Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2823
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18777722 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18437236 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18683690 | DISPLAYING BASE BOARD AND DISPLAYING DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18291047 | DISPLAY DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18472074 | TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL | Non-Final OA | QUALCOMM Incorporated |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Final Rejection | Intel Corporation |
| 17856969 | SUBSTRATES WITH NITRIDED GLASS CORES | Non-Final OA | Intel Corporation |
| 17710802 | DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 17833749 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18753130 | Metal Gates and Methods of Forming Thereby | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18545601 | HYBRID THERMAL INTERFACE MATERIAL WITH EMBEDDED METAL LAYER | Non-Final OA | Sandisk Technologies, Inc. |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 18501960 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | Non-Final OA | NATIONAL TAIWAN UNIVERSITY |
| 18405172 | SEMICONDUCTOR PACKAGE STRUCTURE | Final Rejection | MediaTek Singapore Pte. Ltd. |
| 18080688 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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