Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2823
This examiner grants 84% of resolved cases
Christine A. Enad has a high volume of 1361 resolved cases in Tech Center 2800 and Art Unit 2811. Her allowance rate is 84.4 percent, which indicates a high frequency of successful outcomes for applicants. The median time to allowance is 727 days, suggesting efficient processing of applications. This 727 days figure is relatively low, pointing to a faster path to grant than many other examiners.
The interview lift for this examiner is 10.3 percent. While the baseline allowance rate is already high at 84.4 percent, the data indicates that conducting an interview still provides a measurable benefit. This 10.3 percent lift can be a useful tool for finalizing the few cases that do not immediately reach allowance. With 1361 resolved cases, the 84.4 percent allowance rate is a robust indicator of the examiner's tendency to grant patents, and the 10.3 percent lift offers a clear strategy for further improving those odds. The 727 days median pendency is a positive factor for applicants.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18777722 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18437236 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18683690 | DISPLAYING BASE BOARD AND DISPLAYING DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18888991 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18663651 | LIGHT-EMITTING DEVICE, PLANAR LIGHT SOURCE, AND LIQUID CRYSTAL DISPLAY DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18813003 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18644445 | SENSING DEVICE | Non-Final OA | InnoLux Corporation |
| 18651878 | SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING SYSTEM | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18472074 | TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL | Non-Final OA | QUALCOMM Incorporated |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Final Rejection | Intel Corporation |
| 18700432 | VIAS INCLUDING A POROUS ELECTRICALLY CONDUCTIVE MATERIAL AND METHODS FOR FABRICATING THE VIAS | Non-Final OA | CORNING INCORPORATED |
| 18529029 | STACKED TRANSISTORS HAVING DUAL WORK FUNCTION GATES | Non-Final OA | International Business Machines Corporation |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 18589527 | DAMAGE PREVENTION DURING WAFER EDGE TRIMMING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18227731 | CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18348064 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18457368 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Final Rejection | ROHM CO., LTD. |
| 18584075 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18255516 | METALLIZATION OF SEMICONDUCTOR WAFER | Non-Final OA | Heraeus Deutschland GmbH & Co. KG |
| 18545601 | HYBRID THERMAL INTERFACE MATERIAL WITH EMBEDDED METAL LAYER | Final Rejection | Sandisk Technologies, Inc. |
| 18405172 | SEMICONDUCTOR PACKAGE STRUCTURE | Final Rejection | MediaTek Singapore Pte. Ltd. |
| 18080688 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18650805 | SEMICONDUCTOR DEVICE WITH DECREASED SOURCE AND DRAIN RESISTANCE AND MANUFACTURING METHOD | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy