Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2892
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18414959 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18206139 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18559409 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18774285 | METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18430903 | CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18533315 | INTEGRATED DEVICE, SEMICONDUCTOR DEVICE, AND INTEGRATED DEVICE MANUFACTURING METHOD | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18591298 | DISPLAY DEVICE AND TILED DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18413983 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18518860 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18400672 | III-N SEMICONDUCTOR DEVICE WITH SUBSTRATE CONTACT | Non-Final OA | Texas Instruments Incorporated |
| 18498679 | ELECTROSTATIC DISCHARGE DEVICES WITH METALLIZED DIES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18602313 | Memory Circuitry And Methods Used In Forming Memory Circuitry | Non-Final OA | Micron Technology, Inc. |
| 18432386 | CHIP PACKAGE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18398882 | SEMICONDUCTOR MEMORY CELL STRUCTURE INCLUDING A VERTICAL CHANNEL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18398203 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18361575 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRANSISTOR CONTROL CIRCUIT AND METHOD OF MAKING THEREOF | Final Rejection | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18222632 | TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS | Final Rejection | Sandisk Technologies, Inc. |
| 18349578 | STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FORMING REPLACEMENT WORD LINES THROUGH MEMORY OPENINGS | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18361349 | INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS | Final Rejection | International Business Machines Corporation |
| 18544194 | NANOSHEET DEVICES WITH REDUCED WIDTH INNER SPACER AND METHOD | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18480218 | PRESSURE VALVE FOR MICROELECTROMECHANICAL SYSTEM DIE | Non-Final OA | Knowles Electronics, LLC |
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