Tech Center 2800 • Art Units: 2811
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18206139 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18197768 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17822246 | INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18529058 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18186079 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | LG DISPLAY CO., LTD. |
| 18526869 | PIXEL CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18361349 | INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS | Non-Final OA | International Business Machines Corporation |
| 18190085 | SELF-ALIGNED LITHO-ETCH-LITHO-ETCH MANDREL CUT PROCESS FOR ADVANCED FINFET INTERCONNECT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17969773 | SELF-ALIGNED ZERO TRACK SKIP | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18480225 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18480068 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18480473 | SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18231938 | INTEGRATED CIRCUIT WITH STACKED TRANSISTORS HAVING INDUCTORS AT BOTH SIDES OF SUBSTRATE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18350521 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18361575 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRANSISTOR CONTROL CIRCUIT AND METHOD OF MAKING THEREOF | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17894380 | DOUBLE-DECKED INTERCONNECT FEATURES | Non-Final OA | Intel Corporation |
| 17681305 | TAPERED INTERCONNECT WIRES | Final Rejection | Intel Corporation |
| 18496899 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18488710 | SEMICONDUCTOR MODULE | Non-Final OA | Robert Bosch GmbH |
| 18488325 | FIELD-EFFECT TRANSISTOR, AND METHODS FOR PRODUCTION | Non-Final OA | Robert Bosch GmbH |
| 18480273 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18222632 | TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS | Non-Final OA | Sandisk Technologies, Inc. |
| 18338900 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18226321 | Semiconductor Device and Method of Manufacturing the Same | Non-Final OA | Infineon Technologies Austria AG |
| 18362743 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SOURCE STRUCTURE SURROUNDED BY INNER SIDEWALLS OF VERTICAL SEMICONDUCTOR CHANNELS AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18221711 | THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18321088 | BACK-END-OF-LINE CMOS INVERTER WITH VERTICAL CHANNELS AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18480218 | PRESSURE VALVE FOR MICROELECTROMECHANICAL SYSTEM DIE | Non-Final OA | Knowles Electronics, LLC |
| 18576339 | METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY | Non-Final OA | ams-OSRAM International GmbH |
| 18500642 | MAGNETORESISTIVE RANDOM ACCESS MEMORY DEVICE WITH IN-PLANE MAGNETIC LAYER | Non-Final OA | IMEC VZW |
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