Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2817 4100
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18472930 | SENSOR-EMBEDDED DISPLAY PANEL AND SENSOR AND ELECTRONIC DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18455854 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18204970 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18205312 | DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18133105 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18693340 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING DISPLAY SUBSTRATE, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17636147 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18189860 | LIGHT-EMITTING DEVICE | Final Rejection | NICHIA CORPORATION |
| 18775359 | DISPLAY DEVICE AND REPAIR METHOD | Non-Final OA | ALPS ALPINE CO., LTD. |
| 18217103 | DISPLAY PANEL, DISPLAY DEVICE, AND PREPARATION METHOD OF DISPLAY PANEL | Final Rejection | Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. |
| 18342567 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18197653 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17859671 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18546715 | TRANSFER OF MICRO DEVICES | Non-Final OA | VueReal Inc. |
| 17932624 | MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES | Non-Final OA | Intel Corporation |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | Final Rejection | Intel Corporation |
| 17857872 | LEAD FRAME AND ELECTRONIC COMPONENT | Non-Final OA | TDK CORPORATION |
| 18327036 | WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18670938 | LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STRUCTURE AND SEMICONDUCTOR DEVICE THEREOF | Non-Final OA | REALTEK SEMICONDUCTOR CORP. |
| 17888324 | SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18679788 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18215351 | INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A CONDUCTIVE ROUTING REGION | Final Rejection | Microchip Technology Incorporated |
| 18207917 | TILEABLE MICROLED DISPLAY | Final Rejection | Lumileds LLC |
| 18206309 | LED ARRAY BETWEEN FLEXIBLE AND RIGID SUBSTRATES | Non-Final OA | Lumileds LLC |
| 18671584 | HEMT DEVICE HAVING AN IMPROVED CONDUCTIVITY AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMicroelectronics International N.V. |
| 17856194 | METHOD OF FABRICATING BIT LINE CONTACTS | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17873189 | TESTKEY STRUCTURE AND MONITORING METHOD WITH TESTKEY STRUCTURE | Final Rejection | United Semiconductor (Xiamen) Co., Ltd. |
| 18754435 | PLANARIZATION OF ROUGH SURFACES | Non-Final OA | Colorado School of Mines |
| 18098806 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18161088 | SEMICONDUCTOR STRUCTURE, FORMING METHOD OF SAME AND MEMORY | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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