Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2817 4100
This examiner grants 83% of resolved cases
Hamna Fathima Iqbal works within Tech Center 4100 and Art Unit 2817. With only 18 resolved cases, the data set for this examiner is relatively small compared to others in the tech center. Despite the limited volume of 18 cases, the current allowance rate is 83.3 percent, which is notably high and suggests a favorable environment for applicants at this stage of her career.
The interview lift is recorded at 20.0 percent. This 20.0 percent increase in the probability of allowance following an interview indicates that direct communication is a beneficial tool for resolving outstanding issues. Even with a high base allowance rate of 83.3 percent, an interview can further solidify the path to a grant by providing a forum for technical discussion.
The median days to allowance is 1224. This 1224 day timeline suggests that even with a high grant rate, the process takes a significant amount of time to reach a final resolution. Applicants should prepare for a pendency of 1224 days when navigating prosecution in this docket, factoring this duration into their overall patent strategy.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18593051 | INTEGRATED CIRCUIT DEVICE INCLUDING WIMPY TRANSISTOR STACK WITH THICK INTERGATE INSULATOR AND METHODS OF FORMING TING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18459520 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18455854 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18204970 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18205312 | DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18133105 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18118775 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17871127 | QUANTUM DOT, QUANTUM DOT COMPOSITE, DISPLAY PANEL, AND ELECTRONIC DEVICE INCLUDING SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18626640 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18223050 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18342567 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18197653 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17883015 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 17859671 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18775359 | DISPLAY DEVICE AND REPAIR METHOD | Non-Final OA | ALPS ALPINE CO., LTD. |
| 18189860 | LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18446656 | MOUNTING STRUCTURES FOR EDGE-EMITTING SEMICONDUCTOR DEVICES | Non-Final OA | CreeLED, Inc. |
| 18546715 | TRANSFER OF MICRO DEVICES | Non-Final OA | VueReal Inc. |
| 17932624 | MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES | Non-Final OA | Intel Corporation |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | Final Rejection | Intel Corporation |
| 18327036 | WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18671584 | HEMT DEVICE HAVING AN IMPROVED CONDUCTIVITY AND MANUFACTURING PROCESS THEREOF | Non-Final OA | STMicroelectronics International N.V. |
| 18004860 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 19049232 | METHOD OF PROCESSING A SUBSTRATE AND METHOD OF FABRICATING BIT LINE CONTACTS OVER THE SUBSTRATE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18215351 | INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A CONDUCTIVE ROUTING REGION | Final Rejection | Microchip Technology Incorporated |
| 18202356 | ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE ORIENTATIONS | Final Rejection | Microchip Technology Incorporated |
| 18207917 | TILEABLE MICROLED DISPLAY | Final Rejection | Lumileds LLC |
| 18206309 | LED ARRAY BETWEEN FLEXIBLE AND RIGID SUBSTRATES | Non-Final OA | Lumileds LLC |
| 17970487 | MICRO LIGHT-EMITTING DIODE PACKAGE STRUCTURE | Non-Final OA | Lextar Electronics Corporation |
| 17873189 | TESTKEY STRUCTURE AND MONITORING METHOD WITH TESTKEY STRUCTURE | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
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