Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2823
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18566682 | DISPLAY APPARATUS, DISPLAY MODULE, ELECTRONIC DEVICE, AND FABRICATION METHOD OF DISPLAY APPARATUS | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18471645 | SPACER TO AVOID SOURCE AND DRAIN SHORTING | Non-Final OA | International Business Machines Corporation |
| 18458426 | WRAP-AROUND MIDDLE-OF-LINE CONTACT WITH BACKSIDE SOURCE/DRAIN CUT FOR DIRECT CONTACT AND BACKSIDE POWER DELIVERY NETWORK | Non-Final OA | International Business Machines Corporation |
| 17950293 | BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION | Final Rejection | International Business Machines Corporation |
| 17946821 | SELF-ALIGNED BACKSIDE CONTACT | Non-Final OA | International Business Machines Corporation |
| 17936952 | FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE | Non-Final OA | Intel Corporation |
| 17957106 | ETCH STOP LAYER FOR METAL GATE CUT | Final Rejection | Intel Corporation |
| 17954194 | INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS | Final Rejection | Intel Corporation |
| 17951532 | MULTI-STAGE MASK ETCH PROCESS | Non-Final OA | Intel Corporation |
| 17710802 | DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY | Final Rejection | Intel Corporation |
| 18474250 | SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING | Final Rejection | ETRON TECHNOLOGY, INC. |
| 17833749 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18393050 | MATERIAL STACK FOR MICROELECTRONIC DEVICE, A MICROELECTRONIC DEVICE THAT INTEGRATES SUCH STACK AND METHOD FOR MANUFACTURING SUCH STACK | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18367129 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18464839 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18460578 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18348851 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METHOD FOR FORMING SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18348780 | MULTI-GATE DEVICE AND RELATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18338161 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18099245 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18153553 | BARRIER LAYER FOR WEAKENED BOUNDARY EFFECT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17897151 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18623909 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18471296 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18526498 | THROUGH VIAS AND GUARD RINGS OF SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18471739 | Integrated Circuit Packages and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18355258 | CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18150642 | Gate Isolation Regions and Fin Isolation Regions and Method Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17896970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17847679 | PROCESS FOR MANUFACTURING A VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE AND VERTICAL CONDUCTION SILICON CARBIDE ELECTRONIC DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy