Lextar Electronics Corporation |
| 18624522 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SCHOTTKY BARRIER SOURCE CONTACTS AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18581575 | PROCESSING METHOD OF WAFER | Final Rejection | DISCO CORPORATION |
| 18500642 | MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE WITH IN-PLANE MAGNETIC LAYER | Non-Final OA | IMEC VZW |
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